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    Illuminating Display Systems
    21.
    发明申请
    Illuminating Display Systems 有权
    照明显示系统

    公开(公告)号：US20090284164A1

    公开(公告)日：2009-11-19

    申请号：US12119496

    申请日：2008-05-13

    Applicant: William Johnstone Ray ,  Mark D. Lowenthal ,  David R. Bowden ,  Peter Michael Bray

    Inventor： William Johnstone Ray ,  Mark D. Lowenthal ,  David R. Bowden ,  Peter Michael Bray

    IPC: H05B37/02 ,  H01J9/02

    CPC classification number: G09F9/37 ,  A47F3/001 ,  G09F13/00 ,  G09G3/14 ,  G09G2330/028 ,  H01F38/14 ,  H02J5/005 ,  H02J7/025 ,  H02J50/12 ,  H05B33/0815 ,  H05B37/0209 ,  H05B37/0227 ,  H05B41/245

    Abstract: An exemplary system comprises a power regulator and an emitting apparatus. The emitting apparatus is typically attached to or integrated with a display object, such as a merchandise package or container. A support structure, such as a point of purchase display, typically contains or supports one or more power regulators and display objects. The power regulator comprises a controller and a primary inductor, and the controller is adapted to provide a voltage or current to the primary inductor to generate a first primary inductor voltage. The emitting apparatus comprises an illumination source and a secondary inductor coupled to the illumination source. The illumination source is adapted to emit visible light when the power regulator is in an on state and when the secondary inductor is within a predetermined distance of the primary inductor. In exemplary embodiments, the first and second inductors are substantially planar.

    Abstract translation: 示例性系统包括功率调节器和发射设备。 发光装置通常附接到显示对象，例如商品包装或容器上或与显示对象集成。 支持结构，例如购买点显示，通常包含或支持一个或多个功率调节器和显示对象。 功率调节器包括控制器和初级电感器，并且控制器适于向初级电感器提供电压或电流以产生第一初级电感器电压。 发光装置包括照明源和耦合到照明源的次级电感器。 当功率调节器处于导通状态并且次级电感器在初级电感器的预定距离内时，照明源适于发射可见光。 在示例性实施例中，第一和第二电感器基本上是平面的。

    Three-layer color display using active LED dies
    22.
    发明授权
    Three-layer color display using active LED dies 有权

    公开(公告)号：US11164851B2

    公开(公告)日：2021-11-02

    申请号：US16843590

    申请日：2020-04-08

    Applicant: Nthdegree Technologies Worldwide Inc.

    Inventor： William Johnstone Ray ,  Michael LeFebvre ,  Darin Wagner ,  Richard A. Blanchard

    IPC: H01L25/075 ,  H01L25/065

    Abstract: Over a flexible substrate are deposited stacked pixel layers including a bottom layer of LEDs forming blue pixels, a middle layer of LEDs forming green pixels, and a top layer of LEDs forming red pixels. Each LED die comprises an LED portion and an integrated transistor portion. Applying a voltage to a control terminal of the transistor portion energizes the LED portion. The pixels are substantially transparent, due to the LEDs being microscopic and the pixel areas being much larger, to allow light from the underlying layers to pass through. The three layers of pixels are aligned so that a combination of a single top red pixel, a single underlying green pixel, and a single underlying blue pixel form a single multi-color pixel. The different layers have transparent column and row lines.

    Self-alignment of optical structures to random array of printed micro-LEDs
    24.
    发明授权
    Self-alignment of optical structures to random array of printed micro-LEDs 有权

    公开(公告)号：US10510928B2

    公开(公告)日：2019-12-17

    申请号：US16439141

    申请日：2019-06-12

    Applicant: Nthdegree Technologies Worldwide Inc.

    Inventor： William Johnstone Ray ,  Richard A. Blanchard

    IPC: H01L33/42 ,  G02B27/09 ,  G02B5/02 ,  H01L33/50 ,  H01L23/00 ,  H01L33/38 ,  H01L25/075 ,  H01L33/54 ,  H01L33/40

    Abstract: Printed micro-LEDs have a top metal anode electrode that is relatively tall and narrow and a bottom cathode electrode. After the LED ink is cured, the bottom electrodes are in electrical contact with a conductive layer on a substrate. The locations of the LEDs are random. A thin dielectric layer is then printed between the LEDs, and a thin conductive layer, such as a nano-wire layer, is then printed over the dielectric layer to contact the anode electrodes. The top conductive layer over the tall anode electrodes has bumps corresponding with the locations of the LEDs. An omniphobic liquid is then printed which only resides in the “low” areas of the top conductive layer between the bumps. Any optical material is then uniformly printed over the resulting surface. The printed optical material accumulates only on the bump areas by adhesion and surface tension, so is self-aligned with the individual LEDs.

