公开(公告)号：US08299601B2

公开(公告)日：2012-10-30

申请号：US12535222

申请日：2009-08-04

申请人： Seiji Oka ,  Yoshiko Obiraki ,  Takeshi Oi

发明人： Seiji Oka ,  Yoshiko Obiraki ,  Takeshi Oi

IPC分类号： H01L23/48

CPC分类号： H01L23/3735 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01068 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A power semiconductor module includes: a circuit board having a metal base plate, a high thermal conductive insulating layer, and a wiring pattern; power semiconductor elements electrically connected to the wiring pattern; tubular external terminal connection bodies provided to the wiring pattern for external terminals; and a transfer mold resin body encapsulated to expose through-holes in the metal base plate and used to fixedly attach cooling fins to the face of the metal base plate on the other side with attachment members, the face of the metal base plate on the other side, and top portions of the tubular external terminal connection bodies, to form insertion holes for the attachment members communicating with the through-holes and having a larger diameter than the through-holes, and to cover the one side and side faces of the metal base plate and the power semiconductor elements.

摘要翻译： 功率半导体模块包括：具有金属基板，高导热绝缘层和布线图案的电路板; 电连接到所述布线图案的功率半导体元件; 提供给外部端子的布线图案的管状外部端子连接体; 以及转印模塑树脂体，其被封装以暴露在金属基板中的通孔，并用于将冷却翅片固定地附接到具有附接构件的另一侧上的金属基板的表面，金属基板的另一面 侧面和顶部，以形成用于与通孔连通并且具有比通孔更大的直径的附接构件的插入孔，并且覆盖金属的一侧和侧面 基板和功率半导体元件。

公开(公告)号：US20060286923A1

公开(公告)日：2006-12-21

申请号：US10573586

申请日：2004-09-27

申请人： Seiji Oka ,  Toru Suzuki ,  Akinori Nakai ,  Mituaki Nagamine

发明人： Seiji Oka ,  Toru Suzuki ,  Akinori Nakai ,  Mituaki Nagamine

IPC分类号： F24F13/08 ,  F24F7/00

CPC分类号： F24F1/0011 ,  F24F1/0057 ,  F24F11/30 ,  F24F11/56 ,  F24F11/84 ,  F24F2120/10 ,  F24F2120/12

摘要： An air conditioner and a method for controlling an air conditioner are provided for controlling the direction in which conditioned air is discharged during powerful operation. The air conditioner is provided with a control unit. The control unit is connected, among other things, to a compressor, a four-way switching valve, a pressure-reducing device, a remote control, a fan motor, a flap motor, a temperature sensor, and an infrared sensor. The control unit controls the compressor, the four-way switching valve, the pressure-reducing device, the fan motor, and the flap motor. When a command for powerful operation is entered from the remote control, the control unit temporarily increases the rotational speed of the cross-flow fan, the operating frequency of the compressor, and the like, enhances the air conditioning capacity, and controls the direction of the horizontal flap according to the direction in which people are present in the room.

摘要翻译： 提供一种用于控制空调的空气调节器和方法，用于在强大的操作期间控制调节空气排放的方向。 空调设有控制单元。 控制单元尤其与压缩机，四通切换阀，减压装置，遥控器，风扇马达，挡板马达，温度传感器和红外线传感器相连接。 控制单元控制压缩机，四通切换阀，减压装置，风扇马达和挡板马达。 当从遥控器输入强大操作命令时，控制单元暂时增加横流风扇的转速，压缩机的工作频率等，提高空调能力，并且控制方向 根据人们在房间中存在的方向的水平翼。

