公开(公告)号：US10062813B2

公开(公告)日：2018-08-28

申请号：US15306441

申请日：2015-04-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Siegfried Herrmann ,  Matthias Sperl

IPC: H01L33/48 ,  F21V8/00 ,  H01L33/58 ,  H01L33/60 ,  H01L27/02 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/0304 ,  H01L31/0352 ,  H01L31/18 ,  H01L33/00 ,  H01L33/06 ,  H01L33/30 ,  H01L33/32 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L33/486 ,  G02B6/0006 ,  G02B6/0028 ,  G02B6/0073 ,  H01L27/0248 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02322 ,  H01L31/02327 ,  H01L31/03046 ,  H01L31/03048 ,  H01L31/035236 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/06 ,  H01L33/30 ,  H01L33/32 ,  H01L33/502 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0091

Abstract: An optoelectronic component (100) comprises an optoelectronic semiconductor chip (10), a first contact area (31) and a second contact area (32), which is laterally offset with respect to the first contact area and is electrically insulated therefrom, and a housing element (40). The first contact area (31) is electrically conductively connected to the first semiconductor layer (21) and the second contact area (32) is electrically conductively connected to the second semiconductor layer (22) of the optoelectronic semiconductor chip. The first contact area (31) and the second contact area (32) project beyond the optoelectronic semiconductor chip laterally in each case. The housing element (40) is fixed to the first contact area (31) and the second contact area (32) in regions in which the first contact area (31) and the second contact area (32) project beyond the optoelectronic semiconductor chip laterally in each case. The housing element surrounds the optoelectronic semiconductor chip at least partly. A surface of the housing element that faces the optoelectronic semiconductor chip is embodied as reflective at least in partial regions. A wall of the housing element has a cutout (61).

公开(公告)号：US20180102348A1

公开(公告)日：2018-04-12

申请号：US15719810

申请日：2017-09-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger ,  Matthias Sperl

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L23/00

Abstract: An optoelectronic component includes a carrier, wherein a first optoelectronic semiconductor chip and a second optoelectronic semiconductor chip are arranged above a top side of the carrier, the optoelectronic semiconductor chips each include a top side, an underside situated opposite the top side, and side faces extending between the top side and the underside, the undersides of the optoelectronic semiconductor chips face the top side of the carrier, a first potting material is arranged above the top side of the carrier, the first potting material covering parts of the side faces of the first optoelectronic semiconductor chip, and a second potting material is arranged above the top side of the carrier, and the second potting material covering the first potting material.

公开(公告)号：US20180097156A1

公开(公告)日：2018-04-05

申请号：US15560140

申请日：2016-03-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Christian Leirer ,  Alexander Linkov ,  Matthias Sperl ,  Matthias Kiessling

IPC: H01L33/58 ,  H01L33/50 ,  H01L33/00

CPC classification number: H01L33/58 ,  H01L33/005 ,  H01L33/507

Abstract: An optoelectronic lighting device and a method for manufacturing an optoelectronic lighting device are disclosed. In an embodiment the device includes a carrier and a light-emitting diode arranged on the carrier having a light-emitting surface. The device further includes a microlens structure including a plurality of microlenses, wherein the microlens structure is arranged on the light-emitting surface of the diode and a conversion layer arranged on the microlens structure, wherein the light-emitting surface is configured to emit light, wherein the microlens structure images, at least in part, the light, and wherein the conversion layer converts the light.

公开(公告)号：US10886258B2

公开(公告)日：2021-01-05

申请号：US16197939

申请日：2018-11-21

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Reiner Windisch ,  Florian Bösl ,  Andreas Dobner ,  Matthias Sperl

IPC: H01L25/07 ,  H01L33/50 ,  H01L33/62 ,  H01L27/15 ,  H01L25/075 ,  F21K9/90 ,  F21V29/87 ,  F21Y115/10

Abstract: An LED filament includes semiconductor chips arranged on a top side of a radiation-transmissive carrier, and at least partly covered with a radiation-transmissive first layer, the first layer and an underside of the carrier are covered with a second layer, phosphor is provided in the second layer, the phosphor is configured to shift a wavelength of the radiation of the semiconductor chip, no phosphor or phosphor including less than 50% of the concentration of the phosphor of the second layer is provided in the first layer, the carrier is formed from a further first layer and a carrier layer having cutouts, the carrier layer is arranged on the further first layer, the semiconductor chips are arranged on the further first layer in the regional of the cutouts of the carrier layer, and the first layer and the further first layer are at least partially covered with the second layer.

公开(公告)号：US10854793B2

公开(公告)日：2020-12-01

申请号：US16098172

申请日：2017-05-10

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： David Racz ,  Matthias Sperl

IPC: H01L33/50 ,  H01L33/00 ,  H01L33/36 ,  H01L33/46 ,  H01L33/54 ,  H01L33/32 ,  H01L33/56

Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment a method includes providing at least one light-emitting semiconductor chip comprising a sapphire substrate and an epitaxially grown layer sequence, arranging the light-emitting semiconductor chip with a side facing away from the sapphire substrate on a carrier, detaching the sapphire substrate from the semiconductor chip, applying a converter element on a region of the semiconductor chip in which the sapphire substrate was detached, arranging the semiconductor chip on an auxiliary carrier so that the converter element faces the auxiliary carrier and detaching the carrier from the semiconductor chip.

