公开(公告)号：US6150726A

公开(公告)日：2000-11-21

申请号：US88834

申请日：1998-06-02

申请人： Natalie Barbara Feilchenfeld ,  Stephen Joseph Fuerniss ,  Michael Anthony Gaynes ,  Mark Vincent Pierson ,  Pat Hoontrakul

发明人： Natalie Barbara Feilchenfeld ,  Stephen Joseph Fuerniss ,  Michael Anthony Gaynes ,  Mark Vincent Pierson ,  Pat Hoontrakul

IPC分类号： G03F7/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H05K3/12 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34 ,  H05K1/11 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L29/62

CPC分类号： H01L24/16 ,  G03F7/00 ,  G03F7/0035 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/4867 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/29 ,  H01L24/83 ,  H05K3/321 ,  H05K3/3484 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0568 ,  H05K2203/0577 ,  H05K2203/0769 ,  H05K3/1216 ,  H05K3/28 ,  H05K3/3463

摘要： Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection structure. These articles are produced with screening and printing processes using a screening head and printing machine.

摘要翻译： 计算机系统中的芯片载体封装，集成电路，布线板和组件被制成具有导电粘合剂互连。 具有金属颗粒和粉末的导电聚合物浆料与光可塑聚合物膜一起使用以形成互连结构。 这些物品使用筛选头和印刷机进行筛选和印刷。

公开(公告)号：US5713508A

公开(公告)日：1998-02-03

申请号：US629178

申请日：1996-04-08

申请人： Michael Anthony Gaynes ,  Kostas Papathomas ,  Giana M. Phelan ,  Charles Gerard Woychik

发明人： Michael Anthony Gaynes ,  Kostas Papathomas ,  Giana M. Phelan ,  Charles Gerard Woychik

IPC分类号： B23K1/00 ,  B23K1/20 ,  B23K20/02 ,  B23K35/00 ,  B23K35/02 ,  B23K35/30 ,  H01B1/22 ,  H05K3/32

CPC分类号： B23K20/023 ,  B23K35/007 ,  B23K35/0244 ,  B23K35/3006 ,  B23K35/3013 ,  H05K3/321 ,  B23K2201/32 ,  H01L2224/293 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K2201/0218 ,  H05K2203/0278 ,  H05K2203/0425

摘要： A metallurgical bond which may be substituted for a soldering process forms an alloy of a metal with a metal coating applied to at least one of the surfaces to be so bonded by a transient liquid phase (TLP) reaction at a low temperature. Mechanically robust bonding of noble metals for electrical connections which are resistively stable through repeated thermal cycling can be performed at particularly low temperatures using coating materials of indium, tin or lead. Isotropically or anisotropically conductive connections can be formed by applying a polymer adhesive containing conductive particles to at least one of the surfaces to be bonded and a compressional force developed between surface by curing of the polymer adhesive at temperatures lower than the melting point of a eutectic alloy of the chosen metal system before the TLP process is allowed to proceed.

公开(公告)号：US20090284921A1

公开(公告)日：2009-11-19

申请号：US12120094

申请日：2008-05-13

申请人： Evan George Colgan ,  Michael Anthony Gaynes ,  John Harold Magerlein ,  Kenneth Charles Marston ,  Roger Ray Schmidt ,  Hilton T. Toy

发明人： Evan George Colgan ,  Michael Anthony Gaynes ,  John Harold Magerlein ,  Kenneth Charles Marston ,  Roger Ray Schmidt ,  Hilton T. Toy

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  F28F3/086 ,  F28F3/12 ,  F28F2260/02 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/00

摘要： Apparatus and methods are provided for packaging multi-chip modules with liquid cooling modules designed to provide different thermal resistances for effectively conducting heat from various chips with disparate cooling requirements while minimizing mechanical stresses in thermal bonds due to thermal excursions.

摘要翻译： 提供的装置和方法用于包装多个芯片模块，其中液体冷却模块被设计成提供不同的热阻，以有效地传导来自具有不同冷却要求的各种芯片的热量，同时最小化由于热偏移引起的热粘结中的机械应力。

公开(公告)号：US06974915B2

公开(公告)日：2005-12-13

申请号：US10979366

申请日：2004-11-01

申请人： William Louis Brodsky ,  Benson Chan ,  Michael Anthony Gaynes ,  Voya Rista Markovich

发明人： William Louis Brodsky ,  Benson Chan ,  Michael Anthony Gaynes ,  Voya Rista Markovich

IPC分类号： H05K3/32 ,  H05K1/16

CPC分类号： H01R12/523 ,  H05K3/325 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T29/49213

摘要： The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.

