公开(公告)号：US20100271831A1

公开(公告)日：2010-10-28

申请号：US12832040

申请日：2010-07-07

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: F21V21/00 ,  H01B1/20 ,  C08K3/04 ,  C08K3/08 ,  H01L23/29 ,  C08L63/00

CPC classification number: H01C7/1006 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0738 ,  H05K2203/0723 ,  H05K2203/105 ,  Y10S977/742 ,  Y10S977/779 ,  Y10T428/30 ,  Y10T428/31678

Abstract: One or more embodiments provide for a light emitting diode device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio.

Abstract translation: 一个或多个实施例提供一种利用具有相对较高纵横比的半导体或导电材料的可开关电介质材料的发光二极管器件。

公开(公告)号：US07732318B2

公开(公告)日：2010-06-08

申请号：US11315153

申请日：2005-12-23

Applicant: Gee Sung Chae ,  Mi Kyung Park

Inventor： Gee Sung Chae ,  Mi Kyung Park

IPC: H01L21/00

CPC classification number: H05K3/101 ,  H01L21/288 ,  H01L21/76838 ,  H01L27/1292 ,  H05K3/04 ,  H05K3/102 ,  H05K2201/0257 ,  H05K2201/0272 ,  H05K2203/0108 ,  Y10S977/777

Abstract: A fabricating method of a flat panel display device can reduce manufacturing costs of the flat panel display device. A fabricating method of a flat panel display device includes providing a conductive nanopowder thin film material having a first conductive nanopowder and a second conductive nanopowder, spreading the conductive nanopowder thin film material over a substrate, forming a conductive thin film pattern by patterning the conductive nanopowder thin film material, and forming a conductive thin film by baking the conductive thin film pattern, wherein the first conductive nanopowder is located in a middle of the conductive thin film and the second conductive nanopowder is located in an outer part of the conductive thin film.

Abstract translation: 平板显示装置的制造方法可以降低平板显示装置的制造成本。 平板显示装置的制造方法包括提供具有第一导电纳米粉末和第二导电纳米粉末的导电纳米粉末薄膜材料，将导电纳米粉末薄膜材料铺展在基板上，通过图案化导电纳米粉末形成导电薄膜图案 薄膜材料，并通过烘烤导电薄膜图案形成导电薄膜，其中第一导电纳米粉末位于导电薄膜的中间，第二导电纳米粉末位于导电薄膜的外部。

公开(公告)号：US20100009153A1

公开(公告)日：2010-01-14

申请号：US12483190

申请日：2009-06-11

Applicant: Zhihao Yang ,  Zhiyoung Xu ,  Yu Du

Inventor： Zhihao Yang ,  Zhiyoung Xu ,  Yu Du

IPC: B32B27/00 ,  H01B1/12 ,  B05D5/12

CPC classification number: H01B1/22 ,  C08K3/08 ,  C09D7/67 ,  C09D7/69 ,  C09D7/70 ,  C09D11/037 ,  C09D11/52 ,  C09D17/006 ,  H05K1/097 ,  H05K2201/0266 ,  H05K2201/0272

Abstract: A composition comprises at least one silver nanoparticulate material, at least one conductive microparticulate material, and less than about 3% wt of an organic or polymeric resin. The composition provides a low curing temperature and upon cure good film properties. Also provided herein is a method of using an ink or paste, comprising: (i) providing the ink or paste comprising at least one silver nanoparticulate material, at least one conductive microparticulate material, and less than about 3% wt of an organic or polymeric resin; and (ii) curing the ink or paste at a temperature at lower than about 200° C. to decompose the organic resin.

Abstract translation: 组合物包含至少一种银纳米颗粒材料，至少一种导电微粒材料和小于约3重量％的有机或聚合物树脂。 该组合物提供低固化温度并且在固化时具有良好的膜性能。 本文还提供了使用油墨或糊剂的方法，其包括：（i）提供包含至少一种银纳米颗粒材料，至少一种导电微粒材料和小于约3重量％的有机或聚合物的油墨或糊料 树脂; 和（ii）在低于约200℃的温度下固化油墨或糊状物以分解有机树脂。

公开(公告)号：US20090194745A1

公开(公告)日：2009-08-06

申请号：US12306859

申请日：2007-06-26

Applicant: Norihito Tanaka ,  Tsuyoshi Shiratori

Inventor： Norihito Tanaka ,  Tsuyoshi Shiratori

IPC: H01B1/22

CPC classification number: H05K3/3484 ,  B23K35/262 ,  B23K35/30 ,  C22C13/02 ,  H05K2201/0272

Abstract: Disclosed is a conductive filler which can be fusion-bonded under lower temperature conditions (with the peak temperature of not less than 181° C.) than the reflow heat treatment conditions for an Sn-37Pb eutectic solder. This conductive filler is applicable to heat-resistant uses similar to those of the Sn-37Pb eutectic solder. The conductive filler is a mixture of first metal particles composed of an alloy having a chemical composition including 25-40% by mass of Ag, 2-8% by mass of Bi, 5-15% by mass of Cu, 2-8% by mass of In and 29-66% by mass of Sn, and second metal particles composed of an alloy having a chemical composition including 5-20% by mass of Ag, 10-20% by mass of Bi, 1-15% by mass of Cu and 50-80% by mass of Sn. In the mixture, 20-10,000 parts by mass of the second metal particles are contained per 100 parts by mass of the first metal particles.

