公开(公告)号：US09093619B2

公开(公告)日：2015-07-28

申请号：US14465315

申请日：2014-08-21

Applicant: NICHIA CORPORATION

Inventor： Tomohide Miki ,  Kenji Takine ,  Ryohei Yamashita

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/50 ,  H01L33/54 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/507 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The light emitting device comprises a substrate (2), a positive electrode (6) and a negative electrode (4) formed on the substrate (2), a light emitting diode (8) connected to the positive electrode (6) and the negative electrode (4), the transparent resin (12 and 14) that covers the light emitting diode (8), a fluorescent material (16) that absorbs at least part of light emitted by the light emitting diode (8) and converts it to light of longer wavelength, and the lens that changes the direction of light emission from the light emitting diode (8) and/or the fluorescent material (16). The resin (12 and 14) includes the fluorescent material (16) and is formed so as to constitute the lens of substantially semi-cylindrical shape, and the fluorescent material (16) included in the resin (12 and 14) is distributed with a higher concentration in a region near the surface of the light emitting diode (8) than in a region near the surface of the portion that constitutes the lens.

Abstract translation: 发光装置包括：基板（2），形成在基板（2）上的正极（6）和负极（4）;与正极（6）连接的发光二极管（8） 电极（4），覆盖发光二极管（8）的透明树脂（12和14），吸收由发光二极管（8）发射的光的至少一部分并将其转换为光的荧光材料（16） 以及改变来自发光二极管（8）和/或荧光材料（16）的发光方向的透镜。 树脂（12和14）包括荧光材料（16）并且形成为构成大致半圆柱形状的透镜，并且包含在树脂（12和14）中的荧光材料（16）分布在 在发光二极管（8）的表面附近的区域中比在构成透镜的部分的表面附近的区域更高的浓度。

公开(公告)号：US20140084320A1

公开(公告)日：2014-03-27

申请号：US13969182

申请日：2013-08-16

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki Hayashi ,  Shimpei Sasaoka ,  Tomohide Miki

IPC: H01L33/62 ,  H01L33/60

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

Abstract translation: 一种制造具有树脂封装的发光器件的方法，所述树脂封装在热固化之后在350nm和800nm之间的波长处提供等于或大于70％的光学反射率，并且其中树脂部分和引线形成在 在外侧表面上具有大致相同的平面，包括通过上模和下模夹着设置有切口部的引线框架的步骤，将含有光反射材料的热固性树脂转印成型 模具夹在上模具和下模具之间以在引线框架中形成树脂模制体，以及沿切口部分切割树脂模制体和引线框架的步骤。

公开(公告)号：US11133448B2

公开(公告)日：2021-09-28

申请号：US16660468

申请日：2019-10-22

Applicant: NICHIA CORPORATION

Inventor： Tomohide Miki

IPC: H01L33/64 ,  H01L33/62 ,  H01L33/60 ,  H01L33/48

Abstract: A light emitting device according to one aspect includes a resin package and a light emitting element. The resin package includes a molded resin part defining a part of a recessed portion, and a pair of leads. The leads are exposed from the molded resin part at a bottom surface of the recessed portion. Each of the leads includes a plating layer and exposed from the molded resin part at a lower surface of the resin package. A height of a first part of the plating layer exposed from the lower surface of the resin package and adjacent to an edge of a corresponding one of the leads is different from a height of a second part of the plating layer exposed from the lower surface of the resin package. The light emitting element is mounted on the bottom surface of the recessed portion.

公开(公告)号：US10700241B2

公开(公告)日：2020-06-30

申请号：US16150259

申请日：2018-10-02

Applicant: NICHIA CORPORATION

Inventor： Hirofumi Ichikawa ,  Masaki Hayashi ,  Shimpei Sasaoka ,  Tomohide Miki

IPC: H01L33/48 ,  B29C45/00 ,  B29C45/14 ,  H01L33/60 ,  H01L23/00 ,  H01L33/00 ,  H01L33/62 ,  H01L33/64 ,  H01L33/50 ,  H01L33/56

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US10186649B2

公开(公告)日：2019-01-22

申请号：US15603653

申请日：2017-05-24

Applicant: NICHIA CORPORATION

Inventor： Tomohide Miki

IPC: H01L33/18 ,  H01L33/24 ,  H01L33/62 ,  H01L33/48 ,  H01L33/60

Abstract: A light emitting device includes a package, a light emitting element, and a sealing member. The package is equipped with a lead and a molded resin that holds the lead. The lead has an upper surface and a lower surface, and has a metal board and a plating layer. The plating layer includes a first plating layer that contains a nickel plating layer, a gold plating layer, and a silver plating layer, that is provided to an upper surface of the metal board, and that is not provided to a lower surface of the metal board. The light emitting element is mounted in the package. The sealing member seals the light emitting element.