    LED display with patterned pixel landings and printed LEDs
    25.
    发明授权
    LED display with patterned pixel landings and printed LEDs 有权

    公开(公告)号：US10417956B2

    公开(公告)日：2019-09-17

    申请号：US16219463

    申请日：2018-12-13

    Applicant: Nthdegree Technologies Worldwide Inc.

    Inventor： Brian D. Ogonowsky

    IPC: G09G3/32 ,  H01L23/00 ,  H01L33/06 ,  H01L33/32 ,  H01L33/40 ,  H01L33/00 ,  H01L33/48 ,  H01L33/62 ,  H01L33/58 ,  H01L33/54 ,  H01L33/50 ,  H01L25/075

    Abstract: Pixel locations in an addressable display are defined by metal landings on a top surface of a flexible substrate, such as by depositing a metal film and etching the film. The substrate surface may be hydrophobic so that the hydrophobic surface is exposed between the metal landings. The substrate has conductive vias that connect the metal landings to traces on a bottom surface of the substrate for connection to addressing circuitry. LED ink is then blanket-printed over the top surface and cured to electrically connect bottom electrodes of the LEDs to the metal landings. LEDs that fall between the landings are ineffective. A dielectric layer is blanket-printed which exposes the top electrodes, and a transparent conductor layer is blanket-printed over the LEDs to connect all LEDs associated with an individual pixel location in parallel. Accordingly, all printed steps can be performed without any alignment.

    Active LED module with LED and vertical MOS transistor formed on same substrate
    26.
    发明授权
    Active LED module with LED and vertical MOS transistor formed on same substrate 有权

    公开(公告)号：US10201051B1

    公开(公告)日：2019-02-05

    申请号：US16003544

    申请日：2018-06-08

    Applicant: Nthdegree Technologies Worldwide Inc.

    Inventor： Richard A. Blanchard

    IPC: H01L27/15 ,  H01L33/00 ,  H05B33/08 ,  H01L33/36

    Abstract: An LED module is disclosed containing an integrated MOSFET driver transistor in series with an LED. In one embodiment, GaN-based LED layers are epitaxially grown over an interface layer on a silicon substrate. The MOSFET gate is formed in a trench in the silicon substrate and creates a vertical channel between a top source and a bottom drain when the gate is biased to turn on the LED. A conductor on the die connects the MOSFET in series with the LED. One power electrode is located on a top of the die, another power electrode is located on the bottom of the die, and the gate electrode may be on the top or the side of the die.

    Active LED module with LED and transistor formed on same substrate
    29.
    发明授权
    Active LED module with LED and transistor formed on same substrate 有权
    有源LED模块与LED和晶体管形成在同一基板上

    公开(公告)号：US09577007B2

    公开(公告)日：2017-02-21

    申请号：US14868082

    申请日：2015-09-28

    Applicant: Nthdegree Technologies Worldwide Inc.

    Inventor： Richard Austin Blanchard ,  Bradley Steven Oraw

    IPC: H01L27/15 ,  H01L33/32

    CPC classification number: H01L27/153 ,  H01L27/15 ,  H01L33/32

    Abstract: An LED module is disclosed containing an integrated driver transistor (e.g, a MOSFET) in series with an LED. In one embodiment, LED layers are grown over a substrate. The transistor regions are formed over the same substrate. After the LED layers, such as GaN layers, are grown to form the LED portion, a central area of the LED is etched away to expose a semiconductor surface in which the transistor regions are formed. A conductor connects the transistor in series with the LED. Another node of the transistor is electrically coupled to an electrode on the bottom surface of the substrate. In one embodiment, an anode of the LED is connected to one terminal of the module, one current carrying node of the transistor is connected to a second terminal of the module, and the control terminal of the transistor is connected to a third terminal of the module.

    Abstract translation: 公开了一种LED模块，其包含与LED串联的集成驱动晶体管（例如，MOSFET）。 在一个实施例中，LED层在衬底上生长。 晶体管区域形成在相同的衬底上。 在诸如GaN层的LED层被生长以形成LED部分之后，将LED的中心区域蚀刻掉以暴露其中形成晶体管区域的半导体表面。 导体将晶体管与LED串联连接。 晶体管的另一个节点电耦合到衬底的底表面上的电极。 在一个实施例中，LED的阳极连接到模块的一个端子，晶体管的一个馈电节点连接到模块的第二端子，并且晶体管的控制端子连接到模块的第三端子 模块。

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