公开(公告)号：US08768114B2

公开(公告)日：2014-07-01

申请号：US13775445

申请日：2013-02-25

Applicant: Nitto Denko Corporation

Inventor： Yuichi Tsujita ,  Yasuto Ishimura ,  Hiroyuki Hanazono ,  Naoyuki Tanaka ,  Yasufumi Yamamoto ,  Shotaro Masuda ,  Mayu Ozaki

IPC: G02B6/12

CPC classification number: G02B6/136 ,  G02B6/1221 ,  G02B6/138 ,  G02B6/43

Abstract: An opto-electric hybrid board which is capable of suppressing the increase in light propagation losses and which is excellent in flexibility, and a method of manufacturing the same are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer of the electric circuit board. The metal layer is formed between the optical waveguide and the back surface of the insulative layer of the electric circuit board. The metal layer is patterned to have a plurality of strips. Cores of the optical waveguide are disposed in a position corresponding to a site where the metal layer is removed by the patterning.

Abstract translation: 提供了能够抑制光传播损失增加并且柔性优异的光电混合板及其制造方法。 光电混合基板包括电路板，光波导和金属层。 电路板包括具有前表面和后表面的绝缘层，以及形成在绝缘层的前表面上的电互连线。 光波导形成在电路板的绝缘层的背面上。 金属层形成在光波导与电路板的绝缘层的背面之间。 图案化金属层以具有多个条带。 光波导的芯设置在与通过图案化去除金属层的位置相对应的位置。

公开(公告)号：US20130301980A1

公开(公告)日：2013-11-14

申请号：US13866273

申请日：2013-04-19

Applicant: NITTO DENKO CORPORATION

Inventor： Yuichi Tsujita ,  Yasuto Ishimaru ,  Hiroyuki Hanazono ,  Naoyuki Tanaka ,  Yasufumi Yamamoto ,  Shotaro Masuda ,  Mayu Ozaki

IPC: G02B6/122 ,  G02B6/136

CPC classification number: G02B6/122 ,  G02B6/136 ,  G02B6/138 ,  G02B6/43

Abstract: An opto-electric hybrid board capable of suppressing the increase in light propagation losses and excellent in flexibility, and a method of manufacturing the same, are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer. The metal layer is formed between the cladding layer and the insulative layer. At least part of the metal layer is formed in one of first and second patterns. The first pattern includes a distribution of dot-shaped protrusions, and the second pattern includes a distribution of dot-shaped recesses. A first cladding layer fills a site where the metal layer is removed by the patterning.

Abstract translation: 提供能够抑制光传播损耗增加和柔性优异的光电混合板及其制造方法。 光电混合基板包括电路板，光波导和金属层。 电路板包括具有前表面和后表面的绝缘层，以及形成在绝缘层的前表面上的电互连线。 光波导形成在绝缘层的背面上。 金属层形成在包覆层和绝缘层之间。 金属层的至少一部分形成为第一和第二图案之一。 第一图案包括点状突起的分布，第二图案包括点状凹部的分布。 第一包层填充通过图案化去除金属层的位置。

公开(公告)号：US09679797B2

公开(公告)日：2017-06-13

申请号：US14709914

申请日：2015-05-12

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide Takamoto ,  Hiroyuki Hanazono ,  Akihiro Fukui

IPC: H01L21/683 ,  H01L21/78 ,  H01L23/00 ,  H01L23/544

CPC classification number: H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2223/54486 ,  H01L2224/13111 ,  H01L2224/13611 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/81007 ,  H01L2224/81193 ,  H01L2224/81203 ,  Y10T428/31515 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029

Abstract: The present invention is to provide a dicing-tape integrated film for the backside of a semiconductor that is capable of suppressing the transfer of the coloring agent contained in a film for the backside of a flip-chip semiconductor formed on the pressure-sensitive adhesive layer of the dicing tape onto the dicing tape. The dicing-tape integrated film for the backside of a semiconductor has a dicing tape having a substrate and a pressure-sensitive adhesive layer formed on the substrate and a film for the backside of a flip-chip semiconductor formed on the pressure-sensitive adhesive layer of the dicing tape, the film for the backside of a flip-chip semiconductor contains a coloring agent, and the solubility of the coloring agent to toluene at 23° C. is 2 g/100 ml or less.