公开(公告)号：US06451710B1

公开(公告)日：2002-09-17

申请号：US09875249

申请日：2001-06-07

申请人： Seiji Oka ,  Satoshi Yanaura ,  Yasuo Kawashima ,  Takeshi Muraki

发明人： Seiji Oka ,  Satoshi Yanaura ,  Yasuo Kawashima ,  Takeshi Muraki

IPC分类号： H01L21469

CPC分类号： H01L21/486 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00

摘要： A method of manufacturing highly reliable and highly dense printed wiring board which is not warped even by the application of pressure and heat in manufacturing the multi-layer printed wiring board. The highly precise and highly dense multi-layer printed wiring board is realized by using an uncured resin sheet reinforced with fiber as an interlayer insulating layer, forming non-through holes in the uncured resin sheet using a laser beam, filling the non-through holes with a conductive paste, half-curing the conductive paste to form a wiring material, and sticking the wiring material onto the wiring substrate by application of pressure and heat, without causing a deviation in position even in applying pressure and heat.

摘要翻译： 一种制造高可靠性和高密度印刷线路板的方法，即使在制造多层印刷线路板时，即使通过施加压力和热也不翘曲。 通过使用由纤维增强的未固化树脂片作为层间绝缘层，通过使用激光束在未固化的树脂片中形成非通孔，填充非通孔来实现高精度和高密度的多层印刷线路板 通过导电膏将半导电糊剂半固化以形成布线材料，并且通过施加压力和热量将布线材料粘附到布线基板上，即使在施加压力和热量的同时也不会引起位置偏差。

公开(公告)号：US5983059A

公开(公告)日：1999-11-09

申请号：US925146

申请日：1997-09-08

申请人： Seiji Oka ,  Yasushi Akiba ,  Masumi Ikesue ,  Masakazu Nakada ,  Hiroyasu Itou

发明人： Seiji Oka ,  Yasushi Akiba ,  Masumi Ikesue ,  Masakazu Nakada ,  Hiroyasu Itou

IPC分类号： G03G15/08

CPC分类号： G03G15/0894 ,  G03G15/0855 ,  G03G15/0865 ,  G03G15/087 ,  G03G15/0872 ,  G03G2215/00987 ,  G03G2215/0675 ,  G03G2215/0678

摘要： A recyclable toner container having a hollow cylindrical body, a toner outlet at one end of the container, and a removable cap fitted in the toner outlet. The cap have a plurality of circumferential protuberances on an outer periphery thereof and contacting the inner periphery of the toner outlet. The diameters of the plurality of protuberances are sequentially increased from a downstream side toward an upstream side in a direction in which the cap is inserted into the toner outlet.

摘要翻译： 具有中空圆筒体的可回收调色剂容器，容器一端的调色剂出口以及装在调色剂出口中的可拆卸盖。 盖在其外周上具有多个周向突起并与调色剂出口的内周接触。 多个突起的直径在帽被插入调色剂出口的方向上从下游侧向上游侧依次增加。

公开(公告)号：US08952520B2

公开(公告)日：2015-02-10

申请号：US12504250

申请日：2009-07-16

申请人： Yoshiko Obiraki ,  Seiji Oka ,  Osamu Usui ,  Yasushi Nakayama ,  Takeshi Oi

发明人： Yoshiko Obiraki ,  Seiji Oka ,  Osamu Usui ,  Yasushi Nakayama ,  Takeshi Oi

IPC分类号： H01L23/48 ,  H01L23/373 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/3735 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power semiconductor device with improved productivity, reduced size and reduction of amounting area therefore is provided. In the provided power semiconductor device, an external terminal does not limit an increase in current. The power semiconductor device is sealed with transfer molding resin. In the power semiconductor device, a cylindrical external terminal communication section is arranged on a wiring pattern so as to be substantially perpendicular to the wiring pattern. An external terminal can be inserted and connected to the cylindrical external terminal communication section. The cylindrical external terminal communication section allows the inserted external terminal to be electrically connected to the wiring pattern. A taper is formed at, at least, one end of the cylindrical external terminal communication section, which one end is joined to the wiring pattern.

