公开(公告)号：US20160349129A1

公开(公告)日：2016-12-01

申请号：US14989709

申请日：2016-01-06

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto Pagani ,  Bruno Murari ,  Marco Ferrera ,  Domenico Giusti ,  Daniele Caltabiano

IPC: G01L9/00

CPC classification number: G01L9/0052 ,  G01L9/0054 ,  G01L15/00

Abstract: A pressure sensor with double measuring scale includes: a flexible body designed to undergo deflection as a function of a the pressure; piezoresistive transducers for detecting the deflection; a first focusing region designed to concentrate, during a first operating condition, a first value of the pressure in a first portion of the flexible body so as to generate a deflection of the first portion of the flexible body; and a second focusing region designed to concentrate, during a second operating condition, a second value of said pressure in a second portion of the flexible body so as to generate a deflection of the second portion of the flexible body. The piezoresistive transducers correlate the deflection of the first portion of the flexible body to the first pressure value and the deflection of the second portion of the flexible body to the second pressure value.

Abstract translation: 具有双重测量刻度的压力传感器包括：柔性体，设计成作为压力的函数进行偏转; 用于检测偏转的压阻传感器; 第一聚焦区域，设计成在第一操作条件期间将柔性体的第一部分中的压力的​​第一值集中以产生柔性体的第一部分的偏转; 以及设计成在第二操作条件期间将所述压力的第二值集中在柔性体的第二部分中以便产生柔性体的第二部分的偏转的第二聚焦区域。 压阻传感器将柔性体的第一部分的偏转与第一压力值和柔性体的第二部分的偏转相关联到第二压力值。

公开(公告)号：US09419071B2

公开(公告)日：2016-08-16

申请号：US14926269

申请日：2015-10-29

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Alessandro Finocchiaro

IPC: H01L49/02 ,  H01L23/66 ,  G01R31/28 ,  G01R31/302 ,  H01L21/66 ,  H01L23/528 ,  H01L23/00 ,  H01L23/58 ,  H01L29/06

CPC classification number: H01L28/10 ,  G01R31/2834 ,  G01R31/2889 ,  G01R31/3025 ,  H01L22/32 ,  H01L22/34 ,  H01L23/528 ,  H01L23/544 ,  H01L23/564 ,  H01L23/585 ,  H01L23/66 ,  H01L24/05 ,  H01L25/0657 ,  H01L29/0642 ,  H01L2223/6677 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An integrated circuit on a substrate including at least one peripheral portion that surrounds an active area and is realized close to at least one scribe line providing separation with other integrated circuits realized on a same wafer. The integrated circuit includes at least one conductive structure that extends in its peripheral portion on different planes starting from the substrate and realizes an integrated antenna for the circuit.

公开(公告)号：US20160141216A1

公开(公告)日：2016-05-19

申请号：US15005178

申请日：2016-01-25

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: H01L21/66 ,  H01L23/532 ,  H01L23/528 ,  G01R31/28 ,  H01L21/768

CPC classification number: H01L22/32 ,  G01R31/2886 ,  H01L21/76877 ,  H01L23/528 ,  H01L23/53209 ,  H01L23/53242 ,  H01L23/53257 ,  H01L24/05 ,  H01L24/92 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/05164 ,  H01L2224/05173 ,  H01L2224/05557 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/48463 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated electronic circuit has probe indentations filled by a hard covering substance. The integrated circuit device results from a process of manufacturing including forming a substrate comprising a plurality of functional components of the electronic circuit, creating a plurality of conductive layers on such substrate to form an electric contact region with high hardness equal to or greater than a first hardness value of about 300 HV, contacting the electric contact region with a probe thereby causing an indentation. The process further comprises, after the test run, creating a covering conductive layer on at least one part of the electric contact region contacted by the probe to fill the indentation.

