公开(公告)号：US06206993B1

公开(公告)日：2001-03-27

申请号：US09224156

申请日：1998-12-31

申请人： Larry W. Kiest, Jr. ,  Gary VanAmeyde

发明人： Larry W. Kiest, Jr. ,  Gary VanAmeyde

IPC分类号： B29C6336

CPC分类号： B29C63/36 ,  B29C63/34 ,  F16L55/163 ,  F16L55/1651 ,  F16L55/179 ,  Y10T156/1928

摘要： An apparatus for inserting a lining material into a pipeline includes an elongated carrier device having a hollow central portion which encloses a liner-bladder assembly. The liner-bladder assembly includes an elongated inflation bladder which engages an open end of the carrier device and expands under fluid pressure out of the carrier device. The pipe liner is frangibly attached to the inflation bladder such that its attachment anchors the liner with respect to the open end of the carrier device to permit accurate placement of the liner within a pipeline proximate to a compromised section of the pipeline. The frangible connection breaks when the carrier device and inflation bladder are removed from the pipeline.

摘要翻译： 用于将衬里材料插入到管道中的装置包括细长的载体装置，其具有封闭衬套 - 囊组件的中空中心部分。 衬套 - 囊组件包括细长的充气囊，其接合载体装置的开口端并在流体压力下膨胀出载体装置。 管道衬套易于连接到充气囊上，使得其附件相对于承载装置的开口端锚固衬套，以允许衬管在靠近管道的受损部分的管道内准确放置。 当载体装置和充气气囊从管道中取出时，易碎连接断裂。

公开(公告)号：US5759344A

公开(公告)日：1998-06-02

申请号：US835637

申请日：1997-04-10

申请人： Masaaki Yasunaga ,  Takeshi Kagamida

发明人： Masaaki Yasunaga ,  Takeshi Kagamida

IPC分类号： H01L21/00 ,  H01L21/304 ,  B32B35/00

CPC分类号： H01L21/67092 ,  H01L21/67011 ,  H01L21/67023 ,  Y10S156/941 ,  Y10T156/11 ,  Y10T156/1153 ,  Y10T156/19 ,  Y10T156/1928 ,  Y10T29/49822

摘要： The hot water is stored in the hot-water tank and kept at the predetermined temperature. The clamp base is provided in the hot water of the hot-water tank for receiving the substrate portion of the wafer and the lifter is arranged for moving the wafer from the upper part of the hot-water tank into the hot water. The clamper is placed at the upper of the clamp base and the substrate portion of the wafer is pushed to the clamp base fixedly and the pusher is arranged at the upper side of the clamp base in the vicinity of the clamper so as to push the slice base of the wafer, whereby the slice base is peeled. The peeling is performed in the hot water, therefore, the temperature of the wafer does not lower while peeling, so that the adhesive can be peeled easily.

摘要翻译： 将热水储存在热水箱中并保持在预定温度。 夹具底座设置在热水箱的热水中，用于接收晶片的基板部分，并且提升器用于将晶片从热水箱的上部移动到热水中。 夹持器放置在夹具基部的上部，并且晶片的基板部分被固定地推到夹具基座，并且推动器布置在夹持器的上侧，在夹持器附近，以推动切片 从而切片基底被剥离。 在热水中进行剥离，因此在剥离时晶片的温度不下降，从而可以容易地剥离粘合剂。

公开(公告)号：US5125999A

公开(公告)日：1992-06-30

申请号：US514056

申请日：1990-04-24

申请人： Shigeo Sumi ,  Fumio Hamamura

发明人： Shigeo Sumi ,  Fumio Hamamura

IPC分类号： B32B43/00 ,  B29C63/02 ,  B29C65/20 ,  B29C65/78 ,  B29L9/00 ,  B29L31/34 ,  B32B37/16 ,  B32B37/22 ,  G03F7/16 ,  H05K3/00 ,  H05K3/06

CPC分类号： B32B37/226 ,  B32B37/0038 ,  G03F7/161 ,  B29L2031/3425 ,  H05K3/0079 ,  Y10T156/1111 ,  Y10T156/1928

摘要： A thin film bonding method and apparatus having structure for removing wetting agents applied to a thin film and base plate that are to be bonded by pressure and heat. A spray or rollers apply the wetting agent prior to the initial bonding of a leading edge of the thin film to a leading edge of the base plate. A pressure roller applies heat and pressure to the film and base plate, bonding them together as the roller rotates and drives the plate toward a cleaning position. Suction and agent removal rollers are used to remove the residual excess agent from the bonded film and the pressure roller. The removal rollers are joined together by a link mechanism that has a spring bias and is operation by a gear mechanism that provides a wiping action.

公开(公告)号：US4963205A

公开(公告)日：1990-10-16

申请号：US434814

申请日：1989-11-13

申请人： Jean-Luc Hubert

发明人： Jean-Luc Hubert

IPC分类号： B05B9/04 ,  B05B13/00 ,  B05D1/02 ,  B05D3/00 ,  B05D5/00

CPC分类号： B29C63/0013 ,  B08B7/0092 ,  Y10T156/1928 ,  Y10T225/304 ,  Y10T83/041 ,  Y10T83/283

摘要： A protective coating on a pipe is embrittled by enclosing a portion of the pipe in a body defining an annular space around the protective coating. A pressurized LN2 cryogen is expanded within this annular space for sufficient time to lower the temperature of both the protective coating and the underlying pipe to a temperature below the temperature of embrittlement of the coating. The LN2 is expanded so as to form elliptical patterns on the pipe surface.

