公开(公告)号：US20160097130A1

公开(公告)日：2016-04-07

申请号：US14504436

申请日：2014-10-02

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

IPC: C23C18/28 ,  C23C18/32 ,  C23C18/42 ,  C23C18/16

CPC classification number: C23C18/1689 ,  C23C18/1644 ,  C23C18/2086 ,  C23C18/24 ,  C23C18/285 ,  C23C18/30 ,  C23C18/32 ,  C23C18/42

Abstract: A preparation method of a conductive sponge includes the following steps. First, a sponge substrate is dipped in a metal solution and then taken out. A first drying process is performed. Next, the sponge substrate plated with metal particles is dipped in a carbon nanomaterial suspension and then taken out. Then, a second drying process is performed.

Abstract translation: 导电海绵的制备方法包括以下步骤。 首先将海绵基材浸入金属溶液中，然后取出。 进行第一次干燥处理。 接下来，将镀有金属颗粒的海绵基材浸渍在碳纳米材料悬浮液中，然后取出。 然后进行第二干燥处理。

公开(公告)号：US09095083B2

公开(公告)日：2015-07-28

申请号：US14074655

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang

IPC: B05D5/12 ,  H05K3/46 ,  H05K3/00 ,  H05K3/10 ,  H05K3/40 ,  B05D7/00 ,  H05K3/12 ,  H05K1/02 ,  H05K3/24 ,  H05K1/11 ,  C23C18/16

CPC classification number: H05K1/0298 ,  B05D5/12 ,  B05D7/50 ,  C23C18/165 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/0038 ,  H05K3/12 ,  H05K3/244 ,  H05K3/40 ,  H05K3/46 ,  H05K3/4679 ,  H05K2203/1476

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having a first via penetrating the substrate is provided. Next, a patterned circuit layer is formed on a surface of the substrate by using the first via as an alignment target. The first patterned circuit layer includes a first concentric-circle pattern surrounding the first via. Next, a first stacking layer is formed on the surface. Then, a first through hole penetrating regions where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected on the first stacking layer and the substrate is formed. Next, a second stacking layer is formed on the first stacking layer. Afterward, a second through hole penetrating regions where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected on of the first, the second stacking layers and the substrate is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，提供具有穿过基板的第一通孔的基板。 接下来，通过使用第一通孔作为取向对象，在基板的表面上形成图案化电路层。 第一图案化电路层包括围绕第一通孔的第一同心圆图案。 接下来，在表面上形成第一层叠层。 然后，形成从同心圆图案的中心的第一同心圆正交地突出在第一堆叠层和基板上的第一通孔贯穿区域。 接着，在第一堆叠层上形成第二层叠层。 之后，形成从同心圆图案的中心的第二同心圆正交地突出在第一，第二堆叠层和基板上的第二通孔贯穿区域。

公开(公告)号：US20150125625A1

公开(公告)日：2015-05-07

申请号：US14074655

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang

IPC: H05K3/46 ,  H05K3/10 ,  H05K3/00

CPC classification number: H05K1/0298 ,  B05D5/12 ,  B05D7/50 ,  C23C18/165 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/0038 ,  H05K3/12 ,  H05K3/244 ,  H05K3/40 ,  H05K3/46 ,  H05K3/4679 ,  H05K2203/1476

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having a first via penetrating the substrate is provided. Next, a patterned circuit layer is formed on a surface of the substrate by using the first via as an alignment target. The first patterned circuit layer includes a first concentric-circle pattern surrounding the first via. Next, a first stacking layer is formed on the surface. Then, a first through hole penetrating regions where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected on the first stacking layer and the substrate is formed. Next, a second stacking layer is formed on the first stacking layer. Afterward, a second through hole penetrating regions where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected on of the first, the second stacking layers and the substrate is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，提供具有穿过基板的第一通孔的基板。 接下来，通过使用第一通孔作为取向对象，在基板的表面上形成图案化电路层。 第一图案化电路层包括围绕第一通孔的第一同心圆图案。 接下来，在表面上形成第一层叠层。 然后，形成从同心圆图案的中心的第一同心圆正交地突出在第一堆叠层和基板上的第一通孔贯穿区域。 接着，在第一堆叠层上形成第二层叠层。 之后，形成从同心圆图案的中心的第二同心圆正交地突出在第一，第二堆叠层和基板上的第二通孔贯穿区域。

