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公开(公告)号：US20160332826A1
公开(公告)日：2016-11-17
申请号：US15219930
申请日：2016-07-26
发明人： Masakatsu OHNO , Kohei YOKOYAMA , Satoru IDOJIRI , Hisao IKEDA , Yasuhiro JINBO , Hiroki ADACHI , Yoshiharu HIRAKATA , Shingo EGUCHI
IPC分类号： B65G49/06 , H01L51/56 , H01L27/32 , B65H3/08 , B32B37/00 , B65H35/00 , B65H16/00 , B32B43/00 , B32B17/06 , H01L51/52 , B65H3/48
CPC分类号： B65G49/068 , B32B17/06 , B32B37/025 , B32B38/10 , B32B43/006 , B32B2457/00 , B32B2457/14 , B32B2457/20 , B65G49/069 , B65G2249/04 , B65H3/0816 , B65H3/48 , B65H16/00 , B65H35/0006 , H01L21/673 , H01L21/67333 , H01L21/67715 , H01L21/68 , H01L27/3244 , H01L51/5237 , H01L51/56 , H01L2221/68318 , H01L2227/323 , Y10T29/53091 , Y10T29/5317 , Y10T156/1121 , Y10T156/1137 , Y10T156/1158 , Y10T156/1184 , Y10T156/1917 , Y10T156/1922 , Y10T156/1939 , Y10T156/1967
摘要： An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.
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公开(公告)号：US20160243812A1
公开(公告)日：2016-08-25
申请号：US15147020
申请日：2016-05-05
发明人： Kayo KUMAKURA , Tomoya AOYAMA , Akihiro CHIDA , Kohei YOKOYAMA , Masakatsu OHNO , Satoru IDOJIRI , Hisao IKEDA , Hiroki ADACHI , Yoshiharu HIRAKATA , Shingo EGUCHI , Yasuhiro JINBO
CPC分类号： B32B43/006 , B26D1/04 , B26D2001/006 , B32B38/10 , B32B2457/00 , G02B6/00 , H01L21/67092 , H01L27/1248 , H01L27/3258 , H01L27/3262 , H01L51/56 , H01L2221/68327 , H01L2227/323 , H01L2251/5338 , Y10T156/1126 , Y10T156/1132 , Y10T156/1168 , Y10T156/1184 , Y10T156/1933 , Y10T156/1944 , Y10T156/1961 , Y10T156/1967
摘要： A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.
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公开(公告)号：US20150319893A1
公开(公告)日：2015-11-05
申请号：US14696525
申请日：2015-04-27
发明人： Masakatsu OHNO , Satoru IDOJIRI , Koichi TAKESHIMA , Kayo KUMAKURA , Yoshiharu HIRAKATA , Kohei YOKOYAMA
CPC分类号： B32B38/10 , B32B38/1858 , B32B43/006 , B32B2457/00 , H05K13/0486 , Y10T156/1105 , Y10T156/1132 , Y10T156/1906 , Y10T156/1944
摘要： A separation apparatus (1) for separating a thin-film flexible stacked body (3) from a component (16) where the thin-film flexible stacked body (3) including an element layer is formed over a rigid substrate (2) such as a glass substrate, a quartz substrate, a ceramic substrate, or a metal substrate is provided. The separation apparatus (1) mainly includes a fixing device (10) for fixing the substrate (2) of the component (16), suction jigs (11) for lifting the flexible stacked body (3) by suction to be separated, circular suction pads (13) that are brought into direct contact with the flexible stacked body (3) and attached to the flexible stacked body (3) by suction, and clamp jigs (9) for holding an edge of the flexible stacked body (3). A position sensor such as a laser measuring instrument for measuring or monitoring a separation state of the flexible stacked body may be used together.
