公开(公告)号：US20150214188A1

公开(公告)日：2015-07-30

申请号：US14368434

申请日：2013-12-19

申请人： Sven Albers ,  Michael Skinner ,  Hnas-Joachim Barth ,  Peter Baumgartner ,  Harald Gossner

发明人： Sven Albers ,  Michael Skinner ,  Hnas-Joachim Barth ,  Peter Baumgartner ,  Harald Gossner

IPC分类号： H01L25/065 ,  H01L27/02 ,  H01L23/00

CPC分类号： H01L25/0652 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/5226 ,  H01L23/5227 ,  H01L23/552 ,  H01L23/562 ,  H01L23/564 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/85 ,  H01L25/065 ,  H01L25/0657 ,  H01L27/0207 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/16105 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/481 ,  H01L2224/48106 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48482 ,  H01L2224/49 ,  H01L2224/73257 ,  H01L2224/81001 ,  H01L2224/81007 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/85801 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06551 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/19104 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/014 ,  H01L2924/00012

摘要： Embodiments of a flexibly-wrapped integrated circuit die device and a method for mounting a flexibly-wrapped integrated circuit die to a substrate are disclosed. In some embodiments, the flexibly-wrapped integrated circuit die device includes a substrate and a flexible integrated circuit die coupled to the substrate in a substantially vertical orientation with reference to a surface of the substrate.

摘要翻译： 公开了一种柔性包裹的集成电路管芯器件的实施例和用于将柔性封装的集成电路管芯安装到衬底的方法。 在一些实施例中，柔性包裹的集成电路管芯器件包括基板和柔性集成电路管芯，所述基板和基板相对于基板的表面以基本垂直的取向联接到基板。

公开(公告)号：US20150235920A1

公开(公告)日：2015-08-20

申请号：US14181325

申请日：2014-02-14

申请人： Michael P. Skinner ,  Sven Albers ,  Harald Gossner ,  Peter Baumgartner ,  Hans-Joachim Barth

发明人： Michael P. Skinner ,  Sven Albers ,  Harald Gossner ,  Peter Baumgartner ,  Hans-Joachim Barth

IPC分类号： H01L23/467 ,  H01L23/473

CPC分类号： H01L23/467 ,  H01L23/473 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/00

摘要： Embodiments of flow diversion devices (FDDs) are disclosed herein. An FDD may include a body formed of a body material and a plurality of thermally deformable fins arranged along the body. Individual fins of the plurality of fins may include first and second materials having different coefficients of thermal expansion (CTEs). Other embodiments may be disclosed and/or claimed.

摘要翻译： 流分流装置（FDD）的实施例在此公开。 FDD可以包括由主体材料形成的主体和沿着主体布置的多个可热变形的翅片。 多个翅片中的各个翅片可以包括具有不同热膨胀系数（CTE）的第一和第二材料。 可以公开和/或要求保护其他实施例。

公开(公告)号：US09793220B2

公开(公告)日：2017-10-17

申请号：US13729145

申请日：2012-12-28

申请人： Hans-Joachim Barth ,  Horst Baumeister ,  Peter Baumgartner ,  Philipp Riess ,  Jesenka Veledar Krueger

发明人： Hans-Joachim Barth ,  Horst Baumeister ,  Peter Baumgartner ,  Philipp Riess ,  Jesenka Veledar Krueger

IPC分类号： G01R31/3187 ,  G01R31/26 ,  H01L23/544 ,  H01L27/04 ,  H01L23/00 ,  H01L23/64

CPC分类号： H01L23/544 ,  H01L23/562 ,  H01L23/642 ,  H01L27/04 ,  H01L2224/16225

摘要： A capacitive sensor and measurement circuitry is described that may be able to reproducibly measure miniscule capacitances and variations thereof. The capacitance may vary depending upon local environmental conditions such as mechanical stress (e.g., warpage or shear stress), mechanical pressure, temperature, and/or humidity. It may be desirable to provide a capacitor integrated into a semiconductor chip that is sufficiently small and sensitive to accurately measure conditions expected to be experienced by a semiconductor chip.

公开(公告)号：US20150001689A1

公开(公告)日：2015-01-01

申请号：US13931902

申请日：2013-06-29

申请人： Edmund Goetz ,  Bernd Memmler ,  Jan-Erik Mueller ,  Peter Baumgartner

发明人： Edmund Goetz ,  Bernd Memmler ,  Jan-Erik Mueller ,  Peter Baumgartner

IPC分类号： H01L23/552 ,  H01L25/00

CPC分类号： H04B1/40 ,  H01L21/6835 ,  H01L23/04 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/17 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2223/6644 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/1421 ,  H01L2924/143 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