Abstract translation: 集成电子电路具有由硬覆盖物质填充的探针压痕。 集成电路装置来自制造工艺，包括形成包括电子电路的多个功能部件的基板，在该基板上形成多个导电层，以形成等于或大于第一电极的高硬度的电接触区域 硬度值约为300HV，使电接触区域与探针接触，从而形成压痕。 该方法进一步包括在测试运行之后，在由探针接触的电接触区域的至少一部分上形成覆盖导电层以填充凹陷。

公开(公告)号：US09318516B2

公开(公告)日：2016-04-19

申请号：US13933898

申请日：2013-07-02

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: H01L27/14 ,  H01L31/02 ,  H01L31/0216 ,  H01L27/146 ,  H01L31/105

CPC classification number: H01L31/105 ,  H01L27/14 ,  H01L27/14643 ,  H01L31/02 ,  H01L31/0216 ,  H01L31/02327 ,  H01L31/035281

Abstract: An optoelectronic device for detecting electromagnetic radiation and including: a body of semiconductor material delimited by a main surface and including a first region and a second region that form a junction; and a recess formed in the body, which extends from the main surface and is delimited at least by a first wall, the first wall being arranged transverse to the main surface. The junction faces the first wall.

Abstract translation: 一种用于检测电磁辐射的光电子器件，包括：由主表面限定并包括形成结的第一区域和第二区域的半导体材料体; 以及形成在主体中的凹部，其从主表面延伸并且至少由第一壁限定，第一壁横向于主表面设置。 接头面向第一个墙壁。

公开(公告)号：US09257250B2

公开(公告)日：2016-02-09

申请号：US14062698

申请日：2013-10-24

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: H01H50/16 ,  H01H1/00 ,  H01H50/00 ,  H01H51/26

CPC classification number: H01H50/16 ,  H01H1/0036 ,  H01H50/005 ,  H01H51/26 ,  H01H2001/0078 ,  H01H2001/0084 ,  H01H2050/007

Abstract: A magnetic relay device having a substrate of semiconductor material houses two through magnetic vias of electrically conductive ferromagnetic material. At least one coil is arranged underneath a first surface of the substrate in proximity of at least one between the first and second magnetic vias, and a contact structure, of ferromagnetic material, is arranged over a second surface of the substrate and is controlled by the magnetic field generated by the coil so as to switch between an open position, wherein the contact structure electrically disconnects the first and second magnetic vias, and a close position, wherein the contact structure electrically connects the first and second magnetic vias.

Abstract translation: 具有半导体材料的基板的磁继电器装置容纳两个通过导电铁磁材料的磁通孔。 至少一个线圈布置在衬底的第一表面的下方，靠近第一和第二磁通道之间的至少一个，并且铁磁材料的接触结构布置在衬底的第二表面上，并且由 所述线圈产生的磁场在所述接触结构电断开所述第一和第二磁通孔的打开位置与闭合位置之间切换，其中所述接触结构电连接所述第一和第二磁通孔。

公开(公告)号：US20150336207A1

公开(公告)日：2015-11-26

申请号：US14817554

申请日：2015-08-04

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Allesandro Finocchiaro ,  Giovanni Girlando

IPC: B23K26/00 ,  H01L49/02 ,  B23K26/30 ,  H01L21/268 ,  H01L21/67 ,  H01Q1/22 ,  H01L21/66 ,  H01L23/66

CPC classification number: H01Q1/2225 ,  G06K19/07749 ,  G06K19/07775 ,  G06K19/07779 ,  H01L21/268 ,  H01L21/67115 ,  H01L21/67253 ,  H01L22/26 ,  H01L22/34 ,  H01L23/5223 ,  H01L23/5225 ,  H01L23/5227 ,  H01L23/66 ,  H01L28/10 ,  H01L28/40 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01Q1/526 ,  Y10T29/49004 ,  H01L2924/00

Abstract: An electronic communications device includes a body of semiconductor material with an integrated electronic circuit, an inductive element, and a capacitive element. The capacitive element is formed by a first electrode and a second electrode positioned between the inductive element and the integrated electronic circuit. Tuning of the device circuitry is accomplished by energizing the inductive/capacitive elements, determining resonance frequency, and using a laser trimming operation to alter the structure of one or more of the first electrode, second electrode or inductive element and change the resonance frequency.