Abstract translation: 公开了一种导电填料，其可以在比Sn-37Pb共晶焊料的回流热处理条件更低的温度条件（峰值温度不低于181℃）下进行熔融粘结。 该导电填料适用于与Sn-37Pb共晶焊料类似的耐热用途。 导电性填料是由Ag，25〜40质量％，Bi：2-8质量％，Cu：5〜15质量％，Cu：2-8质量％ 的In和29-66质量％的Sn，第二金属粒子由化学成分含有5〜20质量％的Ag，10〜20质量％的Bi，1-15质量％ Cu的质量和Sn的50〜80质量％。 在该混合物中，每100质量份的第一金属粒子含有20〜10000质量份的第二金属粒子。

公开(公告)号：US20080206553A1

公开(公告)日：2008-08-28

申请号：US12066340

申请日：2006-08-31

Applicant: Norbert Schneider ,  Gerald Lippert ,  Rene Lochtman ,  Heiko Maas ,  Jurgen Pfister ,  Bettina Sobotka ,  Norbert Wagner

Inventor： Norbert Schneider ,  Gerald Lippert ,  Rene Lochtman ,  Heiko Maas ,  Jurgen Pfister ,  Bettina Sobotka ,  Norbert Wagner

IPC: B32B33/00 ,  C09D5/24 ,  C25D5/54 ,  B05D5/12

CPC classification number: H01B1/22 ,  C09D5/24 ,  H05K1/095 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0347 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258

Abstract: The present invention relates to a dispersion for application of a metal layer on a substrate that is not electrically conductive, comprising an organic binder component, a metal component with different metals and/or metal particle shapes, and with a solvent component. The invention moreover relates to a process for preparation of the dispersion, to a process using the dispersion for production of a metal layer, if appropriate structured, and to the resultant substrate surfaces and their use.

Abstract translation: 本发明涉及一种用于在不导电的基底上施加金属层的分散体，其包含有机粘合剂组分，具有不同金属和/或金属颗粒形状的金属组分以及溶剂组分。 本发明还涉及制备分散体的方法，使用该分散体制备金属层的方法，如果合适的结构，以及所得到的基材表面及其用途。

公开(公告)号：US20080179618A1

公开(公告)日：2008-07-31

申请号：US11627489

申请日：2007-01-26

Applicant: CHING-TAI CHENG

Inventor： CHING-TAI CHENG

IPC: H01L33/00 ,  H05K7/20

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/0224 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0323 ,  H05K2201/10106 ,  H05K2201/10113 ,  H01L2924/00014

Abstract: Light-emitting diode (LED) packages with improved heat transfer paths for LED dies encased therein when compared to conventional LED packages are provided. For some embodiments, the LED package includes a ceramic substrate having a top cavity with one or more LED dies disposed within and having a bottom cavity for receiving a metallic insert to dissipate heat away from the LED dies. For other embodiments, an LED package is provided that includes a ceramic substrate having a heat spreader coupled to thermal vias filled with a highly thermally conductive composite.

Abstract translation: 提供了与常规LED封装相比，其中封装有LED管芯的改善的传热路径的发光二极管（LED）封装。 对于一些实施例，LED封装包括具有顶部空腔的陶瓷衬底，所述顶部空腔具有设置在其内的一个或多个LED管芯，并且具有底部空腔，用于接收金属插入件以将热量从LED管芯散开。 对于其他实施例，提供了一种LED封装，其包括陶瓷衬底，该陶瓷衬底具有耦合到填充有高导热性复合材料的热通孔的散热器。

公开(公告)号：US20070110969A1

公开(公告)日：2007-05-17

申请号：US11594134

申请日：2006-11-08

Applicant: Yuuji Suzuki ,  Yuuki Kikuchi ,  Satoru Zama

Inventor： Yuuji Suzuki ,  Yuuki Kikuchi ,  Satoru Zama

IPC: B32B3/00

CPC classification number: H05K3/384 ,  B32B15/08 ,  B32B15/20 ,  H05K3/4069 ,  H05K2201/0272 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0425 ,  H05K2203/0723 ,  H05K2203/1461 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/24917

Abstract: A through-hole type laminated circuit board is given with high reliability of electrical connection using copper foil and conductive paste containing low melting point metal without generating harmful void and crack at boundary between the copper foil and conductive paste metal. The laminated circuit board is made by laminating a multiple number of resin boards with roughening treated copper foils at least on their one surface sides with roughening projection deposition of less than 150 mg/dm2 to make surface roughness Rz of 0.3 to 10 μm and height of the projection to be 0.3 to 10 μm. Surface roughness of the original foil is 0.1 to 5 μm and the amount of copper metal atoms of roughening treated layer is set at 4 times or less than the amount of diffusible conductive paste metal atoms containing low melting point metal into the roughening treated layer on the foil surface.