摘要： Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

摘要翻译： 描述半导体封装内的射频屏蔽。 在一个示例中，多芯片封装在数字芯片和射频芯片之间具有数字芯片，射频芯片和隔离层。 盖子包围数字芯片和射频芯片。

公开(公告)号：US08569820B2

公开(公告)日：2013-10-29

申请号：US13344714

申请日：2012-01-06

申请人： Hans-Joachim Barth ,  Erwin Ruderer ,  Alexander Von Glasow ,  Philipp Riess ,  Erdem Kaltalioglu ,  Peter Baumgartner ,  Thomas Benetik ,  Helmut Horst Tews

发明人： Hans-Joachim Barth ,  Erwin Ruderer ,  Alexander Von Glasow ,  Philipp Riess ,  Erdem Kaltalioglu ,  Peter Baumgartner ,  Thomas Benetik ,  Helmut Horst Tews

IPC分类号： H01L27/108

CPC分类号： H01L27/0805 ,  H01L23/5223 ,  H01L2924/0002 ,  H01L2924/00

摘要： Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a capacitor plate includes a plurality of first parallel conductive members, and a plurality of second parallel conductive members disposed over the plurality of first parallel conductive members. A first base member is coupled to an end of the plurality of first parallel conductive members, and a second base member is coupled to an end of the plurality of second parallel conductive members. A connecting member is disposed between the plurality of first parallel conductive members and the plurality of second parallel conductive members, wherein the connecting member includes at least one elongated via.

摘要翻译： 公开了半导体器件及其制造方法。 在一个实施例中，电容器板包括多个第一平行导电构件，以及设置在多个第一平行导电构件上的多个第二平行导电构件。 第一基座构件联接到多个第一平行导电构件的端部，并且第二基座构件联接到多个第二平行导电构件的端部。 连接构件设置在多个第一平行导电构件和多个第二平行导电构件之间，其中连接构件包括至少一个细长通孔。

公开(公告)号：US08246073B2

公开(公告)日：2012-08-21

申请号：US12585300

申请日：2009-09-10

申请人： Oliver Glöckler ,  Peter Baumgartner

发明人： Oliver Glöckler ,  Peter Baumgartner

IPC分类号： B60R21/16 ,  B60R21/20 ,  B60R21/201 ,  B60R21/217 ,  B60R21/26

CPC分类号： B60R21/2171 ,  B60R21/201

摘要： An airbag arrangement for a vehicle occupant restraint system is provided. The airbag arrangement comprising an airbag folded into an airbag package, a cover that may be evacuated and encloses the airbag package, a gas generator for inflating the airbag, a receptacle formed by a section of the cover enclosing the airbag package and in which at least one section of the gas generator is housed. The airbag comprising an opening, which forms an inlet to an inflatable area of the airbag and in which the receptacle is arranged at least sectionally or into which the receptacle projects. The gas generator is formed as a tubular gas generator. The opening has a hollow cylindrical area in which the receptacle is arranged, or the opening is formed as a hole in an airbag layer which forms a chamber of the airbag.

摘要翻译： 提供了一种用于车辆乘员约束系统的气囊装置。 气囊装置包括折叠成安全气囊包的气囊，可以被抽空并包围气囊包的盖子，用于使气囊膨胀的气体发生器，由封闭气囊包装的盖的一部分形成的容器，其中至少 气体发生器的一部分被容纳。 所述气囊包括开口，所述开口形成到所述气囊的可充气区域的入口，并且所述容器至少部分地布置在所述容器中，或者所述容器突出于所述入口中。 气体发生器形成为管状气体发生器。 开口具有中空圆柱形区域，其中插座被布置，或者开口形成为形成气囊的室的气囊层中的孔。

公开(公告)号：US08067287B2

公开(公告)日：2011-11-29

申请号：US12036911

申请日：2008-02-25

申请人： Peter Baumgartner

发明人： Peter Baumgartner

IPC分类号： H01L21/336

CPC分类号： H01L29/4238 ,  H01L29/66659 ,  H01L29/78

摘要： Structures, layouts and methods of forming integrated circuits are described. In various embodiments, the current invention includes an asymmetric segmented transistor. The asymmetric segmented transistor includes a source region and a drain region disposed within an active region, a floating source/drain region disposed within the active region, a first channel region disposed in the active region between the source region and the floating source/drain region, the first channel having a first length and a first width. A second channel region is disposed in the active region between the drain region and the floating source/drain region, the second channel having a second length and a second width. A first gate dielectric overlies the first channel region and a second gate dielectric overlies the second channel region. A gate line overlies the first gate dielectric and the second gate dielectric.

