公开(公告)号：US20180095426A1

公开(公告)日：2018-04-05

申请号：US15282615

申请日：2016-09-30

申请人： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

发明人： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

IPC分类号： G04B37/14 ,  H04B1/3827 ,  A44C5/02 ,  A44C5/00 ,  A44C5/14

CPC分类号： G04B37/1486 ,  A44C5/0053 ,  A44C5/02 ,  A44C5/105 ,  A44C5/14 ,  G06F1/163 ,  H04B1/385 ,  H04B2001/3861 ,  H04W4/80

摘要： A flexible band wearable electronic device includes a plurality of rigid links. The flexible band wearable electronic device also includes a number of pivot joints coupling the plurality of rigid links together. The flexible band wearable electronic device further includes a first electronic device on a first of the plurality of rigid links, and a second electronic device on a second of the plurality of rigid links. The flexible band wearable electronic device still further includes an electrical communication pathway between first electronic device and the second electronic device and through at least a portion of one of the number of pivot joints.

公开(公告)号：US20150282367A1

公开(公告)日：2015-10-01

申请号：US14227977

申请日：2014-03-27

申请人： Hans-Joachim Barth ,  Reinhard Mahnkopf ,  Sven Albers ,  Thorsten Meyer

发明人： Hans-Joachim Barth ,  Reinhard Mahnkopf ,  Sven Albers ,  Thorsten Meyer

IPC分类号： H05K7/02 ,  H05K13/00 ,  H05K3/36

CPC分类号： H05K7/02 ,  H01L23/3128 ,  H01L24/19 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06558 ,  H01L2924/15311 ,  H05K3/36 ,  H05K7/023 ,  H05K13/00 ,  H05K2203/06 ,  Y10T156/10

摘要： An electronic assembly that includes a first electronic component that includes a first substrate having a front side and a back side and at least one electronic assembly mounted on the front side of the first substrate, a second electronic component that includes a second substrate having a front side and a back side and at least one electronic assembly mounted on the front side of the second substrate, and wherein the back side of the first substrate is directly attached to the back side of the second substrate.

摘要翻译： 一种电子组件，其包括第一电子部件，所述第一电子部件包括具有前侧和后侧的第一基板和安装在所述第一基板的前侧上的至少一个电子组件，所述第二电子部件包括具有前部的第二基板 侧面和背面以及安装在第二基板的前侧上的至少一个电子组件，并且其中第一基板的背面直接附接到第二基板的背面。

公开(公告)号：US20150235920A1

公开(公告)日：2015-08-20

申请号：US14181325

申请日：2014-02-14

申请人： Michael P. Skinner ,  Sven Albers ,  Harald Gossner ,  Peter Baumgartner ,  Hans-Joachim Barth

发明人： Michael P. Skinner ,  Sven Albers ,  Harald Gossner ,  Peter Baumgartner ,  Hans-Joachim Barth

IPC分类号： H01L23/467 ,  H01L23/473

CPC分类号： H01L23/467 ,  H01L23/473 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/00

摘要： Embodiments of flow diversion devices (FDDs) are disclosed herein. An FDD may include a body formed of a body material and a plurality of thermally deformable fins arranged along the body. Individual fins of the plurality of fins may include first and second materials having different coefficients of thermal expansion (CTEs). Other embodiments may be disclosed and/or claimed.

摘要翻译： 流分流装置（FDD）的实施例在此公开。 FDD可以包括由主体材料形成的主体和沿着主体布置的多个可热变形的翅片。 多个翅片中的各个翅片可以包括具有不同热膨胀系数（CTE）的第一和第二材料。 可以公开和/或要求保护其他实施例。

公开(公告)号：US20140197530A1

公开(公告)日：2014-07-17

申请号：US13739045

申请日：2013-01-11

申请人： Thorsten Meyer ,  Sven Albers ,  Christian Geissler ,  Andreas Wolter ,  Markus Brunnbauer ,  David O'Sullivan ,  Frank Zudock ,  Jan Proschwitz

发明人： Thorsten Meyer ,  Sven Albers ,  Christian Geissler ,  Andreas Wolter ,  Markus Brunnbauer ,  David O'Sullivan ,  Frank Zudock ,  Jan Proschwitz

IPC分类号： H01L23/29 ,  H01L21/56

CPC分类号： H01L23/315 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/562 ,  H01L24/19 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device is described having at least one semiconductor chip, the chip having an active area on a top side thereof, the active area formed at least in part of low-k material, said low-k material defining a low-k subarea of said active area; an embedding material, in which said at least one semiconductor chip is embedded, at least part of the embedding material forming a coplanar area with said active area; at least one contact area within the low-k subarea; a redistribution layer on the coplanar area, the redistribution layer connected to said contact areas; at least one first-level interconnect, located outside said low-k subarea, the first-level interconnect electrically connected to at least one of said contact areas via the redistribution layer.

