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公开(公告)号：US20150214188A1
公开(公告)日：2015-07-30
申请号：US14368434
申请日：2013-12-19
IPC分类号： H01L25/065 , H01L27/02 , H01L23/00
CPC分类号： H01L25/0652 , H01L23/367 , H01L23/3675 , H01L23/5226 , H01L23/5227 , H01L23/552 , H01L23/562 , H01L23/564 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L25/065 , H01L25/0657 , H01L27/0207 , H01L29/0657 , H01L2223/6677 , H01L2224/131 , H01L2224/1319 , H01L2224/16105 , H01L2224/16113 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/481 , H01L2224/48106 , H01L2224/4813 , H01L2224/48137 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/48482 , H01L2224/49 , H01L2224/73257 , H01L2224/81001 , H01L2224/81007 , H01L2224/8114 , H01L2224/81801 , H01L2224/8185 , H01L2224/85801 , H01L2225/06506 , H01L2225/0651 , H01L2225/06551 , H01L2225/06589 , H01L2924/00014 , H01L2924/19104 , H01L2224/45099 , H01L2224/05599 , H01L2224/45015 , H01L2924/207 , H01L2924/014 , H01L2924/00012
摘要： Embodiments of a flexibly-wrapped integrated circuit die device and a method for mounting a flexibly-wrapped integrated circuit die to a substrate are disclosed. In some embodiments, the flexibly-wrapped integrated circuit die device includes a substrate and a flexible integrated circuit die coupled to the substrate in a substantially vertical orientation with reference to a surface of the substrate.
摘要翻译： 公开了一种柔性包裹的集成电路管芯器件的实施例和用于将柔性封装的集成电路管芯安装到衬底的方法。 在一些实施例中，柔性包裹的集成电路管芯器件包括基板和柔性集成电路管芯，所述基板和基板相对于基板的表面以基本垂直的取向联接到基板。
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公开(公告)号：US20150048520A1
公开(公告)日：2015-02-19
申请号：US13965746
申请日：2013-08-13
CPC分类号： H01L25/0657 , H01F7/04 , H01L23/32 , H01L23/49811 , H01L23/49866 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/50 , H01L2224/10135 , H01L2224/10165 , H01L2224/11332 , H01L2224/11522 , H01L2224/132 , H01L2224/13298 , H01L2224/13355 , H01L2224/13357 , H01L2224/1336 , H01L2224/13444 , H01L2224/13464 , H01L2224/13469 , H01L2224/1601 , H01L2224/16225 , H01L2224/16227 , H01L2224/811 , H01L2224/81139 , H01L2224/8114 , H01L2224/81193 , H01L2225/06513 , H01L2225/06527 , H01L2225/06531 , H01L2225/06568 , H01L2225/06593 , H01L2225/06596 , H01L2924/014 , H01L2924/00014 , H01L2924/207 , H01L2924/00012
摘要： Embodiments of the present disclosure are directed to integrated circuit (IC) package assemblies with magnetic contacts, as well as corresponding fabrication methods and systems incorporating such magnetic contacts. A first IC substrate may have a first magnet coupled with a first electrical routing feature. A second IC substrate may have a second magnet coupled with a second electrical routing feature. The magnets may be embedded in the IC substrates and/or electrical routing features. The magnets may generate a magnetic field that extends across a gap between the first and second electrical routing features. Electrically conductive magnetic particles may be applied to one or both of the IC substrates to form a magnetic interconnect structure that extends across the gap. In some embodiments, magnetic contacts may be demagnetized by heating the magnets to a corresponding partial demagnetization temperature (PDT) or Curie temperature. Other embodiments may be described and/or claimed.
摘要翻译： 本公开的实施例涉及具有磁性触点的集成电路（IC）封装组件，以及包含这种磁性触点的对应的制造方法和系统。 第一IC基板可以具有与第一电路径特征耦合的第一磁体。 第二IC基板可以具有与第二电路径特征耦合的第二磁体。 磁体可以嵌入在IC基板和/或电路径特征中。 磁体可以产生延伸穿过第一和第二电路由特征之间的间隙的磁场。 可以将导电磁性颗粒施加到IC基板中的一个或两个以形成跨越间隙延伸的磁互连结构。 在一些实施例中，通过将磁体加热到对应的部分退磁温度（PDT）或居里温度，磁接触件可以去磁。 可以描述和/或要求保护其他实施例。
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23.发明授权公开(公告)号：US08323051B2
公开(公告)日：2012-12-04
申请号：US12933367
申请日：2009-03-14
申请人： Sven Albers
发明人： Sven Albers
IPC分类号： H01R13/73
摘要： A device (1) for implementing a dry electrical connection of a motor vehicle lock (27), comprising a fastening part (2) for a lock housing (3), wherein an electrical connection to the lock housing (3) can be implemented through an opening (4) of the fastening part (2) from a first side (5) of the fastening part (2), wherein the lock housing (3) has an external plug (7) that is positioned at a distance to the fastening part (2) and at the circumference (8) of which a flexible collar (9) is fastened, extending to the first side (5) of the fastening part (2) and forming a seal (11) with a second distance (10) to the opening (4) of the fastening part (2).
