公开(公告)号：US08716846B2

公开(公告)日：2014-05-06

申请号：US13293119

申请日：2011-11-10

申请人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

发明人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

IPC分类号： H01L23/495

CPC分类号： H01L41/25 ,  G01L19/0069 ,  G01L19/147 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.

公开(公告)号：US20130196473A1

公开(公告)日：2013-08-01

申请号：US13794789

申请日：2013-03-12

申请人： Zhigang Bai ,  Jinzhong Yao

发明人： Zhigang Bai ,  Jinzhong Yao

IPC分类号： H01L21/56

CPC分类号： H01L21/565 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H03K19/018521 ,  H01L2924/00014

摘要： A mold chase for packaging a semiconductor die includes first and second toothed mold clamps, each having teeth, recesses located between the teeth, and an open cavity located in a center of the first mold clamp. The second mold clamp is in facing arrangement with the first mold clamp and the teeth in the first mold clamp mate with corresponding recesses in the second mold clamp and vice-versa. In an open position a lead frame can be inserted into one of the first or second mold clamps and in a closed position, the teeth and recesses of the first and second mold clamps bend leads of the lead frame into two spaced, planar rows.

摘要翻译： 用于包装半导体模具的模具行包括第一和第二齿形模具夹具，每个具有齿，位于齿之间的凹部和位于第一模具夹具的中心的开口腔。 第二模具夹具与第一模具夹具面对配置，并且第一模具夹具中的齿与第二模具夹具中的相应凹部配合，反之亦然。 在打开位置，引线框架可以插入第一或第二模具夹具中的一个中，并且在关闭位置，第一和第二模具夹具的齿和凹部将引线框架的引线弯曲成两个间隔开的平面行。

公开(公告)号：US20120139067A1

公开(公告)日：2012-06-07

申请号：US13246877

申请日：2011-09-28

申请人： WAI YEW LO ,  Lan Chu Tan ,  Jinzhong Yao

发明人： WAI YEW LO ,  Lan Chu Tan ,  Jinzhong Yao

IPC分类号： H01L21/50 ,  H01L29/84

CPC分类号： G01L19/147 ,  H01L24/97 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A method of packaging a pressure sensor die that does not use pre-molded lead frames. Instead a lead frame array is attached to a tape and a non-conductive material is deposited on the lead frames. The non-conductive material is cured and the tape is removed. Pressure sensor dies then are attached to respective die pads of the lead frames and electrically connected to lead frame leads with bond wires. A gel is dispensed onto a top surface of the pressure sensor dies and then a lid is attached to each of the lead frames to cover the pressure sensor dies. The lead frames are singulated to form individual pressure sensor packages.

摘要翻译： 包装不使用预成型引线框架的压力传感器模具的方法。 相反，引线框架阵列附着到带上，并且非导电材料沉积在引线框架上。 固化非导电材料并除去胶带。 然后将压力传感器模具连接到引线框架的相应的管芯焊盘，并用接合线电连接到引线框架引线。 将凝胶分配到压力传感器模具的顶表面上，然后将盖子附接到每个引线框架以覆盖压力传感器管芯。 引线框架被单独形成单独的压力传感器封装。

公开(公告)号：US08050048B2

公开(公告)日：2011-11-01

申请号：US12053622

申请日：2008-03-24

申请人： Xuesong Xu ,  Meijiang Song ,  Jinzhong Yao

发明人： Xuesong Xu ,  Meijiang Song ,  Jinzhong Yao

IPC分类号： H02B1/56 ,  H01R43/00 ,  H01L23/48 ,  H01L23/52 ,  H05K5/02

CPC分类号： H01R4/028 ,  H01L23/49503 ,  H01L23/49582 ,  H01L2924/0002 ,  Y10T29/49121 ,  H01L2924/00

摘要： A lead frame has multiple regions having different wetting characteristics on its surface. For example, one region is formed to handle silver plating while another has less wetting ability. A boundary between the regions causes a wetting force difference that inhibits molten solder flow between regions during solder die bonding.

摘要翻译： 引线框架具有在其表面上具有不同润湿特性的多个区域。 例如，形成一个区域来处理镀银，而另一个区域具有较少的润湿能力。 区域之间的边界引起润湿力差，在焊料芯片接合期间阻止区域之间的熔融焊料流动。

公开(公告)号：US20110248393A1

公开(公告)日：2011-10-13

申请号：US13021716

申请日：2011-02-05

申请人： Yongsheng Lu ,  Bin Tian ,  Nan Xu ,  Jinzhong Yao ,  Shufeng Zhao

发明人： Yongsheng Lu ,  Bin Tian ,  Nan Xu ,  Jinzhong Yao ,  Shufeng Zhao

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/3107 ,  H01L23/49548 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A lead frame for reducing detrimental effects of burr formation includes a lead frame that has leads where a portion of a top surface is removed from a first lead and a portion of a bottom surface is removed from a second lead adjacent to the first lead to reduce spacing between leads while reducing the detrimental effects of burr formation, such as shorting and the like, caused during singulation of a semiconductor device manufactured with the lead frame.