摘要翻译： 管道上的保护涂层通过将管道的一部分包围在限定保护涂层周围的环形空间的主体中而变脆。 加压的LN2致冷剂在该环形空间内膨胀足够的时间以将保护涂层和下层管的温度降低到低于涂层脆化温度的温度。 LN2膨胀以在管表面上形成椭圆形图案。

公开(公告)号：US4371418A

公开(公告)日：1983-02-01

申请号：US328674

申请日：1981-12-08

申请人： Wladyslaw H. Krywiczanin ,  William Lumsden

发明人： Wladyslaw H. Krywiczanin ,  William Lumsden

IPC分类号： B65H19/10 ,  B65H19/12 ,  B65H19/18 ,  B31F5/06

CPC分类号： B65H19/123 ,  B65H19/105 ,  B65H19/18 ,  B65H2301/413243 ,  B65H2301/41745 ,  B65H2301/46176 ,  B65H2403/942 ,  Y10T156/1707 ,  Y10T156/1928

摘要： Web-splicing apparatus comprises a web splicer and, associated therewith, an air mover and web-presentation means operable to present to the inlet end of the air mover the leading end of a first web extending from a reel and the leading end of a second web extending from another reel, which air mover is operable to feed the leading end of said first web from said presentation means to and through a splicing zone, to serve as a guide for subsequent continuous passage of that web and further operable to feed the leading end of the second said web from said presentation means to said splicing zone during continuous passage of the first web through the air mover. Web-severing means may be disposed for operation in the splicing zone and web-withdrawal means, suitably further air-mover means, downstream of that zone. Splicing-patch supply means comprises a continuous backing strip carrying spaced adhesive patches, means for advancing the said strip past patch-detachment means, a movable vacuum-supplied holding element for receiving detached said patches, and a vacuum-supplied stationary element on the side of the web path remote from said movable element, a detached patch being pressable onto a web by movement of the first-named element towards the second-named element.

摘要翻译： 卷纸装置包括卷筒纸捻接器，并且与其相关联，具有可移动的空气推动器和卷筒纸呈现装置，该装置可操作以向空气推动器的入口端提供从卷轴延伸的第一卷筒纸的前端和第二卷筒纸的前端 从另一个卷轴延伸的卷筒，该空气移动器可操作以将所述第一卷筒纸的前端从所述呈现装置输送到并穿过拼接区域，以用作随后连续通过该卷筒纸的引导件，并进一步可操作地将引导 在所述第一幅材连续通过所述空气推动器期间，所述第二所述幅材从所述呈现装置到所述拼接区的端部。 网络切断装置可以被布置用于在拼接区域和卷筒纸取出装置中操作，适当地进一步的在该区域下游的促动装置。 拼接补片供应装置包括承载间隔开的粘合片的连续背衬条，用于使所述条通过贴片剥离装置前进的装置，用于接收分离的所述贴片的可动真空供应的保持元件，以及在侧面上的真空供应的固定元件 所述网路径远离所述可移动元件，通过所述第一命名元件朝向所述第二命名元件的移动，分离的贴片可压迫到幅材上。

公开(公告)号：US3682744A

公开(公告)日：1972-08-08

申请号：US3682744D

申请日：1970-06-15

申请人： CATHOLIC PRESS SOC INC

发明人： PERSON PAUL L

IPC分类号： B29C63/00 ,  B41F35/00 ,  B32B31/16

CPC分类号： B41F35/00 ,  B29C63/0013 ,  Y10T29/5139 ,  Y10T156/1111 ,  Y10T156/1928

摘要： Disclosed is apparatus for stripping and cleaning a backing plate, such as, an arcuate press saddle, by the process of rotating the saddle past a blade to strip a pinging plate therefrom by advancing from a corner diagonally with respect to movement of the saddle, through a bath of adhesive-removing solvent to wash the stripped saddle surface, into contact with a rotating brush to remove solvent and adhesive from the washed saddle surface, and through an airstream to dry the cleaned saddle surface.

公开(公告)号：US3107193A

公开(公告)日：1963-10-15

申请号：US1547260

申请日：1960-03-16

申请人： MINNESOTA MINING & MFG

发明人： DE NEUI RICHARD P ,  CASEY JAMES H

IPC分类号： B65C11/00 ,  B65H35/00 ,  B65H41/00

CPC分类号： B65H35/0026 ,  B65C11/00 ,  B65H41/00 ,  Y10T156/1365 ,  Y10T156/1928 ,  Y10T225/201 ,  Y10T225/231 ,  Y10T225/247

公开(公告)号：US20170334187A1

公开(公告)日：2017-11-23

申请号：US15610890

申请日：2017-06-01

申请人： Semiconductor Energy Laboratory Co., Ltd.

