公开(公告)号：US5763949A

公开(公告)日：1998-06-09

申请号：US583219

申请日：1996-01-04

Applicant: Arthur Woodworth ,  Peter Richard Ewer

Inventor： Arthur Woodworth ,  Peter Richard Ewer

IPC: H01L25/07 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L25/18 ,  H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K3/26 ,  H05K3/30 ,  H05K3/34 ,  H01L39/02

CPC classification number: H05K1/145 ,  H01L23/3107 ,  H01L23/49555 ,  H05K3/341 ,  H05K3/3426 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/05 ,  H05K2201/09781 ,  H05K2201/10136 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/10969 ,  H05K2203/162 ,  H05K3/26 ,  H05K3/308 ,  H05K3/3447 ,  Y02P70/613

Abstract: A surface-mount semiconductor package comprises a semiconductor which is embedded within a plastic material body. Electrical control connections to the semiconductor package include first and second pads which are spaced apart from each other, making it easier to couple the devices in parallel. Power output is provided by metal pads. The pads may be partially sheared, to step them, thereby allowing a single thickness lead frame to be used in the manufacture of the device. On the lower face of the body there are channels which increase the electrical tracking distance and allow improved washing of residues after the device has been secured to a substrate.

Abstract translation: 表面贴装半导体封装包括嵌入在塑料材料体内的半导体。 与半导体封装的电气控制连接包括彼此间隔开的第一和第二焊盘，使得更容易并联耦合器件。 功率输出由金属垫提供。 衬垫可以被部分地剪切，以便对其进行步骤，从而允许单个厚度的引线框架用于器件的制造。 在身体的下表面上存在增加电跟踪距离的通道，并且在装置固定到基底之后允许改善残留物的洗涤。

公开(公告)号：US5742480A

公开(公告)日：1998-04-21

申请号：US552351

申请日：1995-11-02

Applicant: Sosaku Sawada ,  Ryoji Sakamoto ,  Hiromi Kurashima ,  Daisuke Takagi ,  Satoshi Ohe ,  Takeshi Sekiguchi ,  Nobuo Shiga

Inventor： Sosaku Sawada ,  Ryoji Sakamoto ,  Hiromi Kurashima ,  Daisuke Takagi ,  Satoshi Ohe ,  Takeshi Sekiguchi ,  Nobuo Shiga

IPC: G02B6/42 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/30 ,  H05K3/34 ,  H01R9/09

CPC classification number: H05K1/189 ,  G02B6/4274 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4245 ,  G02B6/4269 ,  H05K1/0393 ,  H05K1/118 ,  H05K2201/10151 ,  H05K2201/1034 ,  H05K2201/10446 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/2009 ,  H05K3/0058 ,  H05K3/306 ,  H05K3/3447 ,  Y02P70/611

Abstract: It is an object of the present invention to provide a highly reliable optical module circuit board having a sufficient mechanical strength with respect to an external stress. An optical module circuit board according to the present invention includes a flexible printed circuit having at least a multilayered structure in which a layer containing a conductive metal interconnection is sandwiched between insulating layers, wherein the flexible printed circuit includes a main body portion having the multilayered structure, a first surface mounted with an electronic component, and a second surface opposite to the first surface, a neck portion having the multilayered structure and extending from one end of the main body portion, and a head portion positioned at a distal end of the neck portion extending from the one end of the main body portion, having the multilayered structure, and mounted with an optical operation element and a bypass capacitor, Particularly, the neck portion defines the positional relationship between the main body portion and the head portion so as to give the circuit board a sufficient mechanical strength.

