公开(公告)号：US20120217645A1

公开(公告)日：2012-08-30

申请号：US13035669

申请日：2011-02-25

申请人： Reza A. Pagaila

发明人： Reza A. Pagaila

IPC分类号： H01L23/485 ,  H01L21/56

CPC分类号： H01L23/5384 ,  H01L21/486 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/83 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2223/54426 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06131 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/21 ,  H01L2224/2105 ,  H01L2224/215 ,  H01L2224/22 ,  H01L2224/221 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/8385 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/95001 ,  H01L2224/95121 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/115 ,  H05K3/429 ,  H05K3/4647 ,  H05K2201/09518 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00012 ,  H01L2224/03

摘要： A semiconductor device has a substrate with a plurality of conductive vias and conductive layer formed over the substrate. A semiconductor die is mounted over a carrier. The substrate is mounted to the semiconductor die opposite the carrier. An encapsulant is deposited between the substrate and carrier around the semiconductor die. A plurality of conductive TMVs is formed through the substrate and encapsulant. The conductive TMVs protrude from the encapsulant to aid with alignment of the interconnect structure. The conductive TMVs are electrically connected to the conductive layer and conductive vias. The carrier is removed and an interconnect structure is formed over a surface of the encapsulant and semiconductor die opposite the substrate. The interconnect structure is electrically connected to the conductive TMVs. A plurality of semiconductor devices can be stacked and electrically connected through the substrate, conductive TMVs, and interconnect structure.

摘要翻译： 半导体器件具有在衬底上形成多个导电通孔和导电层的衬底。 半导体管芯安装在载体上。 衬底被安装到与载体相对的半导体管芯上。 在半导体管芯周围的衬底和载体之间沉积密封剂。 通过衬底和密封剂形成多个导电TMV。 导电TMV从密封剂突出以帮助互连结构的对准。 导电TMV电连接到导电层和导电通孔。 移除载体并且在与衬底相对的密封剂和半导体管芯的表面上形成互连结构。 互连结构电连接到导电TMV。 多个半导体器件可以通过衬底层叠并电连接，导电TMV和互连结构。