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11.发明申请公开(公告)号：US20150373842A1
公开(公告)日：2015-12-24
申请号：US14521641
申请日：2014-10-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN , Yi Hyun JUNG , Suk Hyeon CHO , Young Gwan KO
CPC classification number: H05K3/0097 , H01L2224/16227 , H01L2924/15313 , H01L2924/15788 , H05K1/02 , H05K3/0052 , H05K3/4605 , H05K2201/09145 , H05K2203/0228 , Y10T428/163 , Y10T428/239 , Y10T428/24339 , Y10T428/24612 , Y10T428/24777 , Y10T428/24793
Abstract: There are provided a substrate strip, a substrate panel, and a manufacturing method of a substrate strip. The substrate strip includes: a plurality of unit substrates including a glass core; and a glass core cover part disclosed on a side surface of the substrate strip on which the glass core is exposed.
Abstract translation: 提供了衬底条，衬底面板和衬底条的制造方法。 基板条包括：多个单元基板，包括玻璃芯; 以及玻璃芯覆盖部，其在基板条的侧表面上露出玻璃芯。
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12.发明申请公开(公告)号：US20150223341A1
公开(公告)日：2015-08-06
申请号：US14597795
申请日：2015-01-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Hoon KIM , Tae Hong MIN , Young Gwan KO , Hye Jin KIM , Suk Hyeon CHO , Chil Woo KWON , Jung Han LEE
CPC classification number: H05K3/007 , H01L21/568 , H01L2224/04105 , H05K1/113 , H05K1/185 , H05K3/4623 , H05K3/4682 , H05K3/4697 , Y10T29/49128 , Y10T29/4913
Abstract: An embedded board, a printed circuit board, and a method of manufacturing the same. According to one embodiment of the present invention, an embedded board includes: a core insulating layer formed with a first cavity; a first circuit layer formed on one surface of the core insulating layer; a build-up insulating layer formed on one surface of the core insulating layer and formed with a second cavity extending from the first cavity; devices disposed in the first cavity and the second cavity and formed to protrude from one surface of the core insulating layer; a first insulating layer formed on the other surface of the core insulating layer and filling the first cavity and the second cavity; and a build-up circuit layer and a via formed in the build-up insulating layer.
Abstract translation: 嵌入式电路板，印刷电路板及其制造方法。 根据本发明的一个实施例，嵌入式板包括：形成有第一腔的芯绝缘层; 形成在所述芯绝缘层的一个表面上的第一电路层; 形成在所述芯绝缘层的一个表面上且形成有从所述第一腔延伸的第二腔的积聚绝缘层; 设置在所述第一腔和所述第二腔中并且形成为从所述芯绝缘层的一个表面突出的器件; 形成在所述芯绝缘层的另一个表面上并填充所述第一腔和所述第二腔的第一绝缘层; 以及在积层绝缘层中形成的积聚电路层和通孔。
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公开(公告)号：US20250048553A1
公开(公告)日：2025-02-06
申请号：US18746534
申请日：2024-06-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN , Sang Hoon KIM
Abstract: A printed circuit board includes a first substrate portion including a first insulating portion and a plurality of first wiring layers respectively disposed on or in the first insulating portion, a resin layer disposed to cover a side surface of the first insulating portion, and a second substrate portion including a second insulating portion disposed to cover each of an upper surface of the first insulating portion and an upper surface of the resin layer, and a second wiring layer disposed on or in the second insulating portion.