Abstract translation: 本发明的目的是提供一种具有足够的机械强度相对于外部应力的高度可靠的光学模块电路板。 根据本发明的光学模块电路板包括具有至少多层结构的柔性印刷电路，其中包含导电金属互连的层被夹在绝缘层之间，其中柔性印刷电路包括具有多层结构的主体部分 ，安装有电子部件的第一表面和与第一表面相对的第二表面，具有多层结构并从主体部分的一端延伸的颈部和位于颈部的远端的头部 具有多层结构的主体部分的一端延伸并安装有光操作元件和旁路电容器的部分，特别地，颈部限定主体部分和头部之间的位置关系，从而 给电路板提供足够的机械强度。

公开(公告)号：US5506447A

公开(公告)日：1996-04-09

申请号：US257330

申请日：1994-06-07

Applicant: Tadayoshi Murakami

Inventor： Tadayoshi Murakami

IPC: H01L23/12 ,  H01L23/34 ,  H01L23/50 ,  H01L25/16 ,  H05K1/02 ,  H05K3/34 ,  H05K3/40 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L25/16 ,  H01L24/36 ,  H01L24/40 ,  H05K3/341 ,  H05K3/4015 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2924/13033 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/0263 ,  H05K2201/10166 ,  H05K2201/10287 ,  H05K2201/10651 ,  H05K2201/10962 ,  H05K2201/10969 ,  H05K3/3405 ,  Y02P70/613

Abstract: A hybrid integrated circuit of the invention is formed of an insulation substrate, a thick film conductor printed and sintered on the insulation substrate, and a terminal conductor and a circuit part connected to the first thick film conductor. A first electrically conductive metal plate is brazed on the first thick film conductor and connects the circuit part and the first terminal. Electric current between the circuit part and the first terminal mostly flows through the metal plate.

Abstract translation: 本发明的混合集成电路由绝缘基板，在绝缘基板上印刷和烧结的厚膜导体以及与第一厚膜导体连接的端子导体和电路部分形成。 第一导电金属板钎焊在第一厚膜导体上，并连接电路部分和第一端子。 电路部分和第一端子之间的电流大部分流过金属板。

公开(公告)号：US5471016A

公开(公告)日：1995-11-28

申请号：US215441

申请日：1994-03-18

Applicant: Erich Krainer ,  Martin Sonnek

Inventor： Erich Krainer ,  Martin Sonnek

IPC: H01M2/10 ,  H01M2/20 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K7/12

CPC classification number: H05K1/18 ,  H01M2/1055 ,  H01M2/20 ,  H05K1/0293 ,  H05K1/116 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/10651 ,  H05K2203/175 ,  H05K2203/176 ,  H05K3/3447

Abstract: In an apparatus (1) with at least one battery (12, 13) mounted on a printed circuit board (14) the printed circuit board (14) has mounting portions (23, 24, 25, 26) which can be broken off this printed circuit board, solder lugs (19, 20, 21, 22) which project from terminals (15, 16, 17, 18) of the battery (12, 13) being fixedly connected to said mounting portions by a soldered joint (27) each. Each mounting portion (23, 24, 25, 26) of the printed circuit board (14) is surrounded by the remainder of the printed circuit board (14) and an opening (28, 29, 30, 31), which partly surrounds the relevant mounting portion (23, 24, 25, 26), is formed between each mounting portion (23, 24, 25, 26) and the remainder of the printed circuit board (14) and each mounting portion (23, 24, 25, 26) is connected to the remainder of the printed circuit board (14) by a connecting portion (40, 41, 42, 43) of the printed circuit board (14), which connecting portion is situated between the two ends (32, 33, 34, 35, 36, 37, 38, 39) of an opening (28, 29, 30, 31).

Abstract translation: 在具有安装在印刷电路板（14）上的至少一个电池（12,13）的装置（1）中，印刷电路板（14）具有安装部分（23,24,25,26），其可以被断开 印刷电路板，从电池（12,13）的端子（15,16,17,18）突出的焊接凸块（19,20,21,22）通过焊接接头（27）固定地连接到所述安装部分， 每。 印刷电路板（14）的每个安装部分（23,24,25,26）被印刷电路板（14）的其余部分和一个开口（28,29,30,31）包围，该开口部分包围 相应的安装部分（23,24,25,26）形成在每个安装部分（23,24,25,26）与印刷电路板（14）的其余部分和每个安装部分（23,24,25,26）之间， 26）通过印刷电路板（14）的连接部分（40,41,42,43）连接到印刷电路板（14）的其余部分，该连接部分位于两端（32,33）之间 ，34,35,36,37,38,39）的开口（28,29,30,31）。

