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    Stack package
    23.
    发明授权
    Stack package 有权
    堆栈包

    公开(公告)号：US08097940B2

    公开(公告)日：2012-01-17

    申请号：US12588382

    申请日：2009-10-14

    申请人： Seung-Duk Baek ,  Sun-Won Kang ,  Jong-Joo Lee

    发明人： Seung-Duk Baek ,  Sun-Won Kang ,  Jong-Joo Lee

    IPC分类号： H01L23/02

    CPC分类号： H01L25/0657 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/06136 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73257 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A stack package may include a substrate having first and second faces opposite each other and an opening formed therein. The first semiconductor chip may be mounted on the first face of the substrate and include a through electrode in the middle region of the first semiconductor chip that is exposed through the opening. The second semiconductor chip may be stacked on the first semiconductor chip and electrically connected to the first semiconductor chip by the through electrode of the first semiconductor chip. The circuit pattern may be formed on the second face of the substrate and include a bonding pad arranged adjacent to the opening and electrically connected to the through electrode of the first semiconductor chip through the opening, an outer connection pad spaced apart from the bonding pad and a connection wiring extending from the opening to the outer connection pad via the bonding pad.

    摘要翻译： 堆叠包装可以包括具有彼此相对的第一和第二面以及其中形成的开口的衬底。 第一半导体芯片可以安装在基板的第一面上，并且在通过开口暴露的第一半导体芯片的中间区域中包括通孔。 第二半导体芯片可以堆叠在第一半导体芯片上并且通过第一半导体芯片的通孔电连接到第一半导体芯片。 电路图案可以形成在基板的第二面上，并且包括邻近开口布置的焊盘，并且通过开口与第一半导体芯片的通孔电连接，与焊盘间隔开的外连接焊盘和 连接配线，从连接焊盘的开口延伸到外部连接焊盘。

    Decoupling capacitor, wafer stack package including the decoupling capacitor, and method of fabricating the wafer stack package
    24.
    发明授权
    Decoupling capacitor, wafer stack package including the decoupling capacitor, and method of fabricating the wafer stack package 有权
    去耦电容器，包括去耦电容器的晶片堆叠封装以及制造晶片堆叠封装的方法

    公开(公告)号：US07884458B2

    公开(公告)日：2011-02-08

    申请号：US11935953

    申请日：2007-11-06

    申请人： Sun-Won Kang ,  Seung-Duk Baek

    发明人： Sun-Won Kang ,  Seung-Duk Baek

    IPC分类号： H01L23/02

    CPC分类号： H01G4/06 ,  H01G4/1227 ,  H01G4/308 ,  H01L23/50 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

    摘要： A decoupling capacitor, a wafer stack package including the decoupling capacitor, and a method of fabricating the wafer stack package are provided. The decoupling capacitor may include a first electrode formed on an upper surface of a first wafer, a second electrode formed on a lower surface of a second wafer, and an adhesive material having a high dielectric constant and combining the first wafer with the second wafer. In the decoupling capacitor the first and second electrodes operate as two electrodes of the decoupling capacitor, and the adhesive material operates as a dielectric of the decoupling capacitor.

    摘要翻译： 提供去耦电容器，包括去耦电容器的晶片堆叠封装以及制造晶片堆叠封装的方法。 去耦电容器可以包括形成在第一晶片的上表面上的第一电极，形成在第二晶片的下表面上的第二电极和具有高介电常数并且将第一晶片与第二晶片组合的粘合材料。 在去耦电容器中，第一和第二电极作为去耦电容器的两个电极工作，并且粘合材料作为去耦电容器的电介质。

    TEST PROBE FOR SEMICONDUCTOR PACKAGE
    26.
    发明申请
    TEST PROBE FOR SEMICONDUCTOR PACKAGE 失效
    半导体封装的测试探针

    公开(公告)号：US20070139062A1

    公开(公告)日：2007-06-21

    申请号：US11677017

    申请日：2007-02-20

    申请人： Sun-Won Kang

    发明人： Sun-Won Kang

    IPC分类号： G01R31/02

    CPC分类号： G01R1/06733 ,  G01R1/06738

    摘要： An embodiment may comprise a test probe to measure electrical properties of a semiconductor package having ball-shaped terminals. The probe may include a signal tip and a ground tip. The signal tip may have a spherical lower surface allowing good contact with a ball-shaped signal terminal. The ground tip may be extended from a lower end of a ground barrel that encloses the signal tip. The ground tip may move independent of the signal tip by means of a barrel stopper and a spring. Thus, the probe can be used regardless of the size of and the distance between the package terminals.

    摘要翻译： 实施例可以包括用于测量具有球形端子的半导体封装的电特性的测试探针。 探头可以包括信号尖端和接地尖端。 信号尖端可以具有允许与球形信号端子良好接触的球形下表面。 接地尖端可以从包围信号尖端的接地筒的下端延伸。 接地尖端可以通过镜筒塞和弹簧独立于信号尖端移动。 因此，可以使用探针，而不管封装端子之间的尺寸和距离。

    Vehicular power window safety device
    28.
    发明授权
    Vehicular power window safety device 失效
    车载电动车窗安全装置

    公开(公告)号：US06779303B2

    公开(公告)日：2004-08-24

    申请号：US10253845

    申请日：2002-09-24

    申请人： Sang-Ryeol Park ,  Sun-Won Kang ,  Won-Suk Chun

    发明人： Sang-Ryeol Park ,  Sun-Won Kang ,  Won-Suk Chun

    IPC分类号： E05F1502

    CPC分类号： E05F15/443 ,  E05Y2900/55

    摘要： A vehicular power window safety device by which the state of a foreign object being stuck is recognized only when the foreign object makes contact with a weather strip mounted on the upper portion of a door frame, deforming the weather strip, and preventing an excessive contact between the window glass and run channel from being misjudged as an object being jammed therebetween and thereby enabling to obtain an operational trustworthiness on the power window safety device. The device comprises a motor for generating the driving power for lifting and lowering a window glass; a weather strip mounted on an upper area of a door frame and inherently provided with a sensor of which electric resistance is changed by pressure provided by a foreign object stuck in between the weather strip and the window glass due to the lifting of the window glass; and a controller for controlling the motor in response to signals supplied from the sensor.

    摘要翻译： 只有当异物与安装在门框上部的防风条接触时，才能识别异物被卡住的状态的车辆电动车窗安全装置，使防风条变形，并防止过度接触 窗玻璃和运行通道被误判为物体被卡在其间，从而能够在电动车窗安全装置上获得操作可信赖性。 该装置包括用于产生用于提升和降低窗玻璃的驱动力的电动机; 安装在门框的上部区域上的天气条，固有地设置有传感器，由于窗玻璃的提升，粘附在耐候条和窗玻璃之间的异物所施加的压力使电阻发生变化; 以及控制器，用于响应于从传感器提供的信号来控制电动机。