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    LIGHT-EMITTING DIODES, LIGHT-EMITTING DIODE ARRAYS AND RELATED DEVICES
    21.
    发明申请
    LIGHT-EMITTING DIODES, LIGHT-EMITTING DIODE ARRAYS AND RELATED DEVICES 审中-公开

    公开(公告)号：US20200075813A1

    公开(公告)日：2020-03-05

    申请号：US16118779

    申请日：2018-08-31

    Applicant: Cree, Inc.

    Inventor： Sung Chul Joo ,  Kenneth M. Davis ,  David Suich ,  Jae-Hyung Park ,  Arthur F. Pun

    IPC: H01L33/50 ,  H01L33/10 ,  H01L33/36 ,  H01L33/62

    Abstract: Light-emitting diodes (LEDs), LED arrays, and related devices are disclosed. An LED device includes a first LED chip and a second LED chip mounted on a submount with a light-altering material in between. The light-altering material may include at least one of a light-reflective material and/or a light-absorbing material. Individual wavelength conversion elements may be arranged on each of the first and second LED chips. The light-altering material may improve the contrast between the first and second LED chips as well as between the individual wavelength conversion elements. LED devices may include submounts in modular configurations where LED chips may be mounted on adjacent submounts to form an LED array. Each LED chip of the LED array may be laterally separated from at least one other LED chip by a same distance and a light-altering material may be arranged around the LED array.

    LIGHT EMITTER COMPONENTS, SYSTEMS, AND RELATED METHODS
    22.
    发明申请
    LIGHT EMITTER COMPONENTS, SYSTEMS, AND RELATED METHODS 有权
    发光元件，系统和相关方法

    公开(公告)号：US20140268728A1

    公开(公告)日：2014-09-18

    申请号：US13838654

    申请日：2013-03-15

    Applicant: CREE, INC.

    Inventor： Christopher P. Hussell ,  Sung Chul Joo ,  Erin Welch ,  Peter Scott Andrews ,  Joseph G. Clark ,  John A. Edmond ,  Jesse C. Reiherzer

    IPC: F21K99/00

    CPC classification number: F21K9/90 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects.

    Abstract translation: 公开了具有改善的光学效率和较低制造成本的光发射器部件，系统和相关方法。 在一个方面，光发射器部件可以包括具有细长主体和第一和第二端的基板。 可以在衬底上提供至少第一迹线和第二迹线。 在一些方面，第一迹线可以设置在基板的第一端附近，并且第二迹线可以设置在基板的第二端附近，而第一迹线或第二迹线的其它部分没有设置在第一和第二迹线之间 基片的端部。 在一些方面，可以在衬底上提供一串LED芯片。 LED芯片串可以设置在基板的第一和第二端之间。 在某些方面也可以提供角度曲线，间隙和光发射器部件。

    LIGHT EMITTING DEVICE PACKAGES WITH IMPROVED HEAT TRANSFER
    24.
    发明申请
    LIGHT EMITTING DEVICE PACKAGES WITH IMPROVED HEAT TRANSFER 审中-公开
    具有改进的热传递的发光装置包装

    公开(公告)号：US20140159088A1

    公开(公告)日：2014-06-12

    申请号：US14094341

    申请日：2013-12-02

    Applicant: Cree, Inc.

    Inventor： Christopher P. Hussell ,  Sung Chul Joo

    IPC: H01L33/64 ,  H01L33/60

    CPC classification number: H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/09701 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: Packages containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed. In one embodiment, LED package can include a thermal element having improved solder reliability to improve heat dissipation capacity of the LED package. LED package can include a molded plastic body having one or more LEDs attached to one or more electrical elements. The LEDs can be connected to an upper surface of the thermal element. The thermal element can include a bottom surface which can extend further away in distance from a body of the LED package than a bottom surface of the electrical element. This configuration can result in an improved connection between the LED package and an external circuitry source, thereby increasing heat transfer ability of the LED package.

