公开(公告)号：US20110097893A1

公开(公告)日：2011-04-28

申请号：US12983967

申请日：2011-01-04

申请人： Shin-Puu Jeng ,  Clinton Chao ,  Szu Wei Lu

发明人： Shin-Puu Jeng ,  Clinton Chao ,  Szu Wei Lu

IPC分类号： H01L21/31 ,  H01L21/768

CPC分类号： H01L23/562 ,  H01L21/02123 ,  H01L21/02274 ,  H01L21/02282 ,  H01L21/302 ,  H01L21/314 ,  H01L21/316 ,  H01L21/3185 ,  H01L21/563 ,  H01L21/78 ,  H01L23/52 ,  H01L23/585 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Warpage and breakage of integrated circuit substrates is reduced by compensating for the stress imposed on the substrate by thin films formed on a surface of the substrate. Particularly advantageous for substrates having a thickness substantially less than about 150 μm, a stress-tuning layer is formed on a surface of the substrate to substantially offset or balance stress in the substrate which would otherwise cause the substrate to bend. The substrate includes a plurality of bonding pads on a first surface for electrical connection to other component.

摘要翻译： 通过在衬底的表面上形成的薄膜补偿施加在衬底上的应力来减小集成电路衬底的翘曲和断裂。 对于厚度基本上小于约150μm的衬底特别有利的是，在衬底的表面上形成应力调节层，以基本上抵消或平衡衬底中的应力，否则会使衬底弯曲。 衬底包括在第一表面上的多个接合焊盘，用于与其它部件电连接。

公开(公告)号：US07880278B2

公开(公告)日：2011-02-01

申请号：US11435436

申请日：2006-05-16

申请人： Shin-Puu Jeng ,  Clinton Chao ,  Szu Wei Lu

发明人： Shin-Puu Jeng ,  Clinton Chao ,  Szu Wei Lu

IPC分类号： H01L23/495

CPC分类号： H01L23/562 ,  H01L21/02123 ,  H01L21/02274 ,  H01L21/02282 ,  H01L21/302 ,  H01L21/314 ,  H01L21/316 ,  H01L21/3185 ,  H01L21/563 ,  H01L21/78 ,  H01L23/52 ,  H01L23/585 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Warpage and breakage of integrated circuit substrates is reduced by compensating for the stress imposed on the substrate by thin films formed on a surface of the substrate. Particularly advantageous for substrates having a thickness substantially less than about 150 μm, a stress-tuning layer is formed on a surface of the substrate to substantially offset or balance stress in the substrate which would otherwise cause the substrate to bend. The substrate includes a plurality of bonding pads on a first surface for electrical connection to other component.

摘要翻译： 通过在衬底的表面上形成的薄膜补偿施加在衬底上的应力来减小集成电路衬底的翘曲和断裂。 对于厚度基本上小于约150μm的衬底特别有利的是，在衬底的表面上形成应力调节层，以基本上抵消或平衡衬底中的应力，否则会使衬底弯曲。 衬底包括在第一表面上的多个接合焊盘，用于与其它部件电连接。

公开(公告)号：US08580683B2

公开(公告)日：2013-11-12

申请号：US13246556

申请日：2011-09-27

申请人： Chung Yu Wang ,  Chih-Wei Wu ,  Szu Wei Lu ,  Jing-Cheng Lin

发明人： Chung Yu Wang ,  Chih-Wei Wu ,  Szu Wei Lu ,  Jing-Cheng Lin

IPC分类号： H01L23/28

CPC分类号： H01L21/78 ,  H01L21/561 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/13111 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01029

摘要： Methods and apparatus for performing molding on die on wafer interposers. A method includes receiving an interposer assembly having a die side and an opposite side including two or more integrated circuit dies mounted on the die side of the interposer, the interposer assembly having spaces formed on the die side of the interposer between the two or more integrated circuit dies; mounting at least one stress relief feature on the die side of the interposer assembly in one of the spaces between the two or more integrated circuit dies; and molding the integrated circuit dies using a mold compound, the mold compound surrounding the two or more integrated circuit dies and the at least one stress relief feature. An apparatus is disclosed having integrated circuits mounted on a die side of an interposer, stress relief features between the integrated circuits and mold compound over the integrated circuits.

摘要翻译： 用于在晶片插入件上的模具上进行模制的方法和装置。 一种方法包括接收具有管芯侧面和相对侧的插入件组件，所述插入件组件包括安装在所述插入件的裸片侧上的两个或多个集成电路管芯，所述插入器组件具有形成在所述插入件的裸片侧上的两个或更多个集成 电路模具; 在所述两个或更多个集成电路管芯之间的空间之一中在所述插入器组件的管芯侧上安装至少一个应力释放特征; 以及使用模具化合物模制所述集成电路模具，围绕所述两个或更多个集成电路管芯的所述模具化合物以及所述至少一个应力释放特征。 公开了一种装置，其集成电路安装在插入件的裸片侧，集成电路之间的应力消除特征和集成电路上的模具化合物。