摘要翻译： 描述印刷电路板（PWB）子组件的细节及其制造方法。 子组件包括通过多个连接电连接到一个或多个区域阵列器件（例如模块或印刷线路板）的印刷电路板。 子组件可以作为原始组件的一部分。 子组件可以用作可以容易地替代为故障组件的后市场项目，其中印刷电路板与一个或两个区域阵列器件之间的尺寸空间必须为表面安装的器件提供足够的间隙。

公开(公告)号：US06695623B2

公开(公告)日：2004-02-24

申请号：US09871554

申请日：2001-05-31

申请人： William Louis Brodsky ,  David V. Caletka ,  Michael Anthony Gaynes ,  Voya Rista Markovich

发明人： William Louis Brodsky ,  David V. Caletka ,  Michael Anthony Gaynes ,  Voya Rista Markovich

IPC分类号： H01R1200

CPC分类号： H01R12/52 ,  H05K3/321 ,  H05K3/325 ,  H05K3/3436 ,  Y10T29/49147 ,  Y10T29/49149

摘要： A method and structure for electrically and mechanically interconnecting an array of printed circuit board contacts to an array of module contacts with a plurality of deformable resilient electrical conductors with two ends. Each of the conductor ends are electrically connected to one of the contact arrays. A portion of the conductor may deform longitudinally and laterally responsive to movement of the printed circuit board relative to the module responsive to heating and cooling cycles and mechanical vibrations, while maintaining the electrical connection of the contact arrays. An interposer with apertures extending through the interposer carries the conductors in the apertures and is used to align the conductors with the contacts. A method for excluding a rigid adhesive means from a portion of the resilient conductor is also taught.

摘要翻译： 用于将印刷电路板触点阵列电气和机械地互连到具有两端的多个可变形的弹性电导体的模块触点阵列的方法和结构。 每个导体端电连接到一个接触阵列。 导体的一部分可以响应于加热和冷却循环和机械振动而响应于印刷电路板相对于模块的移动而纵向和横向地变形，同时保持接触阵列的电连接。 具有延伸穿过插入器的孔的插入器承载孔中的导体并且用于将导体与触点对准。 还教导了从弹性导体的一部分排除刚性粘合剂装置的方法。

公开(公告)号：US06495771B2

公开(公告)日：2002-12-17

申请号：US09820563

申请日：2001-03-29

申请人： Michael Anthony Gaynes ,  Eric Arthur Johnson

发明人： Michael Anthony Gaynes ,  Eric Arthur Johnson

IPC分类号： H05K103

CPC分类号： H05K3/462 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0272 ,  H05K3/28 ,  H05K3/321 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/09536 ,  Y10T29/49126 ,  H01L2224/0401

摘要： A electronic package is constituted of a compliant multi-layered circuit board or printed circuit board package, particularly for use in ball grid array (BGA) applications wherein two or possibly greater numbers of naturally spaced sub-composites are equipped with electronic circuitry which is interconnected through the intermediary of conductive adhesives. Pursuant to a method of producing, no other mechanical connection is provided intermediate these spaced sub-composites except, possibly, along the periphery of the structure thereof, where a molded plastic seal may be provided in order to form a protection against the ingress environmental or external influences. The unfilled void, space or interspatial volume which is present between the spaced sub-composite facilitates the deformation in shear of the conductive adhesive interconnections, such as epoxy resins or the like, with extremely little constraint of the various components.

摘要翻译： 电子封装由兼容的多层电路板或印刷电路板封装构成，特别是用于球栅阵列（BGA）应用中，其中两个或可能更多数量的自然间隔的子复合材料配备有互连的电子电路 通过导电胶的中介。 根据生产方法，除了可能沿着其结构的周边之外，在这些间隔的子复合材料之间没有提供其它机械连接，其中可以提供模制塑料密封件，以形成防止侵入环境或 外部影响 存在于间隔的副复合物之间的未填充的空隙，空间或空间体积有助于导电粘合剂互连（例如环氧树脂等）的剪切变形，对各种组分的限制非常小。

公开(公告)号：US06187678B1

公开(公告)日：2001-02-13

申请号：US09379716

申请日：1999-08-24

申请人： Michael Anthony Gaynes ,  Alan James Emerick ,  Viswanadham Puligandla ,  Charles Gerard Woychik ,  Jerzy Maria Zalesinski

发明人： Michael Anthony Gaynes ,  Alan James Emerick ,  Viswanadham Puligandla ,  Charles Gerard Woychik ,  Jerzy Maria Zalesinski

IPC分类号： H01L2144

CPC分类号： H01L23/481 ,  H01L25/0657 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00013 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/00

摘要： Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.