摘要翻译： 一种用于将薄膜柔性层叠体（3）从包括元件层的薄膜柔性层叠体（3）的部件（16）分离的分离装置（1）形成在刚性基板（2）上，例如 玻璃基板，石英基板，陶瓷基板或金属基板。 分离装置（1）主要包括用于固定部件（16）的基板（2）的固定装置（10），用于通过抽吸提升柔性堆叠体（3）以分离的吸入夹具（11），圆形抽吸 与柔性层叠体（3）直接接触并通过抽吸附接到柔性层叠体（3）的垫（13）和用于保持柔性层叠体（3）的边缘的夹具（9）。 可以一起使用诸如用于测量或监测柔性层叠体的分离状态的激光测量仪器的位置传感器。
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公开(公告)号：US20150314456A1
公开(公告)日：2015-11-05
申请号：US14699614
申请日：2015-04-29
发明人： Kayo KUMAKURA , Satoru IDOJIRI , Masakatsu OHNO , Koichi TAKESHIMA , Yoshiharu HIRAKATA , Kohei YOKOYAMA
CPC分类号： B25J15/0616 , B25J11/00 , B25J15/0004 , B25J15/0028 , B25J15/0061
摘要： A film suction mechanism is provided which can prevent a film-like member from warping or sagging for reliable suction, handing over, or the like of the film-like member. A film suction mechanism of the present invention is a film suction mechanism for processing or transferring a flexible film-like member. The film suction mechanism includes a suction unit having a function of attaching the film-like member thereto by suction and an air nozzle having a function of blowing pressurized air onto a first surface of the film-like member. The suction unit includes a plurality of suction pads. The suction unit is capable of attaching a second surface of the film-like member thereto by suction while the pressurized air is blown onto the first surface of the film-like member.
摘要翻译： 提供了一种胶片吸引机构，其可以防止膜状构件翘曲或下垂以获得膜状构件的可靠抽吸，移交等。 本发明的吸膜机构是用于加工或转移柔性膜状部件的膜吸引机构。 薄膜抽吸机构包括具有通过抽吸将薄膜状构件附接到其上的功能的抽吸单元和具有将加压空气吹送到薄膜状构件的第一表面上的功能的空气喷嘴。 抽吸单元包括多个吸盘。 抽吸单元能够通过抽吸将薄膜状构件的第二表面附着在压力空气吹到薄膜状构件的第一表面上。
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公开(公告)号：US20150155505A1
公开(公告)日：2015-06-04
申请号：US14553251
申请日：2014-11-25
CPC分类号： H01L27/3272 , B23K26/04 , B23K26/0617 , B23K26/0622 , B23K26/0643 , B23K26/0648 , B23K26/083 , H01L27/1225 , H01L27/1266 , H01L27/322 , H01L27/3244 , H01L27/3258 , H01L27/3262 , H01L29/24 , H01L29/66969 , H01L29/78603 , H01L29/7869 , H01L41/314 , H01L51/0024 , H01L51/0027 , H01L51/003 , H01L51/0097 , H01L51/5096 , H01L51/5246 , H01L51/5253 , H01L51/5284 , H01L51/56 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2251/558 , Y02E10/549 , Y02P70/521
摘要： A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
摘要翻译： 在第一基板上形成第一有机树脂层; 在第一有机树脂层上形成第一绝缘膜; 第一元件层形成在第一绝缘膜上; 在第二基板上形成第二有机树脂层; 在第二有机树脂层上形成第二绝缘膜; 第二元件层形成在第二绝缘膜上; 第一基板和第二基板接合; 第一分离步骤，其中第一有机树脂层和第一基板之间的粘合力减小; 第一有机树脂层和第一柔性基板与第一接合层接合; 第二分离步骤，其中所述第二有机树脂层和所述第二基板之间的粘合减小; 并且第二有机树脂层和第二柔性基板与第二接合层接合。
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公开(公告)号：US20220384398A1
公开(公告)日：2022-12-01
申请号：US17750570
申请日：2022-05-23
发明人： Shunpei YAMAZAKI , Hiroki ADACHI , Satoru IDOJIRI
摘要： A novel display apparatus that is highly convenient or reliable is provided. Alternatively, a novel input/output device that is highly convenient or reliable is provided. The display apparatus is configured in the following manner: the periphery of end surfaces of a plurality of display panels is processed by laser light and the display panels are joined together so that unevenness is not generated at a boundary between the adjacent display panels and the outermost surface of the display apparatus is flat.