公开(公告)号：US20130249532A1

公开(公告)日：2013-09-26

申请号：US13429054

申请日：2012-03-23

申请人： Jing-Cheng Lin ,  Szu Wei Lu

发明人： Jing-Cheng Lin ,  Szu Wei Lu

IPC分类号： G01R1/06 ,  H01L23/48

CPC分类号： H01L25/0655 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/14 ,  H01L23/3157 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/11 ,  H01L2224/11002 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/81895 ,  H01L2224/83 ,  H01L2224/83104 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06596 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/00

摘要： A method includes bonding a first package component on a first surface of a second package component, and probing the first package component and the second package component from a second surface of the second package component. The step of probing is performed by probing through connectors on the second surface of the second package component. The connectors are coupled to the first package component. After the step of probing, a third package component is bonded on the first surface of the second package component.

公开(公告)号：US20130199577A1

公开(公告)日：2013-08-08

申请号：US13369138

申请日：2012-02-08

申请人： I-Ting Chen ,  Ying-Ching Shih ,  Szu Wei Lu ,  Jing-Cheng Lin

发明人： I-Ting Chen ,  Ying-Ching Shih ,  Szu Wei Lu ,  Jing-Cheng Lin

IPC分类号： B08B7/04 ,  B08B5/00 ,  B08B3/08 ,  B08B3/02 ,  B08B3/12

CPC分类号： H01L21/02041 ,  H01L21/4864 ,  H01L21/67028 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/81911 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2224/0401

摘要： A flux residue cleaning system includes first and second immersion chambers, first and second spray chambers, and a drying chamber. The first immersion chamber softens an outer region of a flux residue formed around microbumps interposed between a wafer and a die when the wafer is immersed in a first chemical. The first spray chamber removes the outer region of the flux residue when the wafer is impinged upon by a first chemical spray in order to expose an inner region of the flux residue. The second immersion chamber softens the inner region of the flux residue when the wafer is immersed in a second chemical. The second spray chamber removes the inner region of the flux residue when the wafer is impinged upon by a second chemical spray in order to clean the wafer to a predetermined standard. The drying chamber dries the wafer.

摘要翻译： 助焊剂残渣清洁系统包括第一和第二浸没室，第一和第二喷雾室以及干燥室。 当晶片浸入第一化学品中时，第一浸入室软化在介于晶片和管芯之间的微胶片周围形成的焊剂残余物的外部区域。 当晶片通过第一化学喷雾冲击以便暴露焊剂残余物的内部区域时，第一喷雾室除去焊剂残余物的外部区域。 当晶片浸入第二种化学品中时，第二浸入室软化助焊剂残余物的内部区域。 当晶片被第二化学喷雾冲击时，第二喷雾室去除焊剂残余物的内部区域，以便将晶​​片清洁至预定的标准。 干燥室干燥晶片。

公开(公告)号：US08501590B2

公开(公告)日：2013-08-06

申请号：US13176606

申请日：2011-07-05

申请人： Chung Yu Wang ,  Kung-Chen Yeh ,  Chih-Wei Wu ,  Szu Wei Lu ,  Jing-Cheng Lin

发明人： Chung Yu Wang ,  Kung-Chen Yeh ,  Chih-Wei Wu ,  Szu Wei Lu ,  Jing-Cheng Lin

IPC分类号： H01L21/78

CPC分类号： H01L23/58 ,  H01L21/486 ,  H01L21/673 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/147 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/97 ,  H01L25/0655 ,  H01L2221/68331 ,  H01L2221/68381 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： Methods and apparatus for performing dicing of die on wafer interposers. Methods are disclosed that include receiving an interposer assembly including one or more integrated circuit dies mounted on a die side of an interposer substrate and having scribe areas defined in spaces between the integrated circuit dies, the interposer having an opposite side for receiving external connectors; mounting the die side of the interposer assembly to a tape assembly, the tape assembly comprising an adhesive tape and preformed spacers disposed between and filling gaps between the integrated circuit dies; and sawing the interposer assembly by cutting the opposite side of the interposer in the scribe areas to make cuts through the interposer, the cuts separating the interposer into one or more die on wafer assemblies. Apparatuses are disclosed for use with the methods.

摘要翻译： 用于在晶片插入件上进行裸片切割的方法和装置。 公开了包括接收包括安装在插入器基板的裸片侧上的一个或多个集成电路管芯并且在集成电路管芯之间的空间中限定的划线区域的插入件组件的方法，所述插入器具有用于接收外部连接器的相对侧; 将所述插入器组件的模具侧安装到带组件上，所述带组件包括粘合带和设置在所述集成电路管芯之间的填充间隙之间的预成型间隔件; 以及通过在所述划线区域中切割所述插入件的相对侧来切割所述插入件组件，以切割所述插入件，所述切口将所述插入件分离成晶片组件上的一个或多个模具。 公开了与该方法一起使用的装置。