摘要翻译： 具有降低的导体长度和改善的抗噪声性的芯片堆叠通过激光钻孔单独的芯片，例如存储芯片，优选靠近但在其周围内，并且通过其形成导体，优选地通过金属化或填充导电浆料来形成，该导电浆料可以由 瞬态液相（TLP）工艺，并且优选地在导电焊盘的金属化期间或期间，或者可能包括堆叠中的至少一些芯片的两侧上的连接器图案。 堆叠中的至少一些芯片之后具有在其间形成的电气和机械连接，优选地使用与TLP工艺一致的电镀焊料预制件。 连接可以由围绕连接的一层弹性材料容纳，并且可以在现场形成。 由此获得的高密度电路封装可以通过表面贴装技术或诸如插头和插座装置的可分离连接器安装在载体上。 载体可以具有与芯片堆叠相同的材料以匹配热膨胀系数。 高密度电路封装也可以是类似于笔或作为导热模块的大致平面或棱柱形形式的可移除存储器模块的形式。

公开(公告)号：US6069023A

公开(公告)日：2000-05-30

申请号：US94401

申请日：1998-06-10

申请人： William Emmett Bernier ,  Michael Anthony Gaynes ,  Irving Memis ,  Hussain Shaukatuallah

发明人： William Emmett Bernier ,  Michael Anthony Gaynes ,  Irving Memis ,  Hussain Shaukatuallah

IPC分类号： H01L23/373 ,  H01L21/44 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/34 ,  H01L23/367 ,  H01L23/433

CPC分类号： H01L24/31 ,  H01L21/563 ,  H01L23/367 ,  H01L23/433 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/3025

摘要： An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using an adhesive of silicon or flexible-epoxy adhesive. The aluminum may be coated by anodizing or Chromate conversion or the copper may be coated with nickel or gold Chromium. Such structures are especially useful for flip chip attachment to flexible or rigid organic circuit boards or modules such as CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, and other chip carrier packages in which the back side of chips are connected directly to heat sinks. These adhesive materials withstand wet or dry thermal cycle tests of -65 to 150.degree. C. for 1,000 cycles and 85.degree. C. and 85% relative humidity for 1000 hours while maintaining a tensile strenth of at least 500 psi. The adhesive contains materials having high thermal conductivity and a low coefficient of thermal expansion (CTE) in order to provide increased thermal performance and a CTE between that of the silicon metal die and the metal of the heat sink.

摘要翻译： 使用硅或柔性环氧树脂粘合剂的粘合剂将铝或铜散热器附接到陶瓷帽或裸露的半导体芯片。 可以通过阳极氧化或铬酸盐转化来涂覆铝，或者铜可以用镍或金铬镀覆。 这种结构对于倒装芯片连接到诸如CQFP，CBGA，CCGA，CPGA，TBGA，PBGA，DCAM，MCM-L和其他芯片载体封装的柔性或刚性有机电路板或模块特别有用，其中芯片的背面 直接连接到散热片。 这些粘合剂材料经受湿度或干热循环试验，在-65至150℃下进行1000次循环，85℃和85％相对湿度下持续1000小时，同时保持至少500psi的拉伸强度。 粘合剂包含具有高导热性和低热膨胀系数（CTE）的材料，以便提供增加的热性能和在硅金属模具和散热器的金属之间的CTE。

公开(公告)号：US5785799A

公开(公告)日：1998-07-28

申请号：US840295

申请日：1997-04-11

申请人： Thomas Moran Culnane ,  Michael Anthony Gaynes ,  Ping Kwong Seto ,  Hussain Shaukatullah

发明人： Thomas Moran Culnane ,  Michael Anthony Gaynes ,  Ping Kwong Seto ,  Hussain Shaukatullah

IPC分类号： H01L23/40 ,  H01L21/56 ,  H01L23/31 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  B30B5/00