公开(公告)号：US5461775A

公开(公告)日：1995-10-31

申请号：US230033

申请日：1994-04-19

Applicant: Kouji Tanabe ,  Naohiro Nishioka

Inventor： Kouji Tanabe ,  Naohiro Nishioka

IPC: H05K3/28 ,  H05K1/00 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46 ,  H05K3/34

CPC classification number: H05K3/321 ,  H05K1/114 ,  H05K3/245 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/181 ,  H05K2201/09436 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10977 ,  H05K2203/0285 ,  H05K2203/065 ,  H05K2203/1311 ,  H05K2203/1453 ,  H05K3/4069 ,  H05K3/4644 ,  H05K3/4664 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A flexible printed circuit board is constituted with a first insulation film covering a first insulating resist layer, a second insulation film covering a second insulating resist layer and a printed circuit formed between the first insulating resist layer and the second insulating resist layer, and a terminal of an electronic component is disposed on the printed circuit, and the second insulation film is pressed and heated.

Abstract translation: 柔性印刷电路板由覆盖第一绝缘抗蚀剂层的第一绝缘膜，覆盖第二绝缘抗蚀剂层的第二绝缘膜和形成在第一绝缘抗蚀剂层和第二绝缘抗蚀剂层之间的印刷电路构成，端子 的电子部件设置在印刷电路上，第二绝缘膜被按压和加热。

公开(公告)号：US5447267A

公开(公告)日：1995-09-05

申请号：US190605

申请日：1994-02-02

Applicant: Tadahiko Sakai ,  Shinichi Kuroki

Inventor： Tadahiko Sakai ,  Shinichi Kuroki

IPC: B23K1/20 ,  H05K3/30 ,  H05K3/34 ,  B23K31/02

CPC classification number: B23K1/20 ,  H05K3/305 ,  H05K3/3421 ,  H05K2201/10628 ,  H05K2201/10651 ,  H05K2203/1163 ,  H05K3/341 ,  H05K3/3494 ,  Y02P70/613 ,  Y10T428/31678

Abstract: An electronic part is tacked to a circuit board, leads of the electronic part being made into contact with cream solder built up on the circuit board, and thereafter, the circuit board is heated up so as to melt the cream solder in order to solder the electronic part to the circuit board. In this procedure, the melting temperature of a hardener in the tacking bond, that is, the hardening temperature of the tacking bond, is higher than that of the cream solder, thereby making it possible to prevent hindrance to sinking of the lead terminal of the electronic part into the melted cream solder.

Abstract translation: 将电子部件固定到电路板上，使电子部件的引线与构成在电路板上的膏状焊膏接触，然后将电路板加热，使熔融焊膏熔化，从而焊接 电子部件到电路板。 在该方法中，粘合剂中的固化剂的熔融温度，即固着粘合剂的固化温度高于膏状焊剂的熔化温度，从而可以防止引线端子的下沉 电子部分进入熔化的奶油焊料。

公开(公告)号：US4931961A

公开(公告)日：1990-06-05

申请号：US332784

申请日：1989-03-07

Applicant: Susumu Ando ,  Ikuo Hagiwara

Inventor： Susumu Ando ,  Ikuo Hagiwara

IPC: H01G2/06 ,  H01G4/224 ,  H05K3/34

CPC classification number: H01G4/224 ,  H01G2/065 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10651 ,  H05K2201/10969 ,  Y02P70/613 ,  Y10T29/417

Abstract: There is disclosed a chip type capacitor in which the capacitor is accommodated in a sheathing frame having the receiving space compatible with an external size of the capacitor, terminals derived from the same open end of the capacitor are bent along the open end and the top surface of the sheathing frame and a solderable metal layer is arranged in a part of the top surface thereof.