公开(公告)号：US20150121693A1

公开(公告)日：2015-05-07

申请号：US14073869

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang ,  Ai-Hwa Lim

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4038 ,  B05D5/12 ,  B05D7/50 ,  C23C18/1655 ,  H05K1/0269 ,  H05K1/0298 ,  H05K1/111 ,  H05K3/0032 ,  H05K3/0097 ,  H05K3/12 ,  H05K3/244 ,  H05K3/46 ,  H05K3/4644 ,  H05K3/4679 ,  H05K2203/107 ,  H05K2203/1536 ,  Y10T29/49165

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, two core layers are compressed to form a substrate having two surfaces opposite to each other. Then, a via connecting the surfaces is formed. A patterned circuit layer including a concentric-circle pattern is then formed on each surface by using the via as an alignment target. Next, a first stacking layer is formed on each surface. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. A second stacking layer is then formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，将两个芯层压缩以形成具有彼此相对的两个表面的基板。 然后，形成连接表面的通孔。 然后通过使用通孔作为对准靶，在每个表面上形成包括同心圆图案的图案化电路层。 接下来，在每个表面上形成第一层叠层。 然后，形成第一层叠层的第一贯通孔和从同心圆图案的中心的第一同心圆正交地突出的基板。 然后在每个第一堆叠层上形成第二层叠层。 之后，形成第一，第二堆叠层和基板的第二通孔穿透区域，其中同心圆图案的中心的第二同心圆正交地突出在其上。

公开(公告)号：US20140174791A1

公开(公告)日：2014-06-26

申请号：US13726659

申请日：2012-12-26

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Cheng-Po Yu ,  Han-Pei Huang ,  Shang-Feng Huang

IPC: H05K3/06 ,  H05K1/02

CPC classification number: H05K3/465 ,  H05K3/06 ,  H05K3/108 ,  H05K2203/0723

Abstract: A circuit board and a manufacturing method thereof are provided. A dielectric layer is formed on a substrate, wherein an internal circuit layer is formed on the substrate and the dielectric layer covers the internal circuit layer. A first trench, a second trench and an opening are formed in the dielectric layer. The opening is located below the first trench and connected with the first trench, and a portion of the internal circuit layer is exposed by the opening. A patterned conductive layer is formed on the dielectric layer. The patterned conductive layer covers a portion of the dielectric layer and fills the first trench, the second trench and the opening so as to form a first circuit layer, a second circuit layer and a conductive through via, respectively, wherein the conductive through via is electrically connected with the first circuit layer and the internal circuit layer.

Abstract translation: 提供一种电路板及其制造方法。 在基板上形成电介质层，在基板上形成内部电路层，电介质层覆盖内部电路层。 在电介质层中形成第一沟槽，第二沟槽和开口。 开口位于第一沟槽的下方并与第一沟槽连接，内部电路层的一部分被开口露出。 在电介质层上形成有图案的导电层。 图案化的导电层覆盖电介质层的一部分并且填充第一沟槽，第二沟槽和开口，以分别形成第一电路层，第二电路层和导电通孔，其中导电通孔是 与第一电路层和内部电路层电连接。

公开(公告)号：US20130040071A1

公开(公告)日：2013-02-14

申请号：US13653423

申请日：2012-10-17

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Cheng-Po Yu ,  Chi-Min Chang ,  Wei-Ming Cheng

IPC: B05D5/00 ,  B05D3/06

CPC classification number: H05K3/185 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/465 ,  H05K3/4661 ,  H05K2201/0236

Abstract: A method for fabricating a circuit board is provided. A non-conductive material layer is provided on a core substrate, wherein the non-conductive material layer comprises a dielectric material and catalytic particles. A recessed circuit structure is then formed in the non-conductive material layer with a laser beam. Simultaneously, the catalytic particles in the recessed circuit structure are activated with aid of the laser. A buried conductive structure is then formed in the recessed circuit structure by chemical copper deposition methods.