公开(公告)号：US20170018472A1

公开(公告)日：2017-01-19

申请号：US15124002

申请日：2015-02-20

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide Takamoto ,  Hiroyuki Hanazono ,  Akihiro Fukui

IPC: H01L23/29 ,  H01L23/00 ,  H01L25/065 ,  H01L21/56 ,  H01L21/683

CPC classification number: H01L23/29 ,  C09J7/24 ,  C09J2203/326 ,  C09J2433/006 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/293 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/27002 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29393 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81127 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83127 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/0635 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/27 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/066 ,  H01L2924/014 ,  H01L2924/013 ,  H01L2924/01006 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/11 ,  H01L2221/68304 ,  H01L21/78 ,  H01L2221/68386 ,  H01L21/304 ,  H01L2221/68368

Abstract: An underfill material having sufficient curing reactivity, and capable of achieving a small change in viscosity and good electrical connection even when loaded with thermal history, a laminated sheet including the underfill material, and a method for manufacturing a semiconductor device. The underfill material has a melt viscosity at 150° C. before heating treatment of 50 Pa·s or more and 3,000 Pa·s or less, a viscosity change rate of 500% or less, at 150° C. as a result of the heating treatment, and a reaction rate represented by {(Qt−Qh)/Qt}×100% of 90% or more, where Qt is a total calorific value in a process of temperature rise from −50° C. to 300° C. and Qh is a total calorific value in a process of temperature rise from −50° C. to 300° C. after heating at 175° C. for 2 hours in a DSC measurement.

Abstract translation: 一种底部填充材料具有足够的固化反应性，并且即使在加载热历史的情况下也能够实现粘度的小变化和良好的电连接，包括底部填充材料的层压片材和半导体器件的制造方法。 底部填充材料在150℃下的熔融粘度在50Pa·s以上且3,000Pa·s以下，粘度变化率为500％以下，在150℃下，作为 加热处理，{（Qt-Qh）/ Qt}×100％表示的反应率为90％以上，其中Qt为从-50℃升温至300℃的总热值 Qh是在DSC测定中，在175℃加热2小时后，从-50℃升温到300℃的过程中的总热值。

公开(公告)号：US20160233184A1

公开(公告)日：2016-08-11

申请号：US15024552

申请日：2014-09-19

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki Hanazono ,  Naohide Takamoto ,  Akihiro Fukui

IPC: H01L23/00

CPC classification number: H01L24/11 ,  H01L21/48 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/11019 ,  H01L2224/11502 ,  H01L2224/11515 ,  H01L2224/1155 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/81 ,  H01L2224/83

Abstract: A method for manufacturing a semiconductor includes: a Step A of preparing a chip with sheet-shaped resin composition in which a sheet-shaped resin composition is pasted onto a semiconductor chip, a Step B of preparing an adherend, a Step C of pasting the chip with sheet-shaped resin composition onto the adherend so that the sheet-shaped resin composition serves as a pasting surface, a Step D of heating the sheet-shaped resin composition to semi-cure the sheet-shaped resin composition after the Step C, and a Step E of heating the sheet-shaped resin composition at a higher temperature than in the Step D to cure the sheet-shaped resin composition after the Step D.

Abstract translation: 半导体的制造方法包括：将片状树脂组合物贴合在半导体芯片上的片状树脂组合物的制备工序A，制造被粘物的工序B，粘贴 将片状树脂组合物与片状树脂组合物贴合在被粘物上，使得片状树脂组合物作为糊状表面，在步骤C之后加热片状树脂组合物以使片状树脂组合物半固化的步骤D， 以及步骤E，其在比步骤D更高的温度下加热片状树脂组合物，以在步骤D之后固化片状树脂组合物。

公开(公告)号：US20160013089A1

公开(公告)日：2016-01-14

申请号：US14772724

申请日：2014-02-28

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide Takamoto ,  Kosuke Morita ,  Akihiro Fukui ,  Hiroyuki Hanazono ,  Akira Suzuki

IPC: H01L21/683 ,  B32B27/08 ,  C08J5/18 ,  H01L21/78

CPC classification number: H01L21/6836 ,  B32B27/08 ,  B32B2270/00 ,  B32B2405/00 ,  B32B2457/14 ,  C08J5/18 ,  C08J2333/08 ,  C08J2333/12 ,  C08J2461/06 ,  C08J2463/00 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/293 ,  H01L23/295 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68368 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83

Abstract: A production method for a semiconductor device is provided whereby, when peeling a support body from an attached wafer, melting of a sheet-shaped resin composition pasted to the other surface of the wafer can be suppressed. The method comprises: preparing a support body-attached wafer, said support body-attached wafer having the support body bonded, via a temporary fixing layer, to one surface of the wafer having a through electrode formed therein; preparing a dicing tape-integrated sheet-shaped resin composition having a sheet-shaped resin composition having an external shape smaller than the other surface of the wafer formed upon a dicing tape; pasting the other surface of the support body-attached wafer to the sheet-shaped resin composition in the dicing tape-integrated sheet-shaped resin composition; and melting the temporary fixing layer by a solvent and peeling the support body away from the wafer.