公开(公告)号：US20190237593A1

公开(公告)日：2019-08-01

申请号：US16339582

申请日：2017-10-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Dirk Becker ,  Matthias Sperl

IPC: H01L31/0232 ,  H01L31/18 ,  H01L31/02 ,  H01L31/0203 ,  H01L25/16

CPC classification number: H01L31/02327 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/167 ,  H01L31/1876 ,  H01L33/62 ,  Y02P70/521

Abstract: A method of producing sensors includes providing a carrier plate; arranging semiconductor chips on the carrier plate, wherein the semiconductor chips include at least radiation-detecting semiconductor chips; providing radiation-transmissive optical elements on the carrier plate provided with the semiconductor chips, wherein a plurality of radiation-transmissive optical elements are provided jointly on the carrier plate provided with the semiconductor chips; and singulating the carrier plate provided with the semiconductor chips and the radiation-transmissive optical elements, thereby forming separate sensors including a section of the carrier plate, at least one radiation-detecting semiconductor chip and at least one radiation-transmissive optical element.

公开(公告)号：US10103296B2

公开(公告)日：2018-10-16

申请号：US15515766

申请日：2015-10-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Frank Singer ,  Britta Goeoetz ,  David Racz ,  Matthias Sperl

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/48 ,  H01L33/62 ,  H01L33/56

Abstract: A method for producing optoelectronic semiconductor devices and an optoelectronic semiconductor device are disclosed. In an embodiment, the method includes providing a plurality of semiconductor chips for producing electromagnetic radiation, arranging the plurality of semiconductor chips in a plane, forming a housing body composite, at least some regions of which are arranged between the semiconductor chips, forming a plurality of conversion elements, wherein each conversion element comprises a wavelength-converting conversion material and is arranged on one of the semiconductor chips, encapsulating the plurality of conversion elements at least on their lateral edges by an encapsulation material, and separating the housing body composite into a plurality of optoelectronic semiconductor components.

公开(公告)号：US20180123007A1

公开(公告)日：2018-05-03

申请号：US15565112

申请日：2016-04-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Sperl ,  Frank Singer ,  Jürgen Moosburger

IPC: H01L33/62 ,  H01L33/64

CPC classification number: H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/647 ,  H01L2933/0075

Abstract: A radiation-emitting semiconductor component and a method for producing a plurality of semiconductor components are disclosed. In an embodiment the component includes a semiconductor chip comprising a semiconductor layer sequence, a front side and a rear side opposite the front side, and a molded body molded on to the semiconductor chip at least in some places. The component further includes a thermal connector located on a rear side of the semiconductor component, wherein the rear side of the semiconductor component is opposite the front side of the semiconductor chip, wherein the thermal connector extends to the rear side of the semiconductor chip, wherein at least one electrical connection surface is located on the front side of the semiconductor chip, and wherein the at least one electrical connection surface is electrically-conductively connected to an electrical contact surface of the semiconductor component via a contact path running on the molded body.

公开(公告)号：US09876155B2

公开(公告)日：2018-01-23

申请号：US15524114

申请日：2015-11-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Frank Singer ,  Jürgen Moosburger ,  Matthias Sabathil ,  Matthias Sperl ,  Björn Hoxhold

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/005 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/60 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: An optoelectronic component includes a composite body including a molded body; and an optoelectronic semiconductor chip embedded into the molded body, wherein the optoelectronic semiconductor chip includes a first electrical contact on its top side, a first top side metallization is arranged on the top side of the composite body and electrically conductively connects the first electrical contact to the through contact, a second top side metallization is arranged on the top side of the composite body and electrically insulated with respect to the first top side metallization, the second top side metallization completely delimits a part of the top side of the optoelectronic semiconductor chip, and a wavelength-converting material is arranged in a region completely delimited by the second top side metallization on the top side of the composite body, the wavelength-converting material extending as far as the second top side metallization.

公开(公告)号：US09876148B2

公开(公告)日：2018-01-23

申请号：US15502188

申请日：2015-08-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger ,  Matthias Sperl

IPC: H01L21/00 ,  H01L33/48 ,  H01L33/00 ,  H01L33/54 ,  H01L33/62 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L33/486 ,  H01L21/568 ,  H01L24/96 ,  H01L33/0095 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2224/24 ,  H01L2224/82 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1815 ,  H01L2933/0033

Abstract: An electronic component, an optoelectronic component, a component arrangement, and a method for producing an electronic component are disclosed. In an embodiment, the method includes forming a sacrificial structure on a top side of a carrier by a photolithographic process from a photoresist layer, arranging an electronic semiconductor chip on the carrier after exposing the photoresist layer, molding a molded body around the sacrificial structure and around the electronic semiconductor chip such that a surface of the electronic semiconductor chip is at least partly not covered by the molded body, detaching the molded body from the carrier and removing the sacrificial structure, wherein removing the sacrificial structure results in a cutout being formed in the molded body.