摘要翻译： 一种用于实现机动车辆锁（27）的干电连接的装置（1），包括用于锁壳（3）的紧固部分（2），其中与所述锁壳（3）的电连接可以通过 所述紧固部分（2）的所述紧固部分（2）的开口（4）从所述紧固部分（2）的第一侧（5）开始，其中所述锁定壳体（3）具有外部插塞（7） 部分（2）和在其周边（8）处的柔性套环（9）被紧固，延伸到紧固部分（2）的第一侧（5）并且形成具有第二距离的密封件（10） ）到紧固部件（2）的开口（4）。
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公开(公告)号：US20100295094A1
公开(公告)日：2010-11-25
申请号：US12848668
申请日：2010-08-02
申请人： Sven Albers , Klaus Diefenbeck , Bernd Eisener , Gernot Langguth , Christian Lehrer , Karl-Heinz Malek , Eberhard Rohrer
发明人： Sven Albers , Klaus Diefenbeck , Bernd Eisener , Gernot Langguth , Christian Lehrer , Karl-Heinz Malek , Eberhard Rohrer
CPC分类号： H01L27/0262 , H01L29/7436
摘要： An ESD protection apparatus includes a substrate, a transistor structure arranged in the substrate, and a diode structure arranged in the substrate, a high-resistance electrical connection being provided between the transistor structure and the diode structure in the substrate.
摘要翻译： ESD保护装置包括衬底，布置在衬底中的晶体管结构和布置在衬底中的二极管结构，在晶体管结构和衬底中的二极管结构之间提供高电阻电连接。
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25.发明申请公开(公告)号：US20110034042A1
公开(公告)日：2011-02-10
申请号：US12933367
申请日：2009-03-14
申请人： Sven Albers
发明人： Sven Albers
摘要： A device (1) for implementing a dry electrical connection of a motor vehicle lock (27), comprising a fastening part (2) for a lock housing (3), wherein an electrical connection to the lock housing (3) can be implemented through an opening (4) of the fastening part (2) from a first side (5) of the fastening part (2), wherein the lock housing (3) has an external plug (7) that is positioned at a distance to the fastening part (2) and at the circumference (8) of which a flexible collar (9) is fastened, extending to the first side (5) of the fastening part (2) and forming a seal (11) with a second distance (10) to the opening (4) of the fastening part (2).
摘要翻译： 一种用于实现机动车辆锁（27）的干电连接的装置（1），包括用于锁壳（3）的紧固部分（2），其中与所述锁壳（3）的电连接可以通过 所述紧固部分（2）的所述紧固部分（2）的开口（4）从所述紧固部分（2）的第一侧（5）开始，其中所述锁定壳体（3）具有外部插塞（7） 部分（2）和在其周边（8）处的柔性套环（9）被紧固，延伸到紧固部分（2）的第一侧（5）并且形成具有第二距离的密封件（10） ）到紧固部件（2）的开口（4）。
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公开(公告)号：US07816791B2
公开(公告)日：2010-10-19
申请号：US11854296
申请日：2007-09-12
申请人： Carsten Ahrens , Sven Albers , Klaus Gnannt , Ulrich Krumbein , Gunther Mackh , Patrick Schelauske , Berthold Schuderer , Georg Seidemann
发明人： Carsten Ahrens , Sven Albers , Klaus Gnannt , Ulrich Krumbein , Gunther Mackh , Patrick Schelauske , Berthold Schuderer , Georg Seidemann
CPC分类号： H01L24/05 , H01L24/45 , H01L2224/04042 , H01L2224/05147 , H01L2224/05164 , H01L2224/05556 , H01L2224/05624 , H01L2224/05644 , H01L2224/45144 , H01L2224/48624 , H01L2224/48644 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/19043 , H01L2924/00014 , H01L2924/00
摘要： A bonding pad on a substrate has a first metal structure establishing an electrical connection between a device and a bonding area, and a second metal structure arranged at the bonding area. The first metal structure extends, within the bonding area, at least over part of the bonding area between the substrate and the second metal structure, so as to contact the second metal structure, the second metal structure being harder than the first metal structure.
摘要翻译： 衬底上的接合焊盘具有在器件和接合区域之间建立电连接的第一金属结构和布置在接合区域处的第二金属结构。 所述第一金属结构在所述接合区域内延伸所述基板与所述第二金属结构之间的所述接合区域的至少一部分以与所述第二金属结构接触，所述第二金属结构比所述第一金属结构硬。
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公开(公告)号：US20080067682A1
公开(公告)日：2008-03-20
申请号：US11854296
申请日：2007-09-12
申请人： Carsten Ahrens , Sven Albers , Klaus Gnannt , Ulrich Krumbein , Gunther Mackh , Patrick Schelauske , Berthold Schuderer , Georg Seidemann
发明人： Carsten Ahrens , Sven Albers , Klaus Gnannt , Ulrich Krumbein , Gunther Mackh , Patrick Schelauske , Berthold Schuderer , Georg Seidemann
IPC分类号： H01L23/52 , H01L21/4763
CPC分类号： H01L24/05 , H01L24/45 , H01L2224/04042 , H01L2224/05147 , H01L2224/05164 , H01L2224/05556 , H01L2224/05624 , H01L2224/05644 , H01L2224/45144 , H01L2224/48624 , H01L2224/48644 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/19043 , H01L2924/00014 , H01L2924/00
摘要： A bonding pad on a substrate has a first metal structure establishing an electrical connection between a device and a bonding area, and a second metal structure arranged at the bonding area. The first metal structure extends, within the bonding area, at least over part of the bonding area between the substrate and the second metal structure, so as to contact the second metal structure, the second metal structure being harder than the first metal structure.
摘要翻译： 衬底上的接合焊盘具有在器件和接合区域之间建立电连接的第一金属结构和布置在接合区域处的第二金属结构。 所述第一金属结构在所述接合区域内延伸所述基板与所述第二金属结构之间的所述接合区域的至少一部分以与所述第二金属结构接触，所述第二金属结构比所述第一金属结构硬。
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