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    Processes and systems for engineering a barrier surface for copper deposition
    11.
    发明申请
    Processes and systems for engineering a barrier surface for copper deposition 有权
    用于工程用于铜沉积的阻挡面的工艺和系统

    公开(公告)号：US20070292603A1

    公开(公告)日：2007-12-20

    申请号：US11514038

    申请日：2006-08-30

    申请人： Yezdi Dordi ,  John Boyd ,  Tiruchirapalli Arunagiri ,  Hyungsuk Alexander Yoon ,  Fritz C. Redeker ,  William Thie ,  Arthur M. Howald

    发明人： Yezdi Dordi ,  John Boyd ,  Tiruchirapalli Arunagiri ,  Hyungsuk Alexander Yoon ,  Fritz C. Redeker ,  William Thie ,  Arthur M. Howald

    IPC分类号： B05D5/12 ,  C23C16/00 ,  B05D3/00 ,  C23C14/00 ,  B05C13/02 ,  H05K3/00 ,  B29C71/04 ,  C23C14/32

    CPC分类号： H01L21/7685 ,  C23C18/1632 ,  C23C18/1651 ,  C23C18/1844 ,  H01L21/0206 ,  H01L21/02063 ,  H01L21/02068 ,  H01L21/02074 ,  H01L21/28518 ,  H01L21/288 ,  H01L21/32115 ,  H01L21/32135 ,  H01L21/32136 ,  H01L21/67161 ,  H01L21/67207 ,  H01L21/76814 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76846 ,  H01L21/76849 ,  H01L21/76862 ,  H01L21/76867 ,  H01L21/76871 ,  H01L21/76879

    摘要： The embodiments fill the need to enhance electro-migration performance, provide lower metal resistivity, and improve metal-to-metal interfacial adhesion for copper interconnects by providing improved processes and systems that produce an improved metal-to-metal interface, more specifically barrier-to-copper interface. An exemplary method of preparing a substrate surface of a substrate to deposit a metallic barrier layer to line a copper interconnect structure of the substrate and to deposit a thin copper seed layer on a surface of the metallic barrier layer in an integrated system to improve electromigration performance of the copper interconnect is provided. The method includes cleaning an exposed surface of a underlying metal to remove surface metal oxide in the integrated system, wherein the underlying metal is part of a underlying interconnect electrically connected to the copper interconnect. The method also includes depositing the metallic barrier layer to line the copper interconnect structure in the integrated system, wherein after depositing the metallic barrier layer, the substrate is transferred and processed in controlled environment to prevent the formation of metallic barrier oxide. The method further includes depositing the thin copper seed layer in the integrated system, and depositing a gap-fill copper layer over the thin copper seed layer in the integrated system. An exemplary system to practice the exemplary method described above is also provided.

    摘要翻译： 这些实施方案通过提供改进的工艺和系统来提供改进的金属 - 金属界面，更具体地说是阻隔层，提高了电迁移性能，提供较低的金属电阻率，以及改进铜互连的金属 - 金属界面粘附的需要， 到铜接口。 一种制备衬底的衬底表面的示例性方法，以沉积金属阻挡层以对衬底的铜互连结构进行排列并且在集成系统中在金属阻挡层的表面上沉积薄铜籽晶层以改善电迁移性能 的铜互连。 该方法包括清洁底层金属的暴露表面以去除集成系统中的表面金属氧化物，其中下面的金属是与铜互连电连接的底层互连件的一部分。 该方法还包括沉积金属阻挡层以在集成系统中对铜互连结构进行排列，其中在沉积金属阻挡层之后，将基底在受控环境中转移和加工以防止形成金属阻挡氧化物。 该方法还包括在集成系统中沉积薄铜籽晶层，以及在集成系统中的薄铜籽晶层上沉积间隙填充铜层。 还提供了用于实践上述示例性方法的示例性系统。

    Self assembled monolayer for improving adhesion between copper and barrier layer
    14.
    发明申请
    Self assembled monolayer for improving adhesion between copper and barrier layer 审中-公开
    自组装单层以改善铜和阻挡层之间的粘附性

    公开(公告)号：US20090304914A1

    公开(公告)日：2009-12-10

    申请号：US11639012

    申请日：2006-12-13

    申请人： Praveen Nalla ,  William Thie ,  John Boyd ,  Tiruchirapalli Arunagiri ,  Hyungsuk Alexander Yoon ,  Fritz C. Redeker ,  Yezdi Dordi

    发明人： Praveen Nalla ,  William Thie ,  John Boyd ,  Tiruchirapalli Arunagiri ,  Hyungsuk Alexander Yoon ,  Fritz C. Redeker ,  Yezdi Dordi