摘要翻译： 因此，提供了具有提高的生产率，减小的尺寸和减少面积的功率半导体器件。 在所提供的功率半导体器件中，外部端子不限制电流的增加。 功率半导体器件用传递模塑树脂密封。 在功率半导体装置中，圆筒状的外部端子连通部布置在布线图案上，使其大致垂直于布线图形。 外部端子可以插入并连接到圆筒形外部端子通信部分。 圆筒形外部终端通信部分允许插入的外部端子电连接到布线图案。 在圆筒形外部终端连通部的至少一端形成有锥形，该端部与布线图案相接合。

公开(公告)号：US08741695B2

公开(公告)日：2014-06-03

申请号：US13619353

申请日：2012-09-14

申请人： Seiji Oka ,  Kazuhiro Tada ,  Hiroshi Yoshida

发明人： Seiji Oka ,  Kazuhiro Tada ,  Hiroshi Yoshida

IPC分类号： H01L23/48 ,  H01L23/495 ,  H01L33/48 ,  H01L33/56

CPC分类号： H01L21/3043 ,  H01L21/561 ,  H01L21/78 ,  H01L23/142 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/072 ,  H01L25/50 ,  H01L29/02 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/85 ,  H01L2924/00

摘要： A semiconductor device includes a metal substrate including a metal base plate, an insulating sheet located on the metal base plate, and a wiring pattern located on the insulating sheet, and a semiconductor element located on the metal substrate. The semiconductor element is sealed with a molding resin. The molding resin extends to side surfaces of the metal substrate. On the side surfaces of the metal substrate, the insulating sheet and the wiring pattern are not exposed from the molding resin, whereas the metal base plate includes a projecting portion exposed from the molding resin.

摘要翻译： 半导体器件包括金属基板，其包括金属基板，位于金属基板上的绝缘片和位于绝缘片上的布线图案，以及位于金属基板上的半导体元件。 半导体元件用模制树脂密封。 成型树脂延伸到金属基板的侧表面。 在金属基板的侧面上，绝缘片和布线图案不会从模制树脂露出，而金属基板包括从模制树脂露出的突出部分。

公开(公告)号：US08502385B2

公开(公告)日：2013-08-06

申请号：US13150593

申请日：2011-06-01

申请人： Seiji Oka ,  Tetsuya Ueda

发明人： Seiji Oka ,  Tetsuya Ueda

IPC分类号： H01L23/48 ,  H01L23/498

CPC分类号： H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A power semiconductor device has the power semiconductor elements having back surfaces bonded to wiring patterns and surface electrodes, cylindrical communication parts having bottom surfaces bonded on the surface electrodes of the power semiconductor elements and/or on the wiring patterns, a transfer mold resin having concave parts which expose the upper surfaces of the communication parts and cover the insulating layer, the wiring patterns, and the power semiconductor elements. External terminals have one ends inserted in the upper surfaces of the communication parts and the other ends guided upward, and at least one external terminal has, between both end parts, a bent area which is bent in an L shape and is embedded in the concave part of the transfer mold resin.

摘要翻译： 功率半导体器件具有将背面接合到布线图案和表面电极的功率半导体元件，具有接合在功率半导体元件的表面电极上和/或布线图案上的底面的圆筒形连通部分，具有凹形 露出通信部的上表面并覆盖绝缘层的部分，布线图案和功率半导体元件。 外部端子的一端插入连通部的上表面，另一端被向上引导，并且至少一个外部端子在两端部之间具有弯曲的L形的弯曲区域并嵌入凹部 部分转移模具树脂。

公开(公告)号：US08319333B2

公开(公告)日：2012-11-27

申请号：US12582025

申请日：2009-10-20

申请人： Seiji Oka ,  Yoshiko Obiraki ,  Takeshi Oi

发明人： Seiji Oka ,  Yoshiko Obiraki ,  Takeshi Oi

IPC分类号： H01L23/48

CPC分类号： H01L24/40 ,  H01L24/37 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/73263 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： In the power semiconductor module, a wiring metal plate electrically connects between power semiconductor elements joined to the circuit pattern, and between the power semiconductor elements and the circuit pattern. Cylindrical main terminals are joined, substantially perpendicularly, to the wiring metal plate and the circuit pattern, respectively. A cylindrical control terminal is joined, substantially perpendicularly, to one of the power semiconductor elements.