Abstract translation: 通过使用铜箔和含有低熔点金属的导电膏，电连接的可靠性高，而不会在铜箔和导电膏金属之间的边界处产生有害的空隙和裂纹。 叠层电路板是通过将至少在其一个表面侧上至少具有粗糙化处理的铜箔的多个树脂板层压而成的，其粗化投影沉积小于150mg / dm 2以使表面粗糙度Rz 为0.3〜10μm，突出部的高度为0.3〜10μm。 原始箔的表面粗糙度为0.1〜5μm，粗化处理层的铜金属原子的量设定为含有低熔点金属的扩散性导电性糊状金属原子的量的4倍以下 箔表面。

公开(公告)号：US20060194920A1

公开(公告)日：2006-08-31

申请号：US10550408

申请日：2004-03-30

Applicant: Miguel Capote ,  Alan Grieve

Inventor： Miguel Capote ,  Alan Grieve

IPC: C08K3/10 ,  C08F20/02

CPC classification number: C09J9/00 ,  C08F220/26 ,  C08F222/1006 ,  C08K3/08 ,  C08K5/0025 ,  C08L63/00 ,  C09J4/00 ,  C09J11/04 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/0215 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y02P70/613 ,  C08F220/10 ,  H01L2924/00

Abstract: Thermally conductive, sinterable, adhesive compositions, free of fugitive solvents, that include a powder of a relatively high melting point metal or metal alloy, a powder of a relatively low melting point metal or metal alloy powder and a thermally curable adhesive flux composition that comprises (i) a polymerizable fluxing agent; (ii) an inerting agent to react with the fluxing agent at elevated temperature, rendering it inert. The fluxing agent preferably comprises a compound with formula RCOOH, wherein R comprises a moiety having one or more polymerizable carbon-carbon double bonds. Optionally, the inventive compositions also include (a) a diluent that is capable of polymerizing with the fluxing agent's polymerizable carbon-carbon double bonds; (b) free radical initiators; (c) a curable resin; and (d) crosslinking agents and accelerators. The compositions can be applied directly onto the surfaces of devices to be joined mechanically and/or electrically and are ideally suited for semiconductor die attachment. During heating, the fluxing agent promotes wetting of the high melting point powder by the molten low melting point powder, causing liquid phase sintering of the powders. The fluxing agent also promotes wetting of the metallizations on the die and substrate by the molten low melting point alloy, providing improved thermal conductivity. Simultaneously, the fluxing agent itself crosslinks to further mechanically bond the adherent surfaces. The absence of fugitive solvents creates a void-free bond.

Abstract translation: 包含相对高熔点金属或金属合金的粉末，相对低熔点的金属或金属合金粉末的粉末以及可热固化的粘合剂助焊剂组合物的导热，可烧结，粘合剂组合物，不含挥发性溶剂，其包含 （i）可聚合助熔剂; （ii）惰性剂在升高的温度下与助熔剂反应，使其惰性。 助熔剂优选包含具有式RCOOH的化合物，其中R包含具有一个或多个可聚合碳 - 碳双键的部分。 任选地，本发明的组合物还包括（a）能够与助熔剂的可聚合碳 - 碳双键聚合的稀释剂; （b）自由基引发剂; （c）可固化树脂; 和（d）交联剂和促进剂。 组合物可以直接施加到机械和/或电连接的装置的表面上，并且理想地适用于半导体芯片附接。 在加热过程中，助熔剂通过熔融的低熔点粉末促进高熔点粉末的润湿，引起粉末的液相烧结。 助熔剂还通过熔融的低熔点合金促进模具和衬底上的金属化的润湿，提供改进的导热性。 同时，助熔剂本身交联以进一步机械地结合附着表面。 没有挥发性溶剂会产生无空隙的键。

公开(公告)号：US20060033873A1

公开(公告)日：2006-02-16

申请号：US11250426

申请日：2005-10-17

Applicant: Akira Mase

Inventor： Akira Mase

IPC: G02F1/1345

CPC classification number: G02F1/13452 ,  G02F2203/69 ,  H01R4/04 ,  H05K1/0306 ,  H05K1/148 ,  H05K3/323 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0326 ,  H05K2201/2036

Abstract: A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.

公开(公告)号：US20060021466A1

公开(公告)日：2006-02-02

申请号：US11209076

申请日：2005-08-22

Applicant: Vahid Goudarzi ,  Edwin Bradley ,  Brian Fariello

Inventor： Vahid Goudarzi ,  Edwin Bradley ,  Brian Fariello

IPC: C22C13/00

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  H05K3/3463 ,  H05K2201/0272

Abstract: This invention is to a mixed alloy lead-free solder paste, a method of making the solder paste, and a method of using the solder paste. The solder paste comprises particles of a first alloy and a second alloy, mixed in a flux. The liquidus temperature of the first alloy and the liquidus temperature of the second alloy differ by not greater than about 15° C.

Abstract translation: 本发明是一种混合合金无铅焊膏，制造焊膏的方法以及使用该焊膏的方法。 焊膏包括在焊剂中混合的第一合金和第二合金的颗粒。 第一合金的液相线温度和第二合金的液相线温度不大于约15℃。