公开(公告)号：US20140103524A1

公开(公告)日：2014-04-17

申请号：US14108960

申请日：2013-12-17

Applicant: Renesas Electronics Corporation

Inventor： Yoichiro KURITA ,  Masaya KAWANO ,  Koji SOEJIMA

IPC: H01L23/498

CPC classification number: H01L25/50 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/522 ,  H01L23/5226 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/02 ,  H01L24/16 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2221/68345 ,  H01L2221/68372 ,  H01L2224/02319 ,  H01L2224/02331 ,  H01L2224/02333 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/16137 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/18161 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/0058 ,  H05K3/284 ,  H05K3/4682 ,  H05K2201/0195 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2201/09972 ,  H05K2203/016 ,  H05K2203/0733 ,  H05K2203/1469 ,  H01L2924/00 ,  H01L2224/0401

Abstract: In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

Abstract translation: 在传统的电子设备及其制造方法中，由于在焊球侧的互连层中使用的树脂受到限制，妨碍了电子设备的成本的降低。 电子设备包括互连层（第一互连层）和互连层（第二互连层）。 第二互连层形成在第一互连层的下表面上。 第二互连层的面积比第一互连层的面积大，并且从第一互连层延伸到外部。

公开(公告)号：US20140092563A1

公开(公告)日：2014-04-03

申请号：US13753824

申请日：2013-01-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ki Lee ,  Kawng Soo Kim ,  Bum Seok Suh ,  Chang Seob Hong ,  Joon Seok Chae

IPC: H05K7/20 ,  B23P15/26

CPC classification number: H05K7/20 ,  B23P15/26 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0201 ,  H05K1/0204 ,  H05K1/0271 ,  H05K1/05 ,  H05K3/44 ,  H05K2201/0187 ,  H05K2201/09909 ,  H05K2201/09972 ,  H05K2203/0207 ,  Y10T29/4935 ,  H01L2924/00014

Abstract: Disclosed herein is a heat radiating substrate including: a heat radiating plate including a plurality of holes having a predetermined depth and formed in a lower portion of one side thereof; a conductor pattern layer formed on the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.

Abstract translation: 本发明公开了一种散热基板，其特征在于，包括：散热板，具有规定深度的多个孔，形成在其一侧的下部; 导体图案层，其形成在所述散热板上并且包括其上安装有控制装置和功率器件的安装焊盘和电路图案; 以及形成在散热板和导体图案层之间的绝缘层。

公开(公告)号：US08615076B2

公开(公告)日：2013-12-24

申请号：US12976659

申请日：2010-12-22

Applicant: Roy Sodersjerna ,  Jackie Lapierre ,  Philip Simmons

Inventor： Roy Sodersjerna ,  Jackie Lapierre ,  Philip Simmons

IPC: H04M1/00 ,  H04M9/00

CPC classification number: H05K1/0268 ,  H05K1/0227 ,  H05K1/025 ,  H05K2201/09663 ,  H05K2201/09972

Abstract: A system and method for wireless DSL routing without signal interference is disclosed herein. The system includes a DSL interface, a WLAN interface, and a power system. The WLAN interface is isolated from the rest of the system by various isolation and signal interference reduction techniques. The system can be implemented in a single printed circuit board.

Abstract translation: 本文公开了一种无信号干扰的无线DSL路由的系统和方法。 该系统包括DSL接口，WLAN接口和电力系统。 WLAN接口通过各种隔离和信号干扰减少技术与系统的其余部分隔离。 该系统可以在单个印刷电路板中实现。

公开(公告)号：US08605448B2

公开(公告)日：2013-12-10

申请号：US13064174

申请日：2011-03-09

Applicant: Kenji Motohashi ,  Hideji Miyanishi ,  Kazumasa Aoki

Inventor： Kenji Motohashi ,  Hideji Miyanishi ,  Kazumasa Aoki

IPC: H05K1/00

CPC classification number: H05K1/0233 ,  H05K1/0227 ,  H05K1/0243 ,  H05K1/025 ,  H05K2201/086 ,  H05K2201/09336 ,  H05K2201/09663 ,  H05K2201/09972

Abstract: A printed wiring board includes a bridge located in a surface layer, a noise absorber located on the bridge, a plurality of grounds directly connected or high-frequency-connected to the bridge, a first device using one of the plurality of grounds as a reference potential, a second device using one of the plurality of grounds other than the ground for the first device as a reference potential, and a high-speed signal line that connects the first device and the second device. The high-speed signal line is routed through a layer adjacent to the bridge in a layer direction of the printed wiring board to form a transmission line structure.