Abstract translation: 提供一种制造电路板的方法。 非导电材料层设置在芯基板上，其中非导电材料层包括电介质材料和催化颗粒。 然后在非导电材料层中用激光束形成凹陷的电路结构。 同时，凹陷电路结构中的催化颗粒借助于激光器被激活。 然后通过化学铜沉积方法在凹陷电路结构中形成掩埋导电结构。

公开(公告)号：US10433413B2

公开(公告)日：2019-10-01

申请号：US14460365

申请日：2014-08-15

Applicant: Unimicron Technology Corp.

Inventor： Cheng-Po Yu ,  Ming-Chia Li

IPC: H05K3/30 ,  H05K1/02 ,  H05K3/40 ,  H05K1/18 ,  H05K3/46

Abstract: A manufacturing method of circuit structure embedded with heat-dissipation block including the following steps is provided. A core board including a first dielectric layer and two first conductive layers located on two opposite sides of the first dielectric layer is provided. A through hole penetrated the core board is formed. A heat-dissipation block is disposed into the through hole. Two inner-layer circuits are formed on two opposite sides of the core board. At least one build-up structure is bonded on the core board, wherein the build-up structure includes a second dielectric layer and a second conductive layer, and the second dielectric layer is located between the second conductive layer and the core board. A cavity is formed on a predetermined region of the build-up structure, and the cavity is communicated with the corresponding inner-layer circuit. Another manufacturing method of circuit structure embedded with heat-dissipation block is also provided.

公开(公告)号：US09883598B2

公开(公告)日：2018-01-30

申请号：US15289950

申请日：2016-10-10

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Ming-Hao Wu ,  Cheng-Po Yu

IPC: H01L35/30 ,  H05K3/46 ,  H05K1/18 ,  H05K1/02 ,  G06F1/20 ,  H01L23/498 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36 ,  H01L23/12

CPC classification number: H05K3/4647 ,  G06F1/206 ,  H01L23/12 ,  H01L23/13 ,  H01L23/4275 ,  H01L23/49827 ,  H01L35/30 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K1/187 ,  H05K3/36 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/10219 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734

Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

公开(公告)号：US20160300473A1

公开(公告)日：2016-10-13

申请号：US14680075

申请日：2015-04-07

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Cheng-Po Yu

IPC: G08B21/24 ,  G08G1/16 ,  B60Q9/00

CPC classification number: G08B21/24 ,  B60Q9/008 ,  G08G1/166

Abstract: A vehicle door opening warning system including a control unit, a projection unit and a detection unit is provided. The control unit is disposed at a door of a vehicle. The projection unit is disposed at the door and is electrically coupled to the control unit. The detection unit is disposed outside of the vehicle and is electrically coupled to the control unit. When the detection unit detects a moving object existing within 5 to 30 meters of the vehicle, the detection unit produces a signal. The control unit receives the signal and controls the projection unit to project a warning message according to the signal. A vehicle door opening warning method is also provided.

Abstract translation: 提供了包括控制单元，投影单元和检测单元的车门打开警告系统。 控制单元设置在车辆的门上。 投影单元设置在门上并且电耦合到控制单元。 检测单元设置在车辆外部并且电耦合到控制单元。 当检测单元检测到存在于车辆5至30米范围内的运动物体时，检测单元产生信号。 控制单元接收信号并根据信号控制投影单元投射警告消息。 还提供车门打开警告方法。

公开(公告)号：US20160266334A1

公开(公告)日：2016-09-15

申请号：US15164878

申请日：2016-05-26

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

IPC: G02B6/42 ,  G02B6/43 ,  G02B6/12

CPC classification number: G02B6/428 ,  G02B6/12004 ,  G02B6/32 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4274 ,  G02B6/43 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167

Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.

Abstract translation: 提供了包括多层基板，光波导元件和两个光电组件的光学部件。 多层基板包括电介质层，两个电路层和穿过电介质层的两个通孔。 光波导元件位于多层基板上并且位于通孔之间。 光电组件分别插入对应的通孔中并相应地位于光波导元件的两个相对端。 光电组件中的一个将电信号转换成光束并将光束提供给光波导元件，另一个光电组件接收从光波导元件传输的光束并转换光 射入另一个电信号。 还提供了具有光学部件的光学部件的制造方法和光电路板。