公开(公告)号：US09620430B2

公开(公告)日：2017-04-11

申请号：US13356173

申请日：2012-01-23

申请人： Szu Wei Lu ,  Ying-Da Wang ,  Li-Chung Kuo ,  Jing-Cheng Lin

发明人： Szu Wei Lu ,  Ying-Da Wang ,  Li-Chung Kuo ,  Jing-Cheng Lin

IPC分类号： H01L21/78 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L25/065 ,  H01L27/06

CPC分类号： H01L25/0655 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3135 ,  H01L23/3178 ,  H01L23/3185 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/11464 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92125 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/10156 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2924/00 ,  H01L2224/05552

摘要： A method includes bonding a first and a second package component on a top surface of a third package component, and dispensing a polymer. The polymer includes a first portion in a space between the first and the third package components, a second portion in a space between the second and the third package components, and a third portion in a gap between the first and the second package components. A curing step is then performed on the polymer. After the curing step, the third portion of the polymer is sawed to form a trench between the first and the second package components.

公开(公告)号：US08871568B2

公开(公告)日：2014-10-28

申请号：US13345485

申请日：2012-01-06

申请人： Ying-Ching Shih ,  Szu Wei Lu ,  Jing-Cheng Lin

发明人： Ying-Ching Shih ,  Szu Wei Lu ,  Jing-Cheng Lin

IPC分类号： H01L21/58 ,  H01L23/485 ,  H01L21/78

CPC分类号： H01L21/6835 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3185 ,  H01L23/49816 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/83

摘要： A method includes forming a dielectric layer over a substrate, forming an interconnect structure over the dielectric layer, and bonding a die to the interconnect structure. The substrate is then removed, and the dielectric layer is patterned. Connectors are formed at a surface of the dielectric layer, wherein the connectors are electrically coupled to the die.

摘要翻译： 一种方法包括在衬底上形成电介质层，在电介质层上形成互连结构，以及将管芯结合到互连结构。 然后去除衬底，并对电介质层进行图案化。 连接器形成在电介质层的表面，其中连接器电耦合到管芯。

公开(公告)号：US08828848B2

公开(公告)日：2014-09-09

申请号：US13328746

申请日：2011-12-16

申请人： Jing-Cheng Lin ,  Ying-Da Wang ,  Li-Chung Kuo ,  Szu Wei Lu

发明人： Jing-Cheng Lin ,  Ying-Da Wang ,  Li-Chung Kuo ,  Szu Wei Lu

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/94 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05552

摘要： A die having a ledge along a sidewall, and a method of forming the die, is provided. A method of packaging the die is also provided. A substrate, such as a processed wafer, is diced by forming a first notch having a first width, and then forming a second notch within the first notch such that the second notch has a second width less than the first width. The second notch extends through the substrate, thereby dicing the substrate. The difference in widths between the first width and the second width results in a ledge along the sidewalls of the dice. The dice may be placed on a substrate, e.g., an interposer, and underfill placed between the dice and the substrate. The ledge prevents or reduces the distance the underfill is drawn up between adjacent dice. A molding compound may be formed over the substrate.

摘要翻译： 提供具有沿侧壁的凸缘的模具和形成模具的方法。 还提供了一种包装模具的方法。 通过形成具有第一宽度的第一凹口，然后在第一凹口内形成第二凹槽，使得第二凹槽具有小于第一宽度的第二宽度，来切割诸如经处理晶片的基底。 第二凹口延伸穿过衬底，从而切割衬底。 第一宽度和第二宽度之间的宽度差导致沿着骰子的侧壁的凸缘。 骰子可以放置在基底上，例如插入物，以及放置在骰子和基底之间的底部填充物。 凸缘防止或减少底部填充物在相邻骰子之间的距离。 可以在基材上形成模塑料。

公开(公告)号：US20130187258A1

公开(公告)日：2013-07-25

申请号：US13356173

申请日：2012-01-23

申请人： Szu Wei Lu ,  Ying-Da Wang ,  Li-Chung Kuo ,  Jing-Cheng Lin

发明人： Szu Wei Lu ,  Ying-Da Wang ,  Li-Chung Kuo ,  Jing-Cheng Lin

IPC分类号： H01L27/06 ,  H01L21/78

CPC分类号： H01L25/0655 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3135 ,  H01L23/3178 ,  H01L23/3185 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/11464 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92125 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/10156 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2924/00 ,  H01L2224/05552

摘要： A method includes bonding a first and a second package component on a top surface of a third package component, and dispensing a polymer. The polymer includes a first portion in a space between the first and the third package components, a second portion in a space between the second and the third package components, and a third portion in a gap between the first and the second package components. A curing step is then performed on the polymer. After the curing step, the third portion of the polymer is sawed to form a trench between the first and the second package components.

摘要翻译： 一种方法包括将第一和第二包装部件接合在第三包装部件的顶表面上，并分配聚合物。 聚合物包括在第一和第三包装部件之间的空间中的第一部分，在第二和第三包装部件之间的空间中的第二部分和第一和第二包装部件之间的间隙中的第三部分。 然后在聚合物上进行固化步骤。 在固化步骤之后，将聚合物的第三部分锯切以在第一和第二包装部件之间形成沟槽。