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公开(公告)号：US20220102534A1
公开(公告)日：2022-03-31
申请号：US17427236
申请日：2020-02-06
IPC分类号： H01L29/66 , H01L29/786 , H01L21/02
摘要： A semiconductor device with favorable electrical characteristics is provided. A semiconductor device with stable electrical characteristics is provided. A highly reliable display device is provided. A method for fabricating the semiconductor device includes a step of forming a semiconductor layer including a metal oxide; a step of forming, over the semiconductor layer, a first conductive layer and a second conductive layer that are apart from each other over the semiconductor layer; a step of performing plasma treatment using a mixed gas including an oxidizing gas and a reducing gas on a region where the semiconductor layer is exposed; a step of forming a first insulating layer over the semiconductor layer, the first conductive layer, and the second conductive layer; and a step of forming a second insulating layer over the first insulating layer. The first insulating layer is formed by a plasma-enhanced chemical vapor deposition method using a mixed gas including a gas containing silicon, an oxidizing gas, and an ammonia gas. The first insulating layer is formed successively after the plasma treatment without exposure to the air.
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公开(公告)号：US20220013754A1
公开(公告)日：2022-01-13
申请号：US17479329
申请日：2021-09-20
发明人： Seiji Yasumoto , Kayo KUMAKURA , Yuka SATO , Satoru IDOJIRI , Hiroki ADACHI , Kenichi OKAZAKI
摘要： A high-yield fabricating method of a semiconductor device including a peeling step is provided.
A peeling method includes a step of stacking and forming a first material layer and a second material layer over a substrate and a step of separating the first material layer and the second material layer from each other. The second material layer is formed over the substrate with the first material layer therebetween. The first material layer includes a first compound layer in contact with the second material layer and a second compound layer positioned closer to the substrate side than the first compound layer is. The first compound layer has the highest oxygen content among the layers included in the first material layer. The second compound layer has the highest nitrogen content among the layers included in the first material layer. The second material layer includes a resin. In the step of separating, the first material layer and the second material layer are separated from each other by irradiation of an interface between the first material layer and the second material layer or the vicinity of the interface with light.-
公开(公告)号：US20190035820A1
公开(公告)日：2019-01-31
申请号：US16143970
申请日：2018-09-27
发明人： Junpei YANAKA , Kayo KUMAKURA , Masataka SATO , Satoru IDOJIRI , Kensuke YOSHIZUMI , Mari TATEISHI , Natsuko TAKASE
CPC分类号： H01L27/1225 , H01L23/293 , H01L27/124 , H01L27/1266 , H01L27/3262 , H01L51/003 , H01L2227/323
摘要： To provide a peeling method that achieves low cost and high mass productivity. The peeling method includes the steps of: forming a first layer with a photosensitive material over a formation substrate; forming a first region and a second region having a smaller thickness than the first region in the first layer by photolithography to form a resin layer having the first region and the second region; forming a transistor including an oxide semiconductor in a channel formation region over the first region in the resin layer; forming a conductive layer over the second region in the resin layer; and irradiating the resin layer with laser light to separate the transistor and the formation substrate.
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公开(公告)号：US20180072033A1
公开(公告)日：2018-03-15
申请号：US15804319
申请日：2017-11-06
发明人： Masakatsu OHNO , Yoshiharu HIRAKATA , Shingo EGUCHI , Yasuhiro JINBO , Hisao IKEDA , Kohei YOKOYAMA , Hiroki ADACHI , Satoru IDOJIRI
IPC分类号： B32B37/00 , B32B37/12 , B32B17/10 , B32B27/08 , B32B27/20 , B32B27/36 , B32B38/18 , B32B38/00
CPC分类号： B32B37/0046 , B32B17/10431 , B32B27/08 , B32B27/20 , B32B27/36 , B32B37/0015 , B32B37/003 , B32B37/1284 , B32B38/0008 , B32B38/18 , B32B38/1841 , B32B38/1858 , B32B2264/102 , B32B2264/105 , B32B2309/68 , B32B2457/14 , B32B2457/20 , H01L2224/01 , Y10T156/15 , Y10T156/1798
摘要： A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.
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