摘要翻译： 描述了半导体器件，其具有至少一个半导体芯片，该芯片在其顶侧具有有源区，至少部分形成在低k材料上的有源区，所述低k材料限定低k分区 说活跃区; 嵌入材料，其中所述至少一个半导体芯片被嵌入，所述嵌入材料的至少一部分与所述有源区域形成共面区域; 低k子区域内的至少一个接触区域; 在共面区域上的再分配层，再分配层连接到所述接触区域; 位于所述低k子区域外的至少一个第一级互连，所述第一级互连经由再分配层电连接到所述接触区域中的至少一个。

公开(公告)号：US08154049B2

公开(公告)日：2012-04-10

申请号：US12848668

申请日：2010-08-02

申请人： Sven Albers ,  Klaus Diefenbeck ,  Bernd Eisener ,  Gernot Langguth ,  Christian Lehrer ,  Karl-Heinz Malek ,  Eberhard Rohrer

发明人： Sven Albers ,  Klaus Diefenbeck ,  Bernd Eisener ,  Gernot Langguth ,  Christian Lehrer ,  Karl-Heinz Malek ,  Eberhard Rohrer

IPC分类号： H01L29/72

CPC分类号： H01L27/0262 ,  H01L29/7436

摘要： An ESD protection apparatus includes a substrate, a transistor structure arranged in the substrate, and a diode structure arranged in the substrate, a high-resistance electrical connection being provided between the transistor structure and the diode structure in the substrate.

摘要翻译： ESD保护装置包括衬底，布置在衬底中的晶体管结构和布置在衬底中的二极管结构，在晶体管结构和衬底中的二极管结构之间提供高电阻电连接。

公开(公告)号：US20180092443A1

公开(公告)日：2018-04-05

申请号：US15282633

申请日：2016-09-30

申请人： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

发明人： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

IPC分类号： A44C5/02 ,  H04B1/3827 ,  A45F5/00 ,  A44C5/00 ,  G01D11/30 ,  A61B5/0205 ,  A61B5/00

CPC分类号： G06F1/163 ,  A44C5/00 ,  A44C5/02 ,  A44C5/105 ,  A45F5/00 ,  A45F2005/008 ,  A45F2200/0508 ,  A61B5/02055 ,  A61B5/021 ,  A61B5/02438 ,  A61B5/1112 ,  A61B5/681 ,  A61B2560/0257 ,  A61B2560/0443 ,  A61B2562/0219 ,  G04B37/1486 ,  G04B47/00 ,  H04B1/385

摘要： A flexible band wearable electronic device includes a plurality of rigid links. The flexible band wearable electronic device also includes a number of pivot joints coupling the plurality of rigid links together. The flexible band wearable electronic device further includes a first electronic device on a first of the plurality of rigid links, and a second electronic device on a second of the plurality of rigid links. The flexible band wearable electronic device still further includes an electrical communication pathway between first electronic device and the second electronic device and through at least a portion of one of the number of pivot joints.

公开(公告)号：US20150333022A1

公开(公告)日：2015-11-19

申请号：US14280110

申请日：2014-05-16

申请人： Sven Albers ,  Georg Seidemann ,  Sonja Koller ,  Stephan Stoeckl ,  Shubhada H. Sahasrabudhe ,  Sandeep B. Sane

发明人： Sven Albers ,  Georg Seidemann ,  Sonja Koller ,  Stephan Stoeckl ,  Shubhada H. Sahasrabudhe ,  Sandeep B. Sane

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/05 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/141 ,  H01L2224/16238 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/0373

摘要： Disclosed herein are contact pads for use with integrated circuit (IC) packages. In some embodiments, a contact pad disclosed herein may be disposed on a substrate of an IC package, and may include a metal projection portion and a metal recess portion. Each of the metal projection portion and the metal recess portion may have a solder contact surface. The solder contact surface of the metal recess portion may be spaced away from the solder contact surface of the metal projection portion. Related devices and techniques are also disclosed herein, and other embodiments may be claimed.