摘要翻译： 在功率半导体模块中，布线金属板将连接到电路图案的功率半导体元件之间以及功率半导体元件与电路图案之间电连接。 圆柱形主端子分别基本上垂直地接合到布线金属板和电路图案。 圆柱形控制端子基本垂直地连接到功率半导体元件中的一个。

公开(公告)号：US08258618B2

公开(公告)日：2012-09-04

申请号：US12577376

申请日：2009-10-12

申请人： Yoshiko Obiraki ,  Seiji Oka ,  Takeshi Oi

发明人： Yoshiko Obiraki ,  Seiji Oka ,  Takeshi Oi

IPC分类号： H01L23/48

CPC分类号： H01L23/4334 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01078 ,  H01L2924/13055 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The power semiconductor module includes: a circuit substrate; power semiconductor elements joined to element mounting portions of the wiring pattern on the circuit substrate; the cylindrical external terminal communication section joined to the wiring pattern; circuit forming means for connecting between portions that require electrical connection therebetween; and transfer molding resin for sealing these components. The cylindrical external terminal communication section is a metal cylinder, and the cylindrical external terminal communication section has a hole filled with gel.

摘要翻译： 功率半导体模块包括：电路基板; 功率半导体元件连接到电路基板上的布线图案的元件安装部分; 所述圆筒形外部端子连通部接合到所述布线图案; 电路形成装置，用于在需要电连接的部分之间连接; 和用于密封这些组分的传递模塑树脂。 圆筒形外部端子连通部是金属圆筒，圆筒状的外部端子连通部具有填充有凝胶的孔。

公开(公告)号：US08253236B2

公开(公告)日：2012-08-28

申请号：US13086499

申请日：2011-04-14

申请人： Takeshi Oi ,  Seiji Oka ,  Yoshiko Obiraki ,  Osamu Usui ,  Yasushi Nakayama

发明人： Takeshi Oi ,  Seiji Oka ,  Yoshiko Obiraki ,  Osamu Usui ,  Yasushi Nakayama

IPC分类号： H01L23/48

CPC分类号： H05K3/32 ,  H01L23/3121 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/284 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/10962 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

摘要： A power semiconductor device includes power semiconductor elements joined to wiring patterns of a circuit substrate, cylindrical external terminal communication sections, and wiring means for forming electrical connection between, for example, the power semiconductor elements and the cylindrical external terminal communication sections. The power semiconductor elements, the cylindrical external terminal communication sections, and the wiring means are sealed with transfer molding resin. The cylindrical external terminal communication sections are arranged on the wiring patterns so as to be substantially perpendicular to the wiring patterns, such that external terminals are insertable and connectable to the cylindrical external terminal communication sections, and such that a plurality of cylindrical external terminal communication sections among the cylindrical external terminal communication sections are arranged two-dimensionally on each of wiring patterns that act as main circuits.

摘要翻译： 功率半导体器件包括接合到电路基板的布线图案的电力半导体元件，圆柱形外部端子连通部分和用于形成例如功率半导体元件和圆筒形外部端子连接部分之间的电连接的布线装置。 功率半导体元件，圆筒形外部端子连通部分和布线装置用传递模塑树脂密封。 圆筒形的外部端子连通部分布置在布线图案上，以便大致垂直于布线图案，使得外部端子可插入并可连接到圆柱形外部端子连通部分，并且使得多个圆柱形外部端子连通部分 在作为主电路的每个布线图案上，圆柱形外部端子通信部分二维布置。