CPC分类号： H01L23/36 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15747 ,  H01L2924/16195

摘要： An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel. Such structures are especially useful for CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, single layer ceramic, and other chip carrier packages as well as for flip chip attachment to flexible or rigid organic circuit boards. These adhesive materials withstand thermal cycle tests of 0.degree. to 100.degree. C. for 1,500 cycles, -25.degree. to 125.degree. C. for 400 cycles, and -40.degree. to 140.degree. C. for 300 cycles; and withstand continuous exposure at 130.degree. C. for 1000 hours without loss of strength. Flexible-epoxies have a modulus of elasticity below 100,000 psi and a glass transition temperature below 250.degree. C., are much stronger than typical silicone adhesives, and do not contaminate the module or circuit board with silicone. The flexible epoxy may contain a material having a low coefficient of thermal expansion (CTE) in order to provide a CTE between that of the silicon die and the metal of the heat sink.

摘要翻译： 使用柔性环氧树脂将铝或铜散热器连接到陶瓷帽或裸露的半导体芯片，以提供改进的热性能。 可以通过阳极氧化或铬酸盐转化来涂覆铝，或者铜可以用镍涂覆。 这种结构对于CQFP，CBGA，CCGA，CPGA，TBGA，PBGA，DCAM，MCM-L，单层陶瓷和其他芯片载体封装以及用于倒装芯片连接到柔性或刚性有机电路板是特别有用的。 这些粘合材料耐受0〜100℃的热循环试验，1500次循环，-25〜125℃，400次循环，-40〜140℃，300次循环; 并在130℃持续暴露1000小时而不损失强度。 柔性环氧树脂具有低于100,000psi的弹性模量和低于250℃的玻璃化转变温度比典型的硅氧烷粘合剂强得多，并且不会用硅树脂污染模块或电路板。 柔性环氧树脂可以包含具有低热膨胀系数（CTE）的材料，以便在硅片和散热片的金属之间提供CTE。

公开(公告)号：US5744863A

公开(公告)日：1998-04-28

申请号：US474341

申请日：1995-06-07

申请人： Thomas Moran Culnane ,  Michael Anthony Gaynes ,  Ping Kwong Seto ,  Hussain Shaukatullah

发明人： Thomas Moran Culnane ,  Michael Anthony Gaynes ,  Ping Kwong Seto ,  Hussain Shaukatullah

IPC分类号： H01L23/40 ,  H01L21/56 ,  H01L23/31 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H01L23/34 ,  H05K7/20

CPC分类号： H01L23/36 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15747 ,  H01L2924/16195

摘要： An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel. Such structures are especilly useful for CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, single layer ceramic, and other chip carrier packages as well as for flip chip attachment to flexible or rigid organic circuit boards. These adhesive materials withstand thermal cycle tests of 0.degree. to 100.degree. C. for 1,500 cycles, -25.degree. to 125.degree. C. for 400 cycles, and -40.degree. to 140.degree. C. for 300 cycles; and withstand continuous exposure at 130.degree. C. for 1000 hours without loss of strength. Flexible-epoxies have a modulus of elasticity below 100,000 psi and a glass transition temperature below 25.degree. C., are much stronger than typical silicone adhesives, and do not contaminate the module or circuit board with silicone. The flexible epoxy may contain a material having a low coefficient of thermal expansion (CTE) in order to provide a CTE between that of the silicon die and the metal of the heat sink.

摘要翻译： 使用柔性环氧树脂将铝或铜散热器连接到陶瓷帽或裸露的半导体芯片，以提供改进的热性能。 可以通过阳极氧化或铬酸盐转化来涂覆铝，或者铜可以用镍涂覆。 这种结构对于CQFP，CBGA，CCGA，CPGA，TBGA，PBGA，DCAM，MCM-L，单层陶瓷和其他芯片载体封装以及用于倒装芯片连接到柔性或刚性有机电路板是非常有用的。 这些粘合材料耐受0〜100℃的热循环试验，1500次循环，-25〜125℃，400次循环，-40〜140℃，300次循环; 并在130℃持续暴露1000小时而不损失强度。 柔性环氧树脂的弹性模量低于100,000psi，玻璃化转变温度低于25℃，比典型的硅氧烷粘合剂强得多，并且不会用硅树脂污染模块或电路板。 柔性环氧树脂可以包含具有低热膨胀系数（CTE）的材料，以便在硅片和散热片的金属之间提供CTE。