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公开(公告)号：US20240215157A1
公开(公告)日：2024-06-27
申请号：US18382202
申请日：2023-10-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ki Ran PARK , Hyun Woo KWON , Tae Hong MIN , Sang Hyun HAN , Guh Hwan LIM , Yo Han SONG , Dong Keun LEE , Kyeong Yub JUNG , Eun Gyu JEONG , Yu Mi KIM
CPC classification number: H05K1/0298 , H05K3/108 , H05K3/425 , H05K2201/09509 , H05K2201/09563 , H05K2201/096 , H05K2203/072 , H05K2203/0723
Abstract: A printed circuit board includes: a first insulating layer; a via pad disposed on an upper surface of the first insulating layer; a second insulating layer disposed on the upper surface of the first insulating layer and having a via hole exposing at least a portion of an upper surface of the via pad; a conductor pattern disposed on the exposed upper surface of the via pad; and a via including a first metal layer covering at least a portion of each of a wall surface of the via hole, the exposed upper surface of the via pad, and the conductor pattern, and a second metal layer disposed on the first metal layer and disposed in at least a portion of the via hole.
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公开(公告)号：US20210329777A1
公开(公告)日：2021-10-21
申请号：US17068290
申请日：2020-10-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN , Ju Ho KIM
Abstract: A printed circuit board has a first stacked body having a flexible region and a rigid region, and a second stacked body disposed on the rigid region of the first stacked body. The first stacked body includes a plurality of first insulating layers, a plurality of first bonding layers, and a plurality of first wiring layers. The second stacked body includes a plurality of second insulating layers and a plurality of second wiring layers, and each of the plurality of first bonding layers integrally covers at least a portion of upper and side surfaces of a respective first wiring layer of the plurality of first wiring layers.
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Patent Agency Ranking
公开(公告)号：US20160095203A1
公开(公告)日：2016-03-31
申请号：US14870572
申请日：2015-09-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Hong MIN , Myung Sam KANG , Young Gwan KO , Min Jae SEONG , Jin Hyuk JANG
CPC classification number: H05K1/0207 , H01L23/3677 , H01L23/373 , H01L23/3737 , H01L23/467 , H01L23/49827 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16265 , H01L2224/20 , H01L2224/2518 , H01L2924/15311 , H05K1/0204 , H05K1/0206 , H05K3/4608 , H05K2201/0323 , H05K2201/10416
Abstract: Disclosed herein is a circuit board including a heat transfer structure formed of a highly thermal conductive material, wherein a part of the heat transfer structure excluding an air cooling unit exposed to outside of an insulation unit is inserted into an insulation unit, and the air cooling unit has a shape having a high non-surface area such as a wrinkled or uneven shape.
Abstract translation: 这里公开了一种电路板，其包括由高导热材料形成的传热结构，其中除暴露于绝缘单元之外的空气冷却单元的传热结构的一部分插入绝缘单元中，并且空气冷却 单元具有具有高的非表面积的形状，例如起皱或不均匀的形状。
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公开(公告)号：US20160095198A1
公开(公告)日：2016-03-31
申请号：US14870741
申请日：2015-09-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Hong MIN , Myung Sam KANG , Young Gwan KO , Min Jae SEONG
CPC classification number: H05K1/0206 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/16235 , H01L2224/2518 , H01L2924/15311 , H05K1/0207 , H05K1/023 , H05K1/141 , H05K1/185 , H05K3/4608 , H05K2201/041
Abstract: Disclosed herein is a circuit board. According to an exemplary embodiment of the present disclosure, a circuit board has a structure in which at least a portion of a first heat transfer structure in which a metal layer and an insulating layer are alternately stacked is inserted into an insulating part.
Abstract translation: 这里公开了一种电路板。 根据本公开的示例性实施例，电路板具有其中将金属层和绝缘层交替堆叠的第一传热结构的至少一部分插入到绝缘部分中的结构。
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公开(公告)号：US20160037620A1
公开(公告)日：2016-02-04
申请号：US14668804
申请日：2015-03-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Myung Sam KANG , Young Gwan KO , Tae Hong MIN , Jung Han LEE
CPC classification number: H05K1/0204 , H01L23/3677 , H01L23/49827 , H05K1/0206 , H05K3/4602 , H05K2201/10416
Abstract: There is provided a printed circuit board including: a core layer having a cavity formed therein; a heat radiation body included in the cavity; an insulating layer provided on an upper surface and a lower surface of the core layer; and a heat dissipating via penetrating through the insulating layer to be in contact with the heat radiation body and dissipating heat externally, wherein the heat radiation body includes an insulating plate, a first metal block formed on an upper surface of the insulating plate, and a second metal block formed on a lower surface of the insulating plate.
