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21.发明申请公开(公告)号：US20090039484A1
公开(公告)日：2009-02-12
申请号：US11834262
申请日：2007-08-06
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49562 , H01L23/49524 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/50 , H01L24/83 , H01L24/84 , H01L24/86 , H01L2224/06181 , H01L2224/29 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29298 , H01L2224/32245 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/37599 , H01L2224/37647 , H01L2224/40095 , H01L2224/40245 , H01L2224/45124 , H01L2224/83801 , H01L2224/8381 , H01L2224/83825 , H01L2224/8384 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/0781 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/0105 , H01L2924/01049 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/48 , H01L2924/00012
摘要： A semiconductor chip has at least one first contact and one second contact on its top side and has connecting elements which are arranged jointly on a structure element and which connect the first contact and the second contact of the top side of the semiconductor chip to the external contacts.
摘要翻译： 半导体芯片在其顶侧具有至少一个第一接触和一个第二触点，并具有连接在结构元件上的连接元件，并且将半导体芯片的顶侧的第一触点和第二触点连接到外部 联系人
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22.发明授权Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same 有权包括与聚合物芯的倒装芯片接触的半导体部件及其制造方法公开(公告)号：US07462940B2
公开(公告)日：2008-12-09
申请号：US11620784
申请日：2007-01-08
IPC分类号： H01L23/50 , H01L23/48 , H01L23/498 , H01L21/00
CPC分类号： H01L23/3192 , H01L21/563 , H01L24/10 , H01L24/13 , H01L2224/05571 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/13561 , H01L2224/16 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H01L2224/16225 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor component includes flip-chip contacts arranged on a wiring structure of a semiconductor chip. The wiring structure includes at least one metallization layer and at least one dielectric insulation layer made of a low-k material with a relative permittivity εr lower than the relative permittivity of a silicon dioxide. The flip-chip contacts are arranged on contact areas of an upper metallization layer and have a polymer core surrounded by a lead-free solder sheath.
摘要翻译： 半导体元件包括布置在半导体芯片的布线结构上的倒装芯片触点。 所述布线结构包括至少一个金属化层和至少一个介电绝缘层，所述介电绝缘层由相对介电常数ε低于二氧化硅的相对介电常数ε的低k材料制成。 倒装芯片触点布置在上金属化层的接触区域上，并且具有由无铅焊接护套包围的聚合物芯。
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23.发明授权公开(公告)号：US07384698B2
公开(公告)日：2008-06-10
申请号：US10986372
申请日：2004-11-12
申请人： Edmund Riedl , Wolfgang Schober
发明人： Edmund Riedl , Wolfgang Schober
CPC分类号： H01L21/4871 , C23C8/80 , H01L21/31683 , H01L21/76801 , H01L21/76838 , H01L21/76888 , H01L23/142 , H01L23/3142 , H01L23/49503 , H01L23/498 , H01L23/528 , H01L24/11 , H01L2224/13099 , H01L2924/01004 , H01L2924/01006 , H01L2924/0101 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01052 , H01L2924/01068 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/09701 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , H05K3/385 , H05K2201/0116 , H05K2203/0315 , H05K2203/1157 , Y10T428/12472 , Y10T428/12479 , Y10T428/12993 , Y10T428/249953 , H01L2924/00
摘要： A metal article intended for at least partially coating with a substance, which includes a metal solder, a plastic, a glass, or a ceramic. The metal article itself may include, in particular, connecting, supporting, or conducting components for an electronic component. The metal article has macroscopically smooth surface portions and a multiplicity of multiply curved nanopores in the region of at least one surface portion.
摘要翻译： 用于至少部分地涂覆物质的金属制品，其包括金属焊料，塑料，玻璃或陶瓷。 金属制品本身可以包括用于电子部件的连接，支撑或导电部件。 金属制品在至少一个表面部分的区域中具有宏观光滑的表面部分和多个多重弯曲的纳米孔。
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公开(公告)号：US20080122075A1
公开(公告)日：2008-05-29
申请号：US11612758
申请日：2006-12-19
CPC分类号： H01L23/5385 , H01L23/49531 , H01L23/49575 , H01L23/49811 , H01L24/48 , H01L25/162 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/48699 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor module includes a module package including a first substrate having a first semiconductor device and a second substrate having a second semiconductor device. A first outer conductor extends from the module package and is connected to the first substrate and a second outer conductor extends from the module package and is connected to the second substrate. A method for producing the semiconductor module includes attaching first outer conductors of a leadframe to a first substrate, where the first substrate includes a first semiconductor device that is attached to the first substrate either before or after attaching the first outer conductors, A second substrate is provided including a signal processing circuit and the second substrate is fastening to second outer conductors of the leadframe.