摘要翻译： 描述形成集成电路的结构，布局和方法。 在各种实施例中，本发明包括非对称分段晶体管。 非对称分段晶体管包括设置在有源区内的源极区域和漏极区域，设置在有源区域内的浮动源极/漏极区域，设置在源极区域和浮置源极/漏极区域之间的有源区域中的第一沟道区域 所述第一通道具有第一长度和第一宽度。 第二沟道区域设置在漏极区域和浮置源极/漏极区域之间的有源区域中，第二沟道具有第二长度和第二宽度。 第一栅极电介质覆盖第一沟道区，第二栅极电介质覆盖第二沟道区。 栅极线覆盖第一栅极电介质和第二栅极电介质。

公开(公告)号：US20100283229A1

公开(公告)日：2010-11-11

申请号：US12662830

申请日：2010-05-05

申请人： Jens Feller ,  Torsten Schmidt ,  Peter Baumgartner ,  Thomas Steck

发明人： Jens Feller ,  Torsten Schmidt ,  Peter Baumgartner ,  Thomas Steck

IPC分类号： B60R21/16 ,  B60N2/02

CPC分类号： B60R21/207 ,  B60N2/449 ,  B60N2/986

摘要： A vehicle seat of a motor vehicle is provided. The vehicle seat comprising a backrest which includes a middle part and at least one side bolster, a gas bag module with a folded gas bag, which is at least partly arranged in the side bolster, an adjusting element for adjusting a width of the backrest, which is at least partly arranged in the side bolster and is movable relative to the middle part, by means of which the position of the side bolster relative to the middle part can be varied, and a seat frame extending in the side bolster, which in the vehicle seat mounted in the motor vehicle is aligned along the longitudinal axis of the vehicle. At least part of the folded gas bag is arranged before the seat frame with respect to the longitudinal axis of the vehicle.

摘要翻译： 提供机动车辆的车辆座椅。 所述车辆座椅包括靠背，所述靠背包括中间部分和至少一个侧枕，具有折叠气囊的气囊模块，其至少部分地布置在所述侧枕中;调节元件，用于调节所述靠背的宽度; 其至少部分地布置在侧枕垫中并且可相对于中间部分移动，通过该中间部件可以改变侧枕垫相对于中间部分的位置，以及在侧枕中延伸的座架， 安装在机动车辆中的车辆座椅沿着车辆的纵向轴线对齐。 折叠的气囊的至少一部分相对于车辆的纵向轴线布置在座椅框架之前。

公开(公告)号：US20100043185A1

公开(公告)日：2010-02-25

申请号：US12585708

申请日：2009-09-22

申请人： Peter Baumgartner ,  Bernd Schumacher

发明人： Peter Baumgartner ,  Bernd Schumacher

IPC分类号： A44B17/00 ,  B25B27/00

CPC分类号： B60R21/18 ,  Y10T24/304 ,  Y10T24/307 ,  Y10T24/45262 ,  Y10T29/53909

摘要： An attachment arrangement is provided. The attachment arrangement comprising a mounting structure having an opening, an attachment element to be inserted into the opening for attaching a part to the mounting structure, and a locking element of the attachment element for locking the attachment element to the mounting structure. Said locking element being inserted as a part of the attachment element along an insertion direction into the opening in the mounting structure up to an end position and engaging behind the opening in the end position such that it prevents removal of the attachment element from the opening (75) and thus locks the attachment element to the mounting structure. Said locking element having at least a first and a second section that rest against the edge of the opening in succession when inserting the attachment element through the opening.

摘要翻译： 提供附件装置。 所述附接装置包括具有开口的安装结构，待插入到所述开口中的用于将部件附接到所述安装结构的附接元件以及用于将所述附接元件锁定到所述安装结构的所述附接元件的锁定元件。 所述锁定元件作为附接元件的一部分沿着插入方向插入到安装结构中的开口中直到终止位置，并且在端部位置处接合在开口后面，使得其防止附接元件从开口移除（ 75），从而将附接元件锁定到安装结构。 所述锁定元件具有至少第一和第二部分，当将附接元件穿过开口插入时，第一和第二部分连续地抵靠开口的边缘。

公开(公告)号：US20090309162A1

公开(公告)日：2009-12-17

申请号：US12484682

申请日：2009-06-15

申请人： Peter Baumgartner ,  Domagoj Siprak

发明人： Peter Baumgartner ,  Domagoj Siprak

IPC分类号： H01L25/065 ,  H01L29/772 ,  H01L21/335

CPC分类号： H01L29/785 ,  H01L29/66818 ,  H01L29/7856

摘要： A semiconductor device includes at least one source region and at least one drain region. A plurality of fins extend between a source region and a drain region, wherein at least one fin has a different width than another fin. At least one gate is provided to control current flow through such fins. Fin spacing may be varied in addition to, or alternative to utilizing different fin widths.

摘要翻译： 半导体器件包括至少一个源极区和至少一个漏极区。 多个翅片在源区域和漏极区域之间延伸，其中至少一个鳍片具有与另一个翅片不同的宽度。 提供至少一个门以控制通过这种翅片的电流。 翅片间距可以除了利用不同翅片宽度之外或替代以改变。