Abstract translation: 提供了一种印刷电路板，包括：其中形成有腔的芯层; 包括在腔中的散热体; 设置在所述芯层的上表面和下表面上的绝缘层; 以及通过贯穿所述绝缘层与所述散热体接触并从外部散热的散热部，其中所述散热体包括绝缘板，形成在所述绝缘板的上表面上的第一金属块，以及 第二金属块形成在绝缘板的下表面上。
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公开(公告)号：US20150034377A1
公开(公告)日：2015-02-05
申请号：US14444126
申请日：2014-07-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN
CPC classification number: H05K1/115 , B32B17/06 , B32B2307/206 , B32B2457/08 , C03C23/0025 , H05K1/0306 , H05K1/036 , H05K3/0029 , H05K3/4076 , H05K3/42 , H05K2201/09563 , H05K2201/09827 , H05K2201/09854 , H05K2201/2072 , H05K2203/108 , Y10T156/1057
Abstract: Disclosed herein are a glass core substrate and a method for manufacturing the same. According to an embodiment of the present invention, there is provided the glass core substrate including: a glass core laminate including a glass layer and insulating layers which are stacked on upper and lower portions of the glass layer; a through hole formed by penetrating through the glass core laminate and provided with at least one crack which is formed at a penetrating inner wall by penetrating into the glass layer; and a conductive material filled in the through hole and the crack. Further, the method for manufacturing a glass core substrate is provided.
Abstract translation: 本文公开了玻璃芯基板及其制造方法。 根据本发明的实施例，提供了一种玻璃芯基板，包括：玻璃芯层叠体，其包括层叠在玻璃层的上部和下部的玻璃层和绝缘层; 通过穿透玻璃芯层叠体并且设置有穿透玻璃层而形成在穿透内壁的至少一个裂纹而形成的通孔; 以及填充在通孔和裂纹中的导电材料。 另外，提供了玻璃芯基板的制造方法。
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公开(公告)号：US20150021074A1
公开(公告)日：2015-01-22
申请号：US14298098
申请日：2014-06-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Hoon KIM , Tae Hong MIN , Jung Han LEE , Hye Jin KIM
CPC classification number: H05K1/0271 , H01L2924/3511 , H05K1/111 , H05K1/115 , H05K1/185 , H05K3/0097 , H05K3/429 , H05K3/4602 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0352 , H05K2201/09136 , H05K2203/0191 , H05K2203/1536 , Y10T29/49139
Abstract: Disclosed herein is a printed circuit board capable of implementing slimness by decreasing the number of entire layers through an asymmetrical build-up structure in which an electric device is embedded, the printed circuit board including: a core layer including a cavity formed therein so that an electric device is embedded and a circuit pattern and a pad formed on upper and lower surfaces thereof; a through via formed in the core layer so as to connect the upper and the lower pads of the core layer to each other; a plurality of insulating layers built-up on the core layer and including a plurality of vias so as to be electrically connected to the through via; and a solder resist layer applied onto a lower portion of the core layer so that a lower surface of the through via is partially exposed.
Abstract translation: 本发明公开了一种印刷电路板，其能够通过使嵌入电气装置的不对称积聚结构减少整个层数来实现薄片化，该印刷电路板包括：芯层，其包括形成在其中的空腔， 电气装置被嵌入，并且在其上表面和下表面上形成电路图案和焊盘; 通孔形成在芯层中，以将芯层的上垫和下焊盘彼此连接; 多个绝缘层，其堆叠在所述芯层上并且包括多个通孔，以便电连接到所述通孔; 以及涂覆在芯层的下部上的阻焊层，使得通孔的下表面部分露出。
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