摘要翻译： 半导体模块包括：模块封装，包括具有第一半导体器件的第一衬底和具有第二半导体器件的第二衬底。 第一外导体从模块封装延伸并连接到第一基板，第二外导体从模块封装延伸并连接到第二基板。 一种半导体模块的制造方法，其特征在于，将引线框架的第一外导体附接到第一基板，第一基板包括在安装第一外导体之前或之后附接到第一基板的第一半导体装置，第二基板 提供包括信号处理电路，并且第二基板紧固到引线框架的第二外导体。
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25.发明申请公开(公告)号：US20070205518A1
公开(公告)日：2007-09-06
申请号：US11692322
申请日：2007-03-28
申请人： Michael Bauer , Alfred Haimerl , Khalil Hosseini , Angela Kessler , Joachim Mahler , Wolfgang Schober
发明人： Michael Bauer , Alfred Haimerl , Khalil Hosseini , Angela Kessler , Joachim Mahler , Wolfgang Schober
IPC分类号： H01L23/52
CPC分类号： H01L23/3142 , B82Y10/00 , H01L23/49586 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01033 , H01L2924/01042 , H01L2924/01055 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/351 , Y10S977/742 , Y10S977/785 , Y10S977/831 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A layer improves adhesion between interfaces of different components in semiconductor devices. The interface of a first component includes surfaces of a circuit carrier and the interface of a second component includes contact surfaces of a plastic package molding compound. The adhesion-improving layer includes a mixture of polymeric chain molecules and carbon nanotubes.
摘要翻译： 一层改善了半导体器件中不同部件的界面之间的粘附。 第一部件的界面包括电路载体的表面，第二部件的界面包括塑料封装模塑料的接触表面。 粘附改善层包括聚合链分子和碳纳米管的混合物。
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26.发明申请Power semiconductor device in lead frame technology with a vertical current path 有权功率半导体器件在引线框架技术中具有垂直电流通路公开(公告)号：US20070085201A1
公开(公告)日：2007-04-19
申请号：US11581678
申请日：2006-10-16
IPC分类号： H01L23/34
CPC分类号： H01L23/49562 , H01L23/49524 , H01L24/36 , H01L24/40 , H01L24/48 , H01L2224/0603 , H01L2224/32245 , H01L2224/40095 , H01L2224/40245 , H01L2224/48247 , H01L2224/73221 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12043 , H01L2924/13055 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： One aspect of the invention relates to a power semiconductor device in lead frame technology and a method for producing the same. The power semiconductor device has a vertical current path through a power semiconductor chip. The power semiconductor chip has at least one large-area electrode on its top side and a large-area electrode on its rear side. The rear side electrode is surface-mounted on a lead frame chip island of a lead frame and the top side electrode is electrically connected to an internal lead of the lead frame via a connecting element. The connecting element has an electrically conductive film on a surface facing the top side electrode, the electrically conductive film extending from the top side electrode to the internal lead.
摘要翻译： 本发明的一个方面涉及引线框技术中的功率半导体器件及其制造方法。 功率半导体器件具有穿过功率半导体芯片的垂直电流路径。 功率半导体芯片在其顶侧具有至少一个大面积电极，在其后侧具有大面积电极。 背面电极被表面安装在引线框架的引线框架芯片岛上，并且顶侧电极经由连接元件电连接到引线框架的内部引线。 连接元件在面向顶侧电极的表面上具有导电膜，导电膜从顶侧电极延伸到内部引线。
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27.发明申请公开(公告)号：US20050133910A1
公开(公告)日：2005-06-23
申请号：US10986372
申请日：2004-11-12
申请人： Edmund Riedl , Wolfgang Schober
发明人： Edmund Riedl , Wolfgang Schober
IPC分类号： C23C8/80 , H01L21/316 , H01L21/48 , H01L21/60 , H01L21/768 , H01L23/14 , H01L23/31 , H01L23/495 , H01L23/498 , H01L23/528 , H05K3/38 , B32B15/04
CPC分类号： H01L21/4871 , C23C8/80 , H01L21/31683 , H01L21/76801 , H01L21/76838 , H01L21/76888 , H01L23/142 , H01L23/3142 , H01L23/49503 , H01L23/498 , H01L23/528 , H01L24/11 , H01L2224/13099 , H01L2924/01004 , H01L2924/01006 , H01L2924/0101 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01052 , H01L2924/01068 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/09701 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , H05K3/385 , H05K2201/0116 , H05K2203/0315 , H05K2203/1157 , Y10T428/12472 , Y10T428/12479 , Y10T428/12993 , Y10T428/249953 , H01L2924/00
摘要： A metal article intended for at least partially coating with a substance, which includes a metal solder, a plastic, a glass, or a ceramic. The metal article itself may include, in particular, connecting, supporting, or conducting components for an electronic component. The metal article has macroscopically smooth surface portions and a multiplicity of multiply curved nanopores in the region of at least one surface portion.
