公开(公告)号：US20140206124A1

公开(公告)日：2014-07-24

申请号：US14219011

申请日：2014-03-19

申请人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

发明人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

IPC分类号： H01L41/25

CPC分类号： H01L41/25 ,  G01L19/0069 ,  G01L19/147 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.

摘要翻译： 包装压力传感器管芯的方法包括提供引线框架，其具有围绕管芯焊盘的管芯焊盘和引线指。 带子附接到引线框架的第一侧。 压力传感器芯片在引线框架的第二侧附接到芯片焊盘，并且芯片的焊盘被连接到引线指。 将密封剂分配到引线框架的第二侧上并且覆盖引线指及其电连接。 将凝胶分配到模具的顶表面上并覆盖芯片接合焊盘及其电连接。 盖子连接到引线框架并覆盖模具和凝胶，并且盖的侧面穿透密封剂。

公开(公告)号：US20120168884A1

公开(公告)日：2012-07-05

申请号：US13293119

申请日：2011-11-10

申请人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

发明人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

IPC分类号： H01L29/84 ,  H01L21/50

CPC分类号： H01L41/25 ,  G01L19/0069 ,  G01L19/147 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.

摘要翻译： 包装压力传感器管芯的方法包括提供引线框架，其具有围绕管芯焊盘的管芯焊盘和引线指。 带子附接到引线框架的第一侧。 压力传感器芯片在引线框架的第二侧附接到芯片焊盘，并且芯片的焊盘被连接到引线指。 将密封剂分配到引线框架的第二侧上并且覆盖引线指及其电连接。 将凝胶分配到模具的顶表面上并覆盖芯片接合焊盘及其电连接。 盖子连接到引线框架并覆盖模具和凝胶，并且盖的侧面穿透密封剂。

公开(公告)号：US08802474B1

公开(公告)日：2014-08-12

申请号：US14219011

申请日：2014-03-19

申请人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

发明人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

IPC分类号： H01L21/00 ,  H01L29/84 ,  H01L41/25

CPC分类号： H01L41/25 ,  G01L19/0069 ,  G01L19/147 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.

摘要翻译： 包装压力传感器管芯的方法包括提供引线框架，其具有围绕管芯焊盘的管芯焊盘和引线指。 带子附接到引线框架的第一侧。 压力传感器芯片在引线框架的第二侧附接到芯片焊盘，并且芯片的焊盘被连接到引线指。 将密封剂分配到引线框架的第二侧上并且覆盖引线指及其电连接。 将凝胶分配到模具的顶表面上并覆盖芯片接合焊盘及其电连接。 盖子连接到引线框架并覆盖模具和凝胶，并且盖的侧面穿透密封剂。

公开(公告)号：US08716846B2

公开(公告)日：2014-05-06

申请号：US13293119

申请日：2011-11-10

申请人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

发明人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

IPC分类号： H01L23/495

CPC分类号： H01L41/25 ,  G01L19/0069 ,  G01L19/147 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.

公开(公告)号：US20120139067A1

公开(公告)日：2012-06-07

申请号：US13246877

申请日：2011-09-28

申请人： WAI YEW LO ,  Lan Chu Tan ,  Jinzhong Yao

发明人： WAI YEW LO ,  Lan Chu Tan ,  Jinzhong Yao

IPC分类号： H01L21/50 ,  H01L29/84

CPC分类号： G01L19/147 ,  H01L24/97 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A method of packaging a pressure sensor die that does not use pre-molded lead frames. Instead a lead frame array is attached to a tape and a non-conductive material is deposited on the lead frames. The non-conductive material is cured and the tape is removed. Pressure sensor dies then are attached to respective die pads of the lead frames and electrically connected to lead frame leads with bond wires. A gel is dispensed onto a top surface of the pressure sensor dies and then a lid is attached to each of the lead frames to cover the pressure sensor dies. The lead frames are singulated to form individual pressure sensor packages.

摘要翻译： 包装不使用预成型引线框架的压力传感器模具的方法。 相反，引线框架阵列附着到带上，并且非导电材料沉积在引线框架上。 固化非导电材料并除去胶带。 然后将压力传感器模具连接到引线框架的相应的管芯焊盘，并用接合线电连接到引线框架引线。 将凝胶分配到压力传感器模具的顶表面上，然后将盖子附接到每个引线框架以覆盖压力传感器管芯。 引线框架被单独形成单独的压力传感器封装。

公开(公告)号：US20120306031A1

公开(公告)日：2012-12-06

申请号：US13118596

申请日：2011-05-31

申请人： Wai Yew Lo ,  Lan Chu Tan

发明人： Wai Yew Lo ,  Lan Chu Tan

IPC分类号： H01L29/84 ,  H01L21/54

CPC分类号： H01L21/561 ,  G01L19/0627 ,  G01L19/143 ,  G01L19/147 ,  H01L21/568 ,  H01L23/04 ,  H01L23/24 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83862 ,  H01L2224/83871 ,  H01L2224/85013 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor sensor die is packaged with a footed lid that has side walls and a top portion with a central hole. Gel material is dispensed into a cavity formed by the side walls such that it covers the die prior to attaching the lid top portion.