Abstract translation: 印刷电路板包括位于表面层中的桥，位于桥上的噪声吸收器，与桥接器直接连接或高频连接的多个接地，使用多个接地中的一个作为参考的第一设备 电位，使用除了第一器件的接地之外的多个接地之一作为参考电位的第二器件以及连接第一器件和第二器件的高速信号线。 高速信号线沿印刷电路板的层方向穿过与桥接件相邻的层，以形成传输线结构。

公开(公告)号：US20130322029A1

公开(公告)日：2013-12-05

申请号：US13483207

申请日：2012-05-30

Applicant: DROR HURWITZ

Inventor： DROR HURWITZ

IPC: H05K7/00 ,  H01K3/10

CPC classification number: H05K3/4644 ,  H01L2924/0002 ,  H01P3/06 ,  H01P3/085 ,  H05K1/0221 ,  H05K1/0242 ,  H05K3/429 ,  H05K3/4647 ,  H05K9/0024 ,  H05K2201/0723 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/09972 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A multilayer electronic support structure including at least one metallic component encapsulated in a dielectric material, and comprising at least one faraday barrier to shield the at least one metallic component from interference from external electromagnetic fields and to prevent electromagnetic emission from the metallic component.

Abstract translation: 一种多层电子支撑结构，包括至少一个金属部件，其包封在电介质材料中，并且包括至少一个法拉第屏障，以屏蔽所述至少一个金属部件免受外部电磁场的干扰并防止来自金属部件的电磁辐射。

公开(公告)号：US20130314296A1

公开(公告)日：2013-11-28

申请号：US13952275

申请日：2013-07-26

Applicant: Huawei Device Co., Ltd.

Inventor： Huiliang Xu ,  Yao Lan ,  Shuhui Sun ,  Dongxing Tu ,  Dingjie Wang ,  Ping Lei ,  Peihua Shuai

IPC: H01Q3/04

CPC classification number: H01Q3/04 ,  H04B1/3816 ,  H05K1/0227 ,  H05K2201/09972

Abstract: Embodiments of the present invention provide a wireless terminal including a PCB, an antenna, and a data connector. The PCB has a groove, which divides the PCB into a first part and a second part. The second part is connected to the antenna, the first part is connected to the data connector through a rotating shaft, and connecting wires of the data connector are connected to the second part. The first part and the second part each have a ground. The ground of the first part is connected to a metal casing of the data connector and a ground wire of the data connector is connected to the ground of the second part and the ground wire of the data connector is electrically connected to the metal casing of the data connector.

Abstract translation: 本发明的实施例提供一种包括PCB，天线和数据连接器的无线终端。 PCB具有凹槽，其将PCB分成第一部分和第二部分。 第二部分连接到天线，第一部分通过旋转轴连接到数据连接器，数据连接器的连接线连接到第二部分。 第一部分和第二部分都有一个基础。 第一部分的接地连接到数据连接器的金属外壳，数据连接器的接地线连接到第二部分的接地，数据连接器的接地线电连接到第二部分的金属外壳 数据连接器。

公开(公告)号：US20130314108A1

公开(公告)日：2013-11-28

申请号：US13949031

申请日：2013-07-23

Applicant: BROADCOM CORPORATION

Inventor： Iain Barnett ,  William Michael James Holland ,  Jonathan Ephraim David Hurwitz

IPC: G01R19/12

CPC classification number: H05K1/162 ,  G01R15/06 ,  G01R15/16 ,  G01R19/12 ,  G01R19/175 ,  H03H7/004 ,  H05K1/0239 ,  H05K1/0256 ,  H05K2201/09309 ,  H05K2201/09972

Abstract: A voltage measurement circuit is operative to measure a high voltage AC signal and includes a capacitive divider circuit and a compensator circuit. The capacitive divider circuit includes first and second inputs, across which, in use, is received a high voltage AC signal and also includes second and third capacitors. First and second plates of each of the first, second and third capacitors are defined by conductive layers of a printed circuit board and the dielectric of each of the first, second and third capacitors being defined by a non-conducting part of the printed circuit board. A compensator circuit has a configurable transfer function and includes an input connected across the first and second plates of the third capacitor and an output. The compensator circuit is operative to change a voltage received at its input in accordance with the transfer function and to provide the changed voltage at its output.

Abstract translation: 电压测量电路用于测量高压AC信号，并包括电容分压器电路和补偿电路。 电容分压器电路包括第一和第二输入，在使用中，它们被接收高压AC信号，并且还包括第二和第三电容器。 第一，第二和第三电容器中的每一个的第一和第二板由印刷电路板的导电层限定，并且第一，第二和第三电容器中的每一个的电介质由印刷电路板的非导电部分限定 。 补偿电路具有可配置的传递函数，并且包括连接在第三电容器的第一和第二板上的输入端和输出端。 补偿电路可操作以根据传递函数改变其输入处接收的电压，并在其输出端提供改变的电压。

公开(公告)号：US20130271928A1

公开(公告)日：2013-10-17

申请号：US13849364

申请日：2013-03-22

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Masaya SHIMAMURA ,  Eiji MUGIYA

IPC: H05K9/00 ,  H05K13/00

CPC classification number: H05K9/0084 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/351 ,  H05K1/0218 ,  H05K3/284 ,  H05K5/0095 ,  H05K9/0037 ,  H05K13/00 ,  H05K2201/09972 ,  H05K2201/10371 ,  Y10T29/49146 ,  H01L2924/00

Abstract: A circuit module pertaining to an embodiment of the present invention has a board, multiple electronic components, a shield member, sealing layer, and cover layer. The board has a mounting surface that includes a first area and second area in which the multiple electronic components are mounted. The shield member is constituted by conductive material and placed between the first area and second area on the mounting surface. The sealing layer has on its top surface a groove having its bottom face including an upper end face of the shield member, is formed on the mounting surface, and is constituted by an insulator that covers the multiple electronic components. The cover layer is constituted by conductive material and has a first cover part that fills the groove as well as a second cover part that covers the first cover part and sealing layer.