    IPC分类号： B05D3/10

    CPC分类号： C23C16/45525 ,  C23C16/18 ,  H01L21/288 ,  H01L21/76843 ,  H01L21/76855 ,  H01L21/76856 ,  H01L21/76861

    摘要： The embodiments fill the need enabling deposition of a thin and conformal barrier layer, and a copper layer in the copper interconnect with good electro-migration performance and with reduced risk of stress-induce voiding of copper interconnect. Electromigration and stress-induced voiding are affected by the adhesion between the barrier layer and the copper layer. A functionalization layer is deposited over the barrier layer to enable the copper layer being deposit in the copper interconnect. The functionalization layer forms strong bonds with barrier layer and with copper to improve adhesion property between the two layers. An exemplary method of preparing a substrate surface of a substrate to deposit a functionalization layer over a metallic barrier layer of a copper interconnect to assist deposition of a copper layer in the copper interconnect in order to improve electromigration performance of the copper interconnect is provided. The method includes depositing the metallic barrier layer to line the copper interconnect structure in the integrated system, and oxidizing a surface of the metallic barrier layer. The method also includes depositing the functionalization layer over the oxidized surface of the metallic barrier layer, and depositing the copper layer in the copper interconnect structure after the funcationalization layer is deposited over the metallic barrier layer.

    摘要翻译： 这些实施例满足了能够沉积薄且保形的阻挡层和铜互连中的铜层的需要，具有良好的电迁移性能并且具有降低的铜互连的应力诱发空穴的风险。 电迁移和应力引起的空隙受到阻挡层和铜层之间的粘附的影响。 在阻挡层上沉积功能化层，以使铜层沉积在铜互连中。 官能化层与阻挡层和铜形成强结合，以改善两层之间的粘附性。 提供了制备衬底的衬底表面以在铜互连的金属阻挡层上沉积功能化层以辅助铜层沉积在铜互连中以便提高铜互连的电迁移性能的示例性方法。 该方法包括沉积金属阻挡层以在集成系统中对铜互连结构进行排列，以及氧化金属阻挡层的表面。 该方法还包括将功能化层沉积在金属阻挡层的氧化表面上，并且在功能层沉积在金属阻挡层上之后，将铜层沉积在铜互连结构中。

    Method and Apparatus for Wafer Electroless Plating
    20.
    发明申请
    Method and Apparatus for Wafer Electroless Plating 有权
    晶圆化学镀方法与装置

    公开(公告)号：US20080254225A1

    公开(公告)日：2008-10-16

    申请号：US11735987

    申请日：2007-04-16

    申请人： William Thie ,  John M. Boyd ,  Fritz C. Redeker ,  Yezdi Dordi ,  John Parks ,  Tiruchirapalli Arunagiri ,  Aleksander Owczarz ,  Todd Balisky ,  Clint Thomas ,  Jacob Wylie

    发明人： William Thie ,  John M. Boyd ,  Fritz C. Redeker ,  Yezdi Dordi ,  John Parks ,  Tiruchirapalli Arunagiri ,  Aleksander Owczarz ,  Todd Balisky ,  Clint Thomas ,  Jacob Wylie

    IPC分类号： B05D1/18 ,  B05C13/00

    CPC分类号： H01L21/02104 ,  C23C18/1619 ,  H01L21/67005 ,  H01L21/6715

    摘要： A semiconductor wafer electroless plating apparatus includes a platen and a fluid bowl. The platen has a top surface defined to support a wafer, and an outer surface extending downward from a periphery of the top surface to a lower surface of the platen. The fluid bowl has an inner volume defined by an interior surface so as to receive the platen, and wafer to be supported thereon, within the inner volume. A seal is disposed around the interior surface of the fluid bowl so as to form a liquid tight barrier when engaged between the interior surface of the fluid bowl and the outer surface of the platen. A number of fluid dispense nozzles are positioned to dispense electroplating solution within the fluid bowl above the seal so as to rise up and flow over the platen, thereby flowing over the wafer when present on the platen.

    摘要翻译： 半导体晶片化学镀设备包括压板和流体碗。 压板具有限定为支撑晶片的顶表面和从顶表面的周边向下延伸到压板的下表面的外表面。 流体碗具有由内表面限定的内部容积，以便在内部容积内容纳压板和要支撑在其上的晶片。 密封件设置在流体碗的内表面周围，以便当接合在流体碗的内表面和压板的外表面之间时形成液密屏障。 多个流体分配喷嘴被定位成在密封件上方的流体碗内分配电镀溶液，以便在压板上升起并流动，从而当存在于压板上时流过晶片。