摘要翻译： 半导体传感器芯片包括具有侧壁的底盖和具有中心孔的顶部部分。 将凝胶材料分配到由侧壁形成的空腔中，使得其在附接盖顶部分之前覆盖模具。

公开(公告)号：US20150270206A1

公开(公告)日：2015-09-24

申请号：US14220121

申请日：2014-03-19

申请人： Wai Yew Lo ,  Lan Chu Tan

发明人： Wai Yew Lo ,  Lan Chu Tan

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  G01L9/00 ,  H01L25/16 ,  H01L21/56 ,  H01L23/053 ,  H01L23/48 ,  H01L23/16

CPC分类号： G01L9/00 ,  G01L17/00 ,  G01L19/147 ,  G01L19/148 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L25/165 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16055 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/1624 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48157 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/85005 ,  H01L2224/92163 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/143 ,  H01L2924/146 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014

摘要： A semiconductor pressure sensor device having a pressure-sensing die electrically connected to a microcontrol unit (MCU) using either through silicon vias (TSVs) or flip-chip bumps. An active surface of the pressure-sensing die is in facing relationship with the MCU. These embodiments avoid the need to used bonds to electrically connect the pressure-sensing die to the MCU, thereby saving time, reducing size, and reducing cost.

摘要翻译： 一种半导体压力传感器装置，其具有通过硅通孔（TSV）或倒装芯片凸块与微控制单元（MCU）电连接的压力感测管芯。 压敏传感芯片的有源表面与MCU面对关系。 这些实施例避免了使用键将电压连接到MCU的需要，从而节省时间，减小尺寸并降低成本。

公开(公告)号：US20150069537A1

公开(公告)日：2015-03-12

申请号：US14020840

申请日：2013-09-08

申请人： Wai Yew Lo ,  Stanley Job Doraisamy ,  Lan Chu Tan

发明人： Wai Yew Lo ,  Stanley Job Doraisamy ,  Lan Chu Tan

IPC分类号： B81B7/00 ,  H01L23/495 ,  B81C1/00

CPC分类号： H01L24/97 ,  G01L19/0069 ,  G01L19/0076 ,  G01L19/147 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49575 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor sensor device has a MCU die and an acceleration-sensing die mounted on a die paddle of a lead frame. The MCU die is connected to leads of the lead frame with first bond wires and the acceleration-sensing die is connected to the MCU die with second bond wires. An interposer is flip-chip mounted on a top surface of the MCU die. The MCU die, acceleration-sensing die and a portion of the interposer are covered with a molding compound. A pre-packaged pressure sensor is flip-chip mounted on a top, exposed surface of the interposer. The interposer provides electrical connection between the pre-packaged pressure sensor and the MCU die.

摘要翻译： 半导体传感器装置具有安装在引线框的芯片上的MCU裸片和加速度感测芯片。 MCU芯​​片通过第一接合线连接到引线框架的引线，加速度传感管芯通过第二接合线连接到MCU管芯。 插入器倒装芯片安装在MCU裸片的顶表面上。 MCU模具，加速度感测模具和插入件的一部分被模塑料覆盖。 预封装的压力传感器被倒装安装在插入件的顶部暴露表面上。 插入器提供预包装压力传感器和MCU管芯之间的电气连接。

公开(公告)号：US20120139063A1

公开(公告)日：2012-06-07

申请号：US12960571

申请日：2010-12-06

申请人： Wai Yew Lo ,  Lan Chu Tan

发明人： Wai Yew Lo ,  Lan Chu Tan

IPC分类号： H01L29/84 ,  H01L21/04

CPC分类号： H01L24/97 ,  G01L19/0069 ,  G01L19/147 ,  H01L24/73 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of packaging a pressure sensing die includes providing a lead frame with lead fingers and attaching the pressure sensing die to the lead fingers such that bond pads of the die are electrically coupled to the lead fingers and a void is formed between the die and the lead fingers. A gel material is dispensed via an underside of the lead frame into the void such that the gel material substantially fills the void. The gel material is then cured and the die and the lead frame are encapsulated with a mold compound. The finished package does not include a metal lid.

摘要翻译： 一种包装压力传感管芯的方法包括提供具有引线指状物的引线框架并将压力感测裸片连接到引线指，使得管芯的接合焊盘电连接到引线指，并且在管芯和管芯之间形成空隙 铅笔指 凝胶材料通过引线框架的下侧分配到空隙中，使得凝胶材料基本上填充空隙。 然后将凝胶材料固化，并将模具和引线框架用模具化合物包封。 成品包装不包括金属盖。

公开(公告)号：US20120073859A1

公开(公告)日：2012-03-29

申请号：US12889428

申请日：2010-09-24

申请人： Wai Yew Lo ,  Yit Meng Lee ,  Lan Chu Tan

发明人： Wai Yew Lo ,  Yit Meng Lee ,  Lan Chu Tan

IPC分类号： H01B5/14 ,  B05D5/12 ,  H01B13/00 ,  C25D5/54

CPC分类号： H01L24/745 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/4519 ,  H01L2224/45193 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/745 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

摘要： A wire capable of conducting electrical current has a polymer core and a coating layer surrounding the core. The coating layer, which may be, for example, gold or copper, conducts electrical current and the core provides strength so that the wire is able to withstand bending and breakage. Among other things, the polymer core wire is useful for connecting an integrated circuit to a lead frame or substrate.

摘要翻译： 能够导电的线具有聚合物芯和围绕芯的涂层。 可以是例如金或铜的涂层传导电流，并且芯提供强度，使得电线能够承受弯曲和断裂。 其中，聚合物芯线可用于将集成电路连接到引线框架或基板。