摘要翻译： 用于减少毛刺形成的有害影响的引线框架包括引线框架，其具有引线，其中顶表面的一部分从第一引线移除，并且底表面的一部分从邻近第一引线的第二引线移除以减少 导线之间的间隔，同时减少了由引线框制造的半导体器件的分割期间引起的毛刺形成的不利影响，例如短路等。

公开(公告)号：US09589928B2

公开(公告)日：2017-03-07

申请号：US14552497

申请日：2014-11-25

申请人： Zhigang Bai ,  Jinzhong Yao ,  Lan Chu Tan

发明人： Zhigang Bai ,  Jinzhong Yao ,  Lan Chu Tan

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L23/495 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L24/85 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a first lead frame type having a first type of package leads and a pre-molded portion, and a second lead frame type having a second type of package leads that surround a die pad and are supported by the pre-molded portion. An integrated circuit is attached to the die pad and electrically connected to the first and second types of leads with bond wires. A mold compound, which forms a mold cap, covers the first and second lead frame types, the integrated circuit and the bond wires. The first lead frame type may be a QFP type and the second lead frame type may be a QFN type.

摘要翻译： 半导体封装包括具有第一类型的封装引线和预成型部分的第一引线框架型和具有围绕芯片焊盘并由预模制部分支撑的第二类型的封装引线的第二引线框架型 。 集成电路附接到管芯焊盘并且用接合线电连接到第一和第二类型的引线。 形成模具帽的模具复合体覆盖第一和第二引线框架类型，集成电路和接合线。 第一引线框类型可以是QFP型，第二引线框类型可以是QFN型。

公开(公告)号：US20150097278A1

公开(公告)日：2015-04-09

申请号：US14459328

申请日：2014-08-14

申请人： Zhigang Bai ,  Yin Kheng Au ,  Lan Chu Tan ,  Jinzhong Yao

发明人： Zhigang Bai ,  Yin Kheng Au ,  Lan Chu Tan ,  Jinzhong Yao

IPC分类号： H01L23/495

CPC分类号： H01L21/4842 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49558 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012

摘要： Assembling a surface mount semiconductor device includes providing a lead frame structure with peripheral leads and additional bottom face contacts integral with frame members. Outer portions of the bottom face contact members are interposed between inner portions of adjacent pairs of the peripheral leads. A package body is formed by encapsulating the lead frame structure in which the frame members are positioned outside a side edge surface. The peripheral leads and the bottom face contact members project between the side edge surface of the package body and the frame members. The frame members are cut and the peripheral leads and the bottom face contact members are separated and electrically isolated from each other.

摘要翻译： 组装表面贴装半导体器件包括提供具有周边引线的引线框结构和与框架构件一体的附加底面接触。 底面接触构件的外部部分位于相邻的外围引线对的内部之间。 通过封装框架构件定位在侧边缘表面外侧的引线框架结构形成封装体。 外围引线和底面接触构件在封装主体的侧边缘表面和框架构件之间突出。 框架构件被切割，并且周边引线和底面接触构件彼此分离并电隔离。

公开(公告)号：US08722465B1

公开(公告)日：2014-05-13

申请号：US14155309

申请日：2014-01-14

申请人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

发明人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

IPC分类号： H01L21/00

CPC分类号： H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.

公开(公告)号：US08709875B2

公开(公告)日：2014-04-29

申请号：US13549518

申请日：2012-07-16

申请人： Jinzhong Yao ,  Zhigang Bai ,  Xuesong Xu

发明人： Jinzhong Yao ,  Zhigang Bai ,  Xuesong Xu

IPC分类号： H01L21/48

CPC分类号： H01L23/49537 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49551 ,  H01L23/49568 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/13101 ,  H01L2224/1329 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92242 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00012

摘要： A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers.

摘要翻译： 封装功率半导体管芯的方法包括提供双量规引线框架的第一引线框架。 第一引线框架包括厚的芯片焊盘。 磁带附着到厚芯片焊盘的第一侧，并且功率管芯附接到厚芯片焊盘的第二侧。 提供了双量规引线框架的第二引线框架。 第二引线框架具有薄的引线指。 引线指的一端连接到功率管芯的有源表面，使得引线指电连接到功率管芯的焊盘。 然后将模塑料分配到双量规引线框架的顶表面上，使得模制化合物覆盖电源模具和引线指。

公开(公告)号：US08481369B2

公开(公告)日：2013-07-09

申请号：US13004028

申请日：2011-01-11

申请人： Junhua Luo ,  Xingshou Pang ,  Jinzhong Yao

发明人： Junhua Luo ,  Xingshou Pang ,  Jinzhong Yao

IPC分类号： H01L21/56

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

摘要： A no-lead type semiconductor package is formed by attaching a die to a top surface of a flag of a lead frame and then taping a bottom surface of the flag and leads of the lead frame. Die bonding pads are connected to the leads with wires and then the assembly is put in a mold chase and encapsulated with a plastic material. The mold chase has protrusions between the flag and the leads of a lead frame, and between the leads themselves, which causes indentations to be formed between the leads and between the flag and the leads. The method is particularly useful for making quad flat no lead (QFN) devices and power-QFN type devices.

摘要翻译： 无引线型半导体封装通过将管芯附接到引线框架的标志的顶表面，然后贴合引线框架的标志和引线的底表面而形成。 芯片焊盘通过导线连接到引线，然后将组件放入模具中并用塑料材料封装。 模具追踪在引线框架的标志和引线之间以及引线本身之间具有突起，这导致引线之间以及引脚之间形成凹痕。 该方法对于制造四边形无铅（QFN）器件和功率QFN型器件特别有用。