Abstract translation: 提供一种用于半导体器件的制造方法，其中当从附着的晶片剥离支撑体时，可以抑制粘贴到晶片的另一个表面上的片状树脂组合物的熔化。 该方法包括：准备附着有支撑体的晶片，所述支撑体附着晶片具有通过临时固定层与支撑体结合在其中形成有通孔的晶片的一个表面上; 制备具有小于形成在切割带上的晶片的另一表面的外形的片状树脂组合物的切割带一体的片状树脂组合物; 将附着有支撑体的晶片的另一个表面粘贴在切割带一体的片状树脂组合物中的片状树脂组合物上; 并通过溶剂熔化临时固定层，并将支撑体剥离晶片。

公开(公告)号：US20150380277A1

公开(公告)日：2015-12-31

申请号：US14769441

申请日：2014-02-07

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke Morita ,  Naohide Takamoto ,  Hiroyuki Hanazono ,  Akihiro Fukui

IPC: H01L21/56 ,  C08J5/18 ,  H01L23/00 ,  B32B27/38 ,  H01L21/683 ,  H01L23/29

CPC classification number: H01L21/563 ,  B32B27/38 ,  B32B2264/102 ,  B32B2457/14 ,  C08G59/621 ,  C08J5/18 ,  C08J2333/08 ,  C08J2333/12 ,  C08J2361/10 ,  C08J2433/08 ,  C08J2433/12 ,  C08J2433/20 ,  C08J2463/00 ,  C08L33/06 ,  C09J133/08 ,  C09J163/00 ,  H01L21/6836 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/562 ,  H01L24/13 ,  H01L24/14 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/84862 ,  H01L2924/00011 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/0105 ,  H01L2924/0665 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2224/81805

Abstract: An object of the present invention is to provide an underfill sheet that enables suitable filling of unevenness of a circuit surface of a semiconductor element, a suitable connection of a terminal of the semiconductor element and a terminal of an adherend, and suppression of outgas. The present invention relates to the underfill sheet having a viscosity of 1,000 Pa·s to 10,000 Pa·s at 150° C. and 0.05 to 0.20 rotations/min; and a minimum viscosity of 100 Pa·s or more at 100 to 200° C. and 0.3 to 0.7 rotations/min.

Abstract translation: 本发明的目的是提供一种能够适当地填充半导体元件的电路表面的不均匀性，半导体元件的端子和被粘物的端子的适当连接以及抑制排气的底部填充片。 本发明涉及在150℃下粘度为1,000Pa·s〜10,000Pa·s和0.05〜0.20转/分钟的底填料片; 在100〜200℃，最低粘度为100Pa·s以上，0.3〜0.7转/分钟。

公开(公告)号：US20130243370A1

公开(公告)日：2013-09-19

申请号：US13775445

申请日：2013-02-25

Applicant: NITTO DENKO CORPORATION

Inventor： Yuichi Tsujita ,  Yasuto Ishimaru ,  Hiroyuki Hanazono ,  Naoyuki Tanaka ,  Yasufumi Yamamoto ,  Shotaro Masuda ,  Mayu Ozaki

IPC: G02B6/136

CPC classification number: G02B6/136 ,  G02B6/1221 ,  G02B6/138 ,  G02B6/43

Abstract: An opto-electric hybrid board which is capable of suppressing the increase in light propagation losses and which is excellent in flexibility, and a method of manufacturing the same are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer of the electric circuit board. The metal layer is formed between the optical waveguide and the back surface of the insulative layer of the electric circuit board. The metal layer is patterned to have a plurality of strips. Cores of the optical waveguide are disposed in a position corresponding to a site where the metal layer is removed by the patterning.

Abstract translation: 提供了能够抑制光传播损失增加并且柔性优异的光电混合板及其制造方法。 光电混合基板包括电路板，光波导和金属层。 电路板包括具有前表面和后表面的绝缘层，以及形成在绝缘层的前表面上的电互连线。 光波导形成在电路板的绝缘层的背面上。 金属层形成在光波导与电路板的绝缘层的背面之间。 图案化金属层以具有多个条带。 光波导的芯设置在与通过图案化去除金属层的位置相对应的位置。