摘要翻译： 用于至少部分地涂覆物质的金属制品，其包括金属焊料，塑料，玻璃或陶瓷。 金属制品本身可以包括用于电子部件的连接，支撑或导电部件。 金属制品在至少一个表面部分的区域中具有宏观光滑的表面部分和多个多重弯曲的纳米孔。
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公开(公告)号：US08440733B2
公开(公告)日：2013-05-14
申请号：US13461202
申请日：2012-05-01
IPC分类号： C08J9/00
CPC分类号： H01L23/49894 , H01L21/56 , H01L23/293 , H01L23/3142 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/00014 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/12044 , H01L2924/181 , H01L2924/19041 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor component and method for production of a semiconductor component. The invention relates to a semiconductor component having a semiconductor chip, which is arranged on a substrate, in one embodiment on a chip carrier, and an encapsulation material, which at least partially surrounds the semiconductor chip. The chip carrier is at least partly provided with a layer of polymer foam.
摘要翻译： 半导体元件的制造方法及半导体元件的制造方法。 本发明涉及一种具有半导体芯片的半导体元件，该半导体元件布置在基板上，在一个实施例中在芯片载体上，以及至少部分地围绕半导体芯片的封装材料。 芯片载体至少部分地设置有聚合物泡沫层。
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29.发明授权Method for producing a metal article intended for at least partially coating with a substance 有权用于制造用于至少部分涂覆物质的金属制品的方法公开(公告)号：US08147621B2
公开(公告)日：2012-04-03
申请号：US12107374
申请日：2008-04-22
申请人： Edmund Riedl , Wolfgang Schober
发明人： Edmund Riedl , Wolfgang Schober
CPC分类号： H01L21/4871 , C23C8/80 , H01L21/31683 , H01L21/76801 , H01L21/76838 , H01L21/76888 , H01L23/142 , H01L23/3142 , H01L23/49503 , H01L23/498 , H01L23/528 , H01L24/11 , H01L2224/13099 , H01L2924/01004 , H01L2924/01006 , H01L2924/0101 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01052 , H01L2924/01068 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/09701 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , H05K3/385 , H05K2201/0116 , H05K2203/0315 , H05K2203/1157 , Y10T428/12472 , Y10T428/12479 , Y10T428/12993 , Y10T428/249953 , H01L2924/00
摘要： A method of producing a metal article intended for at least partially coating with a substance, which includes a metal solder, a plastic, a glass, or a ceramic. The metal article itself may include, in particular, connecting, supporting, or conducting components for an electronic component. The metal article has macroscopically smooth surface portions and a plurality of multiply curved nanopores in the region of at least one surface portion.
摘要翻译： 一种制造用于至少部分地涂覆物质的金属制品的方法，其包括金属焊料，塑料，玻璃或陶瓷。 金属制品本身可以包括用于电子部件的连接，支撑或导电部件。 金属制品在至少一个表面部分的区域中具有宏观光滑的表面部分和多个多次弯曲的纳米孔。
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30.发明授权Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite 有权将热塑性材料接合到热固性材料和热塑性热固性复合材料的方法公开(公告)号：US07645642B2
公开(公告)日：2010-01-12
申请号：US11348542
申请日：2006-02-07
IPC分类号： H01L21/00 , H01B1/24 , H01B1/06 , C08F290/14
CPC分类号： C08J5/121 , B29C65/3412 , B29C65/3484 , B29C66/54 , B29C66/71 , B29C66/731 , B29C66/73113 , B29C66/7315 , B29C66/7392 , B29C66/7394 , B29C66/91411 , B29C66/919 , B29K2063/00 , B29K2067/00 , B29K2071/00 , B29K2081/06 , B29K2083/00 , B29K2101/10 , B29K2101/12 , B29K2105/0079 , B29K2105/16 , B29K2309/08 , B29L2031/3061 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/00014 , H01L2924/00 , B29K2067/003 , B29K2081/04
摘要： A method of joining a thermoplastic material to a thermoset material, and a resultant thermoplastic-thermoset composite formed from such method are provided. At least one of the thermoplastic material and the thermoset material includes particles that melt when the thermoplastic material and the thermoset material are heated during the joining operation. The particles further produce a solid bond between the materials after the particles have solidified in the course of cooling after the joining operation.
摘要翻译： 提供了一种将热塑性材料接合到热固性材料的方法，以及由这种方法形成的所得的热塑性热固性复合材料。 热塑性材料和热固性材料中的至少一种包括当在接合操作期间热塑性材料和热固性材料被加热时熔化的颗粒。 颗粒在接合操作后的冷却过程中固化后，颗粒进一步在材料之间产生固态结合。
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