Abstract translation: 电子通信设备包括具有集成电子电路的半导体材料体，电感元件和电容元件。 电容元件由位于感应元件和集成电子电路之间的第一电极和第二电极形成。 通过激励感应/电容元件，确定谐振频率以及使用激光修整操作来改变第一电极，第二电极或电感元件中的一个或多个的结构并改变谐振频率来实现器件电路的调谐。

公开(公告)号：US20150135846A1

公开(公告)日：2015-05-21

申请号：US14401332

申请日：2013-05-23

Applicant: STMICROELECTRONICS S.r.l

Inventor： Alberto Pagani ,  Bruno Murari ,  Federico Giovanni Ziglioli ,  Marco Ronchi ,  Giulio Ricotti

IPC: G01D11/24 ,  G01K17/00 ,  B28B23/00 ,  G01L1/18

CPC classification number: G01D11/245 ,  B28B23/0031 ,  G01K17/00 ,  G01L1/18 ,  G01M5/00 ,  G01N33/383

Abstract: A package for a device to be inserted into a solid structure may include a building material that includes particles of one of micrometric and sub-micrometric dimensions. The device may include an integrated detection module having at least one integrated sensor and the package arranged to coat at least one portion of the device including the integrated detection module. A method aspect includes a method of manufacturing the device. A system aspect is for monitoring parameters in a solid structure that includes the device.

Abstract translation: 用于插入固体结构的装置的包装可以包括包括微米和亚微米尺寸之一的颗粒的建筑材料。 该装置可以包括具有至少一个集成传感器的集成检测模块，并且该封装被布置成涂覆包括集成检测模块的装置的至少一部分。 方法方面包括制造该装置的方法。 系统方面用于监视包括设备的实体结构中的参数。

公开(公告)号：US20130242636A1

公开(公告)日：2013-09-19

申请号：US13782263

申请日：2013-03-01

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto Pagani ,  Marco Morelli ,  Giulio Ricotti

IPC: G11C23/00

CPC classification number: G11C23/00 ,  G11C5/005 ,  G11C7/02 ,  G11C7/1048 ,  G11C7/12 ,  G11C11/50 ,  G11C29/12 ,  G11C2029/0409 ,  H01H1/0036 ,  H01H1/52 ,  H01H59/0009

Abstract: An electromechanical memory element includes a fixed body and a deformable element attached to the fixed body. An actuator causes a deformation of the deformable element from a first position (associated with a first logic state) to a second position (associated with a second logic state) where a mobile element makes contact with a fixed element. A programming circuit then causes a weld to be formed between the mobile element and the fixed element. The memory element is thus capable of associating the first and second positions with two different logic states. The weld may be selectively dissolved to return the deformable element back to the first position.

Abstract translation: 机电存储元件包括固定体和附接到固定体的可变形元件。 致动器使可变形元件从第一位置（与第一逻辑状态相关联）变形到移动元件与固定元件接触的第二位置（与第二逻辑状态相关联）。 然后编程电路在可移动元件和固定元件之间形成焊缝。 因此，存储元件能够将第一和第二位置与两个不同的逻辑状态相关联。 可以选择性地溶解焊缝以将可变形元件返回到第一位置。

公开(公告)号：US12248012B2

公开(公告)日：2025-03-11

申请号：US18371823

申请日：2023-09-22

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: H01F7/06 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/319

Abstract: Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.

公开(公告)号：US10962659B2

公开(公告)日：2021-03-30

申请号：US16174016

申请日：2018-10-29

Applicant: STMicroelectronics S.r.l.

Inventor： Sara Loi ,  Alberto Pagani

IPC: G01T1/178 ,  G01N15/02 ,  G01N15/06 ,  G01T1/24 ,  G01T1/29 ,  F04B19/06 ,  F04B37/00 ,  G01N15/00 ,  G01N15/10 ,  G01N1/22

Abstract: A process for manufacturing an optical system includes forming a first hydrophobic surface at a semiconductor substrate, providing a first drop of transparent material having a first shape on the first hydrophobic surface, and allowing the first drop to harden to form a first optical element having the first shape. The optical system may be a particle detector, and the process may optionally further include forming a light source at the semiconductor substrate configured to generate a light beam that passes through the first optical element and a cavity to a photodetector.