发明人： Kayo KUMAKURA ,  Tomoya AOYAMA ,  Akihiro CHIDA ,  Kohei YOKOYAMA ,  Masakatsu OHNO ,  Satoru IDOJIRI ,  Hisao IKEDA ,  Hiroki ADACHI ,  Yoshiharu HIRAKATA ,  Shingo EGUCHI ,  Yasuhiro JINBO

IPC分类号： B32B43/00 ,  H01L21/67 ,  H01L51/56 ,  G02B6/00 ,  B26D1/04 ,  B26D1/00 ,  H01L27/32 ,  H01L27/12 ,  B32B38/10

CPC分类号： B32B43/006 ,  B26D1/04 ,  B26D2001/006 ,  B32B38/10 ,  B32B2457/00 ,  G02B6/00 ,  H01L21/67092 ,  H01L27/1248 ,  H01L27/3258 ,  H01L27/3262 ,  H01L51/56 ,  H01L2221/68327 ,  H01L2227/323 ,  H01L2251/5338 ,  Y10T156/1126 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/1184 ,  Y10T156/1928 ,  Y10T156/1933 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1989

摘要： A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

公开(公告)号：US09764488B2

公开(公告)日：2017-09-19

申请号：US14468801

申请日：2014-08-26

申请人： Semiconductor Energy Laboratory Co., Ltd.

发明人： Ryu Komatsu ,  Kohei Yokoyama ,  Masakatsu Ohno ,  Satoru Idojiri ,  Hisao Ikeda ,  Yasuhiro Jinbo ,  Hiroki Adachi ,  Yoshiharu Hirakata ,  Shingo Eguchi ,  Daiki Nakamura

IPC分类号： C03B33/027 ,  C03B33/07 ,  B26D3/08 ,  G02F1/13 ,  B26D3/28 ,  B26F1/38 ,  C03B33/037

CPC分类号： B26D3/282 ,  B26D3/08 ,  B26F1/3826 ,  C03B33/027 ,  C03B33/037 ,  C03B33/07 ,  G02F1/1303 ,  Y02P40/57 ,  Y10T83/0281 ,  Y10T156/1051 ,  Y10T156/1082 ,  Y10T156/1126 ,  Y10T156/1137 ,  Y10T156/1168 ,  Y10T156/1195 ,  Y10T156/12 ,  Y10T156/1348 ,  Y10T156/1788 ,  Y10T156/1793 ,  Y10T156/1928 ,  Y10T156/1933 ,  Y10T156/1939 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1994

摘要： A device for forming a separation starting point that allows separation of a surface layer of a processed member to form a remaining portion is provided. A manufacturing device of a stack including a support and a remaining portion of a processed member whose surface layer is separated is provided. The device for forming the separation starting point includes a stage that supports the processed member, a cutter that faces the stage, a head portion that supports the cutter, an arm portion that supports the head portion, and a moving mechanism that relatively moves the cutter to the stage.

公开(公告)号：US20170036433A1

公开(公告)日：2017-02-09

申请号：US15332898

申请日：2016-10-24

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ying-Ching Shih ,  Jing-Cheng Lin ,  Szu-Wei Lu

IPC分类号： B32B43/00 ,  B32B38/10 ,  H01L21/683 ,  H01L21/687 ,  H01L21/02 ,  B32B38/16 ,  H01L21/67

CPC分类号： B32B43/006 ,  B32B38/10 ,  B32B38/162 ,  B32B38/1858 ,  B32B2310/0825 ,  B32B2310/0831 ,  B32B2310/0843 ,  B32B2457/14 ,  H01L21/02076 ,  H01L21/02079 ,  H01L21/02096 ,  H01L21/02098 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6836 ,  H01L21/68785 ,  H01L24/96 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/95001 ,  Y10S901/40 ,  Y10S901/43 ,  Y10T156/1111 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T156/1928

摘要： Methods and tools for de-bonding and cleaning substrates are disclosed. A method includes de-bonding a surface of a first substrate from a second substrate, and after de-bonding, cleaning the surface of the first substrate. The cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate. A tool includes a de-bonding module and a cleaning module. The de-bonding module comprises a first chuck, a radiation source configured to emit radiation toward the first chuck, and a first robot arm having a vacuum system. The vacuum system is configured to secure and remove a substrate from the first chuck. The cleaning module comprises a second chuck, a spray nozzle configured to spray a fluid toward the second chuck, and a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck.

摘要翻译： 公开了用于去粘合和清洁基底的方法和工具。 一种方法包括从第二衬底去除粘合第一衬底的表面，并且在去结合之后，清洁第一衬底的表面。 清洁包括将清洁机构物理接触到第一基板的表面。 一种工具包括去粘合模块和清洁模块。 去粘合模块包括第一卡盘，被配置为朝向第一卡盘发射辐射的辐射源，以及具有真空系统的第一机器人手臂。 真空系统构造成从第一卡盘固定和移除基板。 清洁模块包括第二卡盘，被配置为朝向第二卡盘喷射流体的喷嘴，以及第二机器人手臂，其具有构造成将清洁装置物理接触到第二卡盘上的基板的清洁装置。