    Abstract translation: 公开了包含一个或多个发光器件（例如发光二极管（LED））的封装。 在一个实施例中，LED封装可以包括具有改进的焊料可靠性以提高LED封装的散热能力的热元件。 LED封装可以包括具有连接到一个或多个电气元件的一个或多个LED的模制塑料体。 LED可以连接到热元件的上表面。 热元件可以包括底表面，该底表面可以远离电气元件的底部表面延伸远离LED封装体。 该配置可以改善LED封装和外部电路源之间的连接，从而增加LED封装的传热能力。

    Systems and Processes for Increasing Semiconductor Device Reliability
    25.
    发明申请
    Systems and Processes for Increasing Semiconductor Device Reliability 有权

    公开(公告)号：US20210111144A1

    公开(公告)日：2021-04-15

    申请号：US16597224

    申请日：2019-10-09

    Applicant: Cree, Inc.

    Inventor： Sung Chul Joo ,  Jack Powell ,  Donald Farrell ,  Bradley Millon

    IPC: H01L23/00 ,  H01L23/66 ,  H01P3/00 ,  H01P11/00

    Abstract: A system configured to increase a reliability of electrical connections in a device. The system including a lead configured to electrically connect a pad of at least one support structure to a pad of at least one electrical component. The lead includes an upper portion that includes a lower surface arranged on a lower surface thereof. The lower surface of the upper portion is arranged vertically above a first upper surface of a first pad connection portion; and the lower surface of the upper portion is arranged vertically above a second upper surface of the second pad connection portion. A process configured to increase a reliability of electrical connections in a device is also disclosed.

    Robust Electronics Mounting Device
    26.
    发明申请
    Robust Electronics Mounting Device 审中-公开

    公开(公告)号：US20200321268A1

    公开(公告)日：2020-10-08

    申请号：US16909334

    申请日：2020-06-23

    Applicant: Cree, Inc.

    Inventor： Sung Chul Joo ,  Bradley Millon ,  Erwin Cohen

    IPC: H01L23/495 ,  H01L23/31 ,  H01L23/34 ,  H01L23/60

    Abstract: A device comprises a base, a die, leads, and an electrically-insulating die housing covering the die. The base comprises a die mounting section in which the die is mounted. The leads extend away from the die mounting section and are electrically connected to the die. The base further comprises a base mounting section and a recessed section. The recessed section comprises a recess between the die mounting section and the base mounting section. The base further comprises a first side, a second side opposing the first side, and a thickness measured between the first and second sides. The thickness of the base throughout the recessed section is less than the thickness of the base throughout the base mounting section. The base further comprises an opening extending at least through the base mounting section from the first side to the second side.

    SUBMOUNT BASED LIGHT EMITTER COMPONENTS AND METHODS
    30.
    发明申请
    SUBMOUNT BASED LIGHT EMITTER COMPONENTS AND METHODS 有权
    基于子系统的发光元件和方法

    公开(公告)号：US20150349218A1

    公开(公告)日：2015-12-03

    申请号：US14292331

    申请日：2014-05-30

    Applicant: Cree, Inc.

    Inventor： Jesse Colin Reiherzer ,  Sung Chul Joo

    IPC: H01L33/56 ,  H01L33/50 ,  H01L33/60 ,  H01L27/15 ,  H01L33/48 ,  H01L33/62

    CPC classification number: H01L33/56 ,  H01L24/97 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/15 ,  H01L33/486 ,  H01L33/507 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: Submount based light emitter components and related methods are disclosed. In some aspects, light emitter components include a ceramic submount, at least a first pair of electrical traces disposed on a first side of the submount, at least a first pair of electrical contacts disposed on a second side of the submount, at least one light emitter chip disposed on the first side of the submount, and a non-ceramic reflector disposed about the at least one light emitter chip. The first pair of electrical contacts is configured to electrical communicate with the first pair of electrical traces. The at least one chip is configured to electrically communicate with the first pair of electrical traces. At least a portion of the reflector is configured to conceal a portion of each trace of the first pair of electrical traces.

    Abstract translation: 公开了基于底座的光发射器部件和相关方法。 在一些方面，光发射器部件包括陶瓷基座，至少第一对电迹线布置在基座的第一侧上，至少第一对电触点设置在基座的第二侧上，至少一个光 设置在所述基座的第一侧上的发射极芯片和设置在所述至少一个发光芯片周围的非陶瓷反射器。 第一对电触点被配置为与第一对电迹线电连通。 至少一个芯片被配置为与第一对电迹线电连通。 反射器的至少一部分被配置为隐藏第一对电迹线的每个迹线的一部分。

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