Abstract translation: 关于本发明的实施例的电路模块具有板，多个电子部件，屏蔽部件，密封层和覆盖层。 该电路板具有安装表面，该安装表面包括安装多个电子部件的第一区域和第二区域。 屏蔽构件由导电材料构成，并被放置在安装表面上的第一区域和第二区域之间。 密封层在其顶面上具有包括屏蔽部件的上端面的底面的槽，形成在安装面上，由覆盖多个电子部件的绝缘体构成。 覆盖层由导电材料构成，并且具有填充槽的第一盖部以及覆盖第一盖部和密封层的第二盖部。

公开(公告)号：US08523391B2

公开(公告)日：2013-09-03

申请号：US11346388

申请日：2006-02-03

Applicant: Masahiro Ishizuka ,  Katsuyuki Okimura ,  Yoshinori Ueji ,  Ryuichiro Morinaka ,  Naoki Tatsumi ,  Tomoyuki Fukuda

Inventor： Masahiro Ishizuka ,  Katsuyuki Okimura ,  Yoshinori Ueji ,  Ryuichiro Morinaka ,  Naoki Tatsumi ,  Tomoyuki Fukuda

IPC: H05K1/14

CPC classification number: H05K3/0052 ,  F21K9/00 ,  H05K1/0286 ,  H05K2201/09127 ,  H05K2201/09972 ,  H05K2201/10106 ,  H05K2203/175

Abstract: A flat light source apparatus has a light source board which comprises unit boards, each unit board having a printed circuit board and a light source formed on the printed circuit board, wherein the unit boards are arranged adjacent to each other at least in one direction, and any pair of the unit boards adjacent to each other is integrated by a connecting portion provided therebetween. The apparatus also has a main wire which extends along a plane of the light source board, wherein the main wire extends between adjacent unit boards via the connecting portion such that all of the unit boards are electrically connected to each other by the main wire. The apparatus further has a branch wire for supplying electric power to the light source, the branch wire being provided in each unit board and branching from the main wire in each unit board.

Abstract translation: 平面光源装置具有包括单元板的光源板，每个单元板具有印刷电路板和形成在印刷电路板上的光源，其中，单元板至少在一个方向上彼此相邻布置， 并且彼此相邻的任何一对单元板通过设置在它们之间的连接部分而被集成。 该设备还具有沿着光源板的平面延伸的主线，其中主线经由连接部分在相邻单元板之间延伸，使得所有单元板通过主线彼此电连接。 该装置还具有用于向光源提供电力的分支线，分支线设置在每个单元板中并且在每个单元板中从主线分支。

公开(公告)号：US20130170213A1

公开(公告)日：2013-07-04

申请号：US13633305

申请日：2012-10-02

Applicant: Shu-Juan HUANG ,  Cheng-Wei Chang ,  Te-Hen Lo

Inventor： Shu-Juan HUANG ,  Cheng-Wei Chang ,  Te-Hen Lo

IPC: F21S4/00

CPC classification number: F21K9/00 ,  F21S4/20 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/0296 ,  H05K2201/09227 ,  H05K2201/09972 ,  H05K2201/10106

Abstract: An LED module includes a single-sided circuit board, a plurality of LED strings and signal wires. The single-sided circuit board has a surface defined with a first and second areas. A long edge of the surface has a wiring outlet located at a position corresponding to a boundary of the first and second areas. The LED strings are divided into a first and second groups disposed in the first and second areas, respectively. The signal wires each are disposed on the surface and routed to have its one end joined to the wiring outlet, and its another end electrically connected to a first end of one LED string or a second end of one LED string. In addition, some signal wires each are further routed to have a segment thereof passed through a gap formed between the two groups of LED strings.

Abstract translation: LED模块包括单面电路板，多个LED串和信号线。 单面电路板具有限定了第一和第二区域的表面。 表面的长边缘具有位于对应于第一和第二区域的边界的位置处的接线出口。 LED串被分成设置在第一和第二区域中的第一组和第二组。 信号线各自设置在表面上并被布线以使其一端接合到接线插座，并且其另一端电连接到一个LED串的第一端或一个LED串的第二端。 此外，一些信号线每个进一步布线以使其一段通过形成在两组LED串之间的间隙。