摘要翻译： 这里公开了与集成电路（IC）封装一起使用的接触焊盘。 在一些实施例中，本文公开的接触垫可以设置在IC封装的基板上，并且可以包括金属突出部分和金属凹部。 金属突出部和金属凹部中的每一个可以具有焊料接触表面。 金属凹部的焊接接触表面可以与金属突出部的焊接接触表面间隔开。 本文还公开了相关的设备和技术，并且可以要求保护其他实施例。

公开(公告)号：US20150282308A1

公开(公告)日：2015-10-01

申请号：US14229476

申请日：2014-03-28

申请人： Thorsten Meyer ,  Gerald Ofner ,  Sven Albers ,  Reinhard Mahnkopf

发明人： Thorsten Meyer ,  Gerald Ofner ,  Sven Albers ,  Reinhard Mahnkopf

IPC分类号： H05K1/03 ,  H05K1/18 ,  H05K7/02 ,  H05K1/02

CPC分类号： H05K1/181 ,  H01L21/568 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5227 ,  H01L23/66 ,  H01L24/00 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/04042 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19105 ,  H05K1/0233 ,  H05K1/0292 ,  H05K1/162 ,  H05K1/165 ,  H05K1/185 ,  H05K3/4644 ,  H05K2201/10636 ,  H05K2203/1469 ,  H05K2203/171 ,  H05K2203/173 ,  H05K2203/175 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00

摘要： Passive electrical devices are described with a polymer carrier. In one example, a conductive layer is formed over a polymer substrate in a pattern to form a passive electrical device and at least two terminals of the device. A plurality of external connection pads are connected to the terminals of the device.

摘要翻译： 无源电器件用聚合物载体描述。 在一个示例中，导电层以图案形成在聚合物基板上，以形成无源电器件和器件的至少两个端子。 多个外部连接焊盘连接到设备的端子。

公开(公告)号：US20140264914A1

公开(公告)日：2014-09-18

申请号：US13833514

申请日：2013-03-15

申请人： Thorsten Meyer ,  Sven Albers ,  Andreas Wolter

发明人： Thorsten Meyer ,  Sven Albers ,  Andreas Wolter

IPC分类号： H01L23/48 ,  H01L21/66

CPC分类号： H01L25/105 ,  H01L21/568 ,  H01L22/14 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3135 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/16225 ,  H01L2924/00012

摘要： An electronic package includes an interposer, a die attached to a first side of the interposer, an embedded electronic package attached to a second side of the interposer, an encapsulation compound, a set of vias providing electrical paths from a first side of the electronic package to the interposer through the encapsulation compound, and a redistribution layer electrically redistributing the set of vias to form a set of interconnect-pads. Either the die or the embedded electronic package, or both, are electrically connected to the interposer.

摘要翻译： 电子封装包括插入器，附接到插入件的第一侧的管芯，附接到插入件的第二侧的嵌入式电子封装，封装化合物，从电子封装的第一侧提供电路径的一组通孔 通过所述封装化合物施加到所述插入件，以及再分布层，电再重分配所述一组通孔以形成一组互连焊盘。 芯片或嵌入式电子封装或两者都电连接到插入器。

公开(公告)号：US20140264832A1

公开(公告)日：2014-09-18

申请号：US13802848

申请日：2013-03-14

申请人： Thorsten Meyer ,  Hans-Joachim Barth ,  Reinhard Mahnkopf ,  Sven Albers ,  Andreas Augustin ,  Christian Mueller

发明人： Thorsten Meyer ,  Hans-Joachim Barth ,  Reinhard Mahnkopf ,  Sven Albers ,  Andreas Augustin ,  Christian Mueller

IPC分类号： H01L23/00

CPC分类号： H01L24/17 ,  H01L23/5256 ,  H01L23/5382 ,  H01L25/0657 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/1703 ,  H01L2224/17107 ,  H01L2224/17154 ,  H01L2224/17181 ,  H01L2224/17517 ,  H01L2224/81193 ,  H01L2924/12042 ,  H01L2924/014 ,  H01L2924/00

摘要： A chip arrangement may include: a first chip including a first contact, a second contact, and a redistribution structure electrically coupling the first contact to the second contact; a second chip including a contact; and a plurality of interconnects electrically coupled to the second contact of the first chip, wherein at least one interconnect of the plurality of interconnects electrically couples the second contact of the first chip to the contact of the second chip.

摘要翻译： 芯片布置可以包括：第一芯片，其包括第一触点，第二触点和将第一触点电耦合到第二触点的再分配结构; 包括触点的第二芯片; 以及电耦合到第一芯片的第二触点的多个互连，其中多个互连件中的至少一个互连将第一芯片的第二触点电耦合到第二芯片的触点。