公开(公告)号：US10103302B2

公开(公告)日：2018-10-16

申请号：US14757843

申请日：2015-12-24

Applicant: NICHIA CORPORATION

Inventor： Ryoji Naka ,  Naofumi Sumitani ,  Yasuo Kato ,  Tomohide Miki

IPC: H01L33/62 ,  H01L33/44 ,  H01L33/54 ,  H01L33/60 ,  H01L25/16 ,  H01L33/56

Abstract: A light emitting device includes a base having a first lead electrode and a second lead electrode. Each of the first lead electrode and the second lead electrode includes a reflecting layer which includes silver or silver alloy plating containing a sulfur-based gloss agent. A light emitting element is provided on one side of the base and is electrically connected to the first lead electrode and the second lead electrode. The reflecting layer is on the one side of the base. A sealer includes resin and is provided on the one side of the base to seal the light emitting element and at least a part of the first lead electrode and the second lead electrode. A light-transmissive protective film includes an inorganic matter and is provided between the reflecting layer and the sealer.

公开(公告)号：US09615493B2

公开(公告)日：2017-04-04

申请号：US14478086

申请日：2014-09-05

Applicant: NICHIA CORPORATION

Inventor： Ryohei Yamashita ,  Tomohide Miki ,  Hiroto Tamaki

IPC: H01L33/62 ,  H01L33/48 ,  H05K13/00 ,  H01L23/00

CPC classification number: H05K13/00 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49113 ,  H01L2924/181 ,  Y10T29/49124 ,  Y10T29/49126 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method for manufacturing a circuit board constituted by a light emitting device and a mounting board includes the steps of: conveying the light emitting device onto the mounting board in a state in which a top face is chucked by a nozzle so that the nozzle and an exposed part of a first terminal part of the light emitting device are in contact; and placing the light emitting device onto the mounting board so that the first terminal part and a wiring component are in contact in a state in which the top face is chucked by the nozzle.

公开(公告)号：US09287476B2

公开(公告)日：2016-03-15

申请号：US13969182

申请日：2013-08-16

Applicant: NICHIA CORPORATION

Inventor： Hirofumi Ichikawa ,  Masaki Hayashi ,  Shimpei Sasaoka ,  Tomohide Miki

IPC: H01L21/00 ,  H01L23/495 ,  H01L33/62 ,  B29C45/00 ,  B29C45/14 ,  H01L33/60 ,  H01L33/48 ,  H01L23/00

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

Abstract translation: 一种制造具有树脂封装的发光器件的方法，所述树脂封装在热固化之后在350nm和800nm之间的波长处提供等于或大于70％的光学反射率，并且其中树脂部分和引线形成在 在外侧表面上具有大致相同的平面，包括通过上模和下模夹着设置有切口部的引线框架的步骤，将含有光反射材料的热固性树脂转印成型 模具夹在上模具和下模具之间以在引线框架中形成树脂模制体，以及沿切口部分切割树脂模制体和引线框架的步骤。

公开(公告)号：US09287472B2

公开(公告)日：2016-03-15

申请号：US14316546

申请日：2014-06-26

Applicant: Nichia Corporation

Inventor： Tomohide Miki

IPC: H01L33/44 ,  H01L33/56 ,  H01L33/54

CPC classification number: H01L33/56 ,  H01L33/46 ,  H01L33/50 ,  H01L33/54 ,  H01L2224/16245 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2924/00012

Abstract: There is provided a light emitting device including a light emitting element, a covering member for covering a side surface of the light emitting element, and a light-transmissive member disposed on upper surfaces in a light emitting direction of the light emitting element and the covering member and having an end face on substantially the same plane as an end face of the covering member, wherein the covering member has a recess portion or a convex portion on the upper surface, a light emitting surface of the light emitting element and an upper surface other than the recess portion or the convex portion of the covering member are arranged on substantially the same plane, and the light-transmissive member is provided in contact with the recess portion or the convex portion.

Abstract translation: 提供了一种发光装置，其包括发光元件，用于覆盖发光元件的侧表面的覆盖构件和设置在发光元件的发光方向上的上表面上的透光构件和覆盖物 构件，并且在与覆盖构件的端面基本相同的平面上具有端面，其中覆盖构件在上表面上具有凹部或凸部，发光元件的发光表面和上表面 覆盖部件的凹部或凸部以外的部分布置在基本上相同的平面上，并且透光部件设置成与凹部或凸部接触。

公开(公告)号：US08803159B2

公开(公告)日：2014-08-12

申请号：US14044419

申请日：2013-10-02

Applicant: Nichia Corporation

Inventor： Masafumi Kuramoto ,  Tomohide Miki ,  Tomoya Tsukioka ,  Tomohisa Kishimoto

IPC: H01L33/56 ,  H01L33/32 ,  H01L33/60 ,  C08G59/32 ,  C08K3/00 ,  C08K5/00

CPC classification number: H01L33/36 ,  C08G59/3245 ,  C08K3/013 ,  C08K5/005 ,  H01L33/32 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.

Abstract translation: 公开了一种发光装置，其包括由发光峰值波长不小于430nm的氮化镓系化合物半导体构成的发光元件（10） 设置有具有安装有发光元件（10）的底面的凹部和侧面的成型体（40） 以及含有包含三嗪衍生物环氧树脂的环氧树脂或含硅树脂的密封构件（50）。 成型体（40）通过使用基本上含有包含三嗪衍生物环氧树脂的环氧树脂的热固性环氧树脂组合物的固化物得到，并且在不小于430nm的波长下具有不小于70％的反射率 。