Abstract:
An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes a flexible printed circuit board connected to jack contacts and to connections to a network cable. The flexible printed circuit board includes conductive traces arranged as one or more couplings to provide crosstalk compensation.
Abstract:
A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.
Abstract:
A composite flexible circuit planar cable includes a flat cable, a first section, and a second section. The flat cable includes a plurality of straight line like parallel and non-jumping conductor lines. At least one jumping line is formed on the first section to interchangeably connect a selected conductive line of the first section to an another selected conductive line. The second section may also form at least one jumping line to interchangeably connect a selected conductive line of the second section to an another selected conductive line. Through such a jumping line, electrical connection can be formed between signal terminals and corresponding and interchanged signal terminals. The plurality of conductor lines of the flat cable includes at least a pair of differential signal conductor lines, a grounding line, and a power line.
Abstract:
A signaling system is disclosed. The system includes a transmitter comprising an encoder to encode a data signal such that the encoded data signal has a balanced number of logical 1s and 0s. The system also includes a receiver having a decoder to decode the encoded data signal, and a link. The link is coupled between the transmitter and the receiver to route the encoded data signal. The link comprises three or more conductive lines that are routed along a path in parallel between the encoder and the decoder, and wherein the link comprises segments, each segment comprising a routing change to reorder proximity of at least one pair of lines relative to any adjacent segment, with a sufficient number of segments such that each line has each of the other lines of the link as a nearest neighbor over at least a portion of the path.
Abstract:
An electrostatic-capacitance touch panel includes of X electrodes which are formed above a front surface of the electrostatic-capacitance touch panel, Y electrodes which intersect with the X electrodes, a back-surface electrode which is formed above a back surface of the electrostatic-capacitance touch panel, X-electrode signal lines which supply signals to the X electrodes from both ends of each X electrode, Y-electrode signal lines which supply signals to the Y electrodes from both ends of each Y electrode, a flexible printed circuit board connected to the X-electrode signal lines and the Y-electrode signal lines at a connection portion, intersecting portions where the X electrodes and the Y electrodes overlap with each other, and electrode portions each of which is formed between two intersecting portions. A back-surface-connection-use terminal is formed outside of the connection portion, and the back-surface-connection-use terminal and the back-surface electrode are connected to each other using a conductive member.
Abstract:
A disk drive is disclosed comprising a disk, a head actuated over the disk, a preamp, and an interconnect for coupling the head to the preamp. The interconnect comprises a first transmission line stacked with a second transmission line, and a dielectric between the first transmission line and second transmission line. The transmission lines form an approximation of at least one inductor/capacitor ladder network and an approximation of at least one inductor/capacitor lattice network. The lattice network comprises a first leg and a second leg, and a cross-over hub for interconnecting the first leg and the second leg.
Abstract:
Embodiments of the present invention relate to circuit layouts that are compatible with printing electronic inks, printed circuits formed by printing an electronic ink or a combination of printing and conventional blanket deposition and photolithography, and methods of forming circuits by printing electronic inks onto structures having print-compatible shapes. The layouts include features having (i) a print-compatible shape and (ii) an orientation that is either orthogonal or parallel to the orientation of every other feature in the layout.
Abstract:
A semiconductor device has a substrate and RF coupler formed over the substrate. The RF coupler has a first conductive trace with a first end coupled to a first terminal of the semiconductor device, and a second conductive trace with a first end coupled to a second terminal of the semiconductor device. The first conductive trace is placed in proximity to a first portion of the second conductive trace. An integrated passive device is formed over the substrate. A second portion of the second conductive trace operates as a circuit component of the integrated passive device. The integrated passive device can be a balun or low-pass filter. The RF coupler also has a first capacitor coupled to the first terminal of the semiconductor device, and second capacitor coupled to a third terminal of the semiconductor device for higher directivity. The second conductive trace is wound to exhibit an inductive property.
Abstract:
A circuit board includes a substrate having upper and lower sides, and first and second conductive vias extending between the upper and lower sides. The first and second conductive vias include circular outer profiles. The circuit board also includes a differential pair of conductive traces, which includes a first conductive trace having first upper and lower segments disposed on the upper and lower sides, respectively. The first upper and lower segments are electrically connected together through the first conductive via. The first upper segment is curved around the second conductive via such that the first upper segment follows the circular outer profile of the second conductive via. The differential pair of conductive traces also includes a second conductive trace having second upper and lower segments disposed on the upper and lower sides, respectively. The second upper and lower segments are electrically connected together through the second conductive via. The first upper segment crosses over the second lower segment. The second lower segment is curved around the first conductive via such that the second lower segment follows the circular outer profile of the first conductive via.
Abstract:
Connecting element for mounting on a printed circuit board, which connecting element has at least two connecting lines which cross one another and are not electrically connected between respectively associated contacts.