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    WIRING STRUCTURE AND METHOD OF FORMING THE STRUCTURE
    12.
    发明申请
    WIRING STRUCTURE AND METHOD OF FORMING THE STRUCTURE 有权
    导线结构及形成结构的方法

    公开(公告)号：US20120299188A1

    公开(公告)日：2012-11-29

    申请号：US13114079

    申请日：2011-05-24

    申请人： Fen Chen ,  Jeffrey P. Gambino ,  Anthony K. Stamper ,  Timothy D. Sullivan

    发明人： Fen Chen ,  Jeffrey P. Gambino ,  Anthony K. Stamper ,  Timothy D. Sullivan

    IPC分类号： H01L23/485 ,  H01L21/768

    CPC分类号： H01L21/76816 ,  H01L21/76843 ,  H01L23/5283 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed is a wiring structure and method of forming the structure with a conductive diffusion barrier layer having a thick upper portion and thin lower portion. The thicker upper portion is located at the junction between the wiring structure and the adjacent dielectric materials. The thicker upper portion: (1) minimizes metal ion diffusion and, thereby TDDB; (2) allows a wire width to dielectric space width ratio that is optimal for low TDDB to be achieved at the top of the wiring structure; and (3) provides a greater surface area for via landing. The thinner lower portion: (1) allows a different wire width to dielectric space width ratio to be maintained in the rest of the wiring structure in order to balance other competing factors; (2) allows a larger cross-section of wire to reduce current density and, thereby reduce EM; and (3) avoids an increase in wiring structure resistivity.

    摘要翻译： 公开了一种具有导电扩散阻挡层的结构的布线结构和方法，所述导电扩散阻挡层具有较厚的上部和较薄的下部。 较厚的上部位于布线结构和相邻电介质材料之间的接合处。 较厚的上部：（1）最小化金属离子扩散，从而使TDDB; （2）允许在布线结构的顶部实现对于低TDDB最佳的电线宽度与电介质空间宽度比; 和（3）为通孔着陆提供更大的表面积。 较薄的下部：（1）允许在布线结构的其余部分中保持不同的导线宽度与电介质空间宽度比，以平衡其他竞争因素; （2）允许更大的导线截面减小电流密度，从而减少EM; 和（3）避免了布线结构电阻率的增加。

    Thermo-mechanical cleavable structure
    16.
    发明授权
    Thermo-mechanical cleavable structure 有权
    热机械可切割结构

    公开(公告)号：US08018017B2

    公开(公告)日：2011-09-13

    申请号：US10905905

    申请日：2005-01-26

    申请人： Fen Chen ,  Cathryn J. Christiansen ,  Richard S. Kontra ,  Tom C. Lee ,  Alvin W. Strong ,  Timothy D. Sullivan ,  Joseph E. Therrien

    发明人： Fen Chen ,  Cathryn J. Christiansen ,  Richard S. Kontra ,  Tom C. Lee ,  Alvin W. Strong ,  Timothy D. Sullivan ,  Joseph E. Therrien

    IPC分类号： H01L31/058

    CPC分类号： H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A thermo-mechanical cleavable structure is provided and may be used as a programmable fuse for integrated circuits. As applied to a programmable fuse, the thermo-mechanical cleavable structure includes an electrically conductive cleavable layer adjacent to a thermo-mechanical stressor. As electricity is passed through the cleavable layer, the cleavable layer and the thermo-mechanical stressor are heated and gas evolves from the thermo-mechanical stressor. The gas locally insulates the thermo-mechanical stressor, causing local melting adjacent to the bubbles in the thermo-mechanical stressor and the cleavable structure forming cleaving sites. The melting also interrupts the current flow through the cleavable structure so the cleavable structure cools and contracts. The thermo-mechanical stressor also contracts due to a phase change caused by the evolution of gas therefrom. As the thermo-mechanical cleavable structure cools, the cleaving sites expand causing gaps to be permanently formed therein.

    摘要翻译： 提供了一种热机械可切割结构，可用作集成电路的可编程保险丝。 如应用于可编程保险丝，热机械可切割结构包括与热机械应力源相邻的导电可切割层。 当电通过可切割层时，可切割层和热机械应力器被加热并且气体从热机械应力源逸出。 气体将热机械应力局部绝缘，导致邻近热机械应力的气泡局部熔化，形成裂开位置的可切割结构。 熔化还中断当前通过可切割结构的流动，因此可切割结构冷却和收缩。 热机械应力还由于由其产生的气体引起的相变而收缩。 当热机械可裂解结构冷却时，裂解位置膨胀，导致间隙永久形成。