公开(公告)号：US4908336A

公开(公告)日：1990-03-13

申请号：US330874

申请日：1989-03-30

Applicant: Bob Mouissie

Inventor： Bob Mouissie

IPC: B60R16/02 ,  H01R4/48 ,  H01R12/24 ,  H01R24/00 ,  H05K3/32

CPC classification number: H05K3/326 ,  H05K2201/052 ,  H05K2201/10053 ,  H05K2201/10393 ,  H05K2201/10424 ,  H05K2201/10651

Abstract: A flexible circuit (1) provided with at least one connector for connecting an electrical component (25) to corresponding conductors of the flexible circuit. The connector consists of two parallel contact strips (5) from insulating flexible material, which are attached to the flexible circuit. The surfaces of the contact strips (5) facing each other have contact surfaces (6, 7) which are electrically connected to the corresponding conductors (3, 2) of the flexible circuit (1). The connector further consists of a positioning block (15) from insulating material, which is provided with holes into which the connecting pins (21, 22) of the electrical component (25) can be inserted. Grooves (16, 17) in which the contact strips lie are provided in the side faces, adjacent to the holes, of the positioning block and have a depth which is greater than the minimum distance between the wall of a hole and the adjacent side face of the positioning block. A clamping spring (37) which presses the contact strips (5) towards each other is provided.

公开(公告)号：US4672358A

公开(公告)日：1987-06-09

申请号：US864777

申请日：1986-05-19

Applicant: Theodore S. Pryst ,  John G. Kirschner

Inventor： Theodore S. Pryst ,  John G. Kirschner

IPC: H01C1/01 ,  H01C1/034 ,  H01C1/084 ,  H01C1/14 ,  H01C1/148 ,  H01C13/02 ,  H01C17/00 ,  H01F27/29 ,  H01G4/224 ,  H01G4/252 ,  H01L23/48 ,  H05K1/18 ,  H05K3/34 ,  H01C1/02

CPC classification number: H05K3/3426 ,  H01C17/006 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A surface-mount power resistor may be fabricated using a power resistor of conventional design as its core. A conventional resistor is reworked so as to flatten its leads from a point near their emergence from the generally tubular body of the resistor to the ends of the leads. The reworked resistor is then encapsulated from a point on the flattened portion of one lead to a corresponding point on the other lead, with the resulting mold being shaped as to have at least two opposing flat surfaces. The ribbon-shaped portions of the leads which exit from the molded body are then shaped as desired to afford the finished product. Similar surface-mount electrical components may be fabricated for any component with axial leads.

Abstract translation: 可以使用常规设计的功率电阻作为其核心来制造表面贴装功率电阻器。 传统的电阻器被重新加工，以便使其引线从靠近其从电阻器的大致管状体到引线端部的出现点平坦化。 然后将返工电阻器从一个引线的平坦部分上的点封装到另一个引线上的对应点，所得到的模具被成形为具有至少两个相对的平坦表面。 然后从成形体出来的引线的带状部分根据需要成型，以提供成品。 可以为具有轴向引线的任何部件制造类似的表面贴装电气部件。

公开(公告)号：US4614995A

公开(公告)日：1986-09-30

申请号：US667046

申请日：1984-11-01

Applicant: Bernard Lavene

Inventor： Bernard Lavene

IPC: H01G2/02 ,  H01G2/06 ,  H01G4/228 ,  H01G4/248 ,  H05K3/34 ,  H01G1/13

CPC classification number: H01G4/248 ,  H01G2/06 ,  H01G2/065 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10916 ,  Y02P70/611 ,  Y02P70/613

Abstract: A planar terminated capacitor and a method for fabricating planar terminated capacitors is disclosed wherein a capacitor element is inserted in a nonconductive ceramic case. The case extends outwardly beyond the ends of the capacitor element forming cavities at each end of the case. Metal end caps are positioned at the ends of the case substantially enclosing the cavities. The end caps are electrically coupled to the ends of the capacitor element.

Abstract translation: 公开了一种平面端接电容器和制造平面端接电容器的方法，其中将电容器元件插入到非导电陶瓷壳体中。 壳体向外延伸超过在壳体的每个端部处形成腔的电容器元件的端部。 金属端帽位于壳体的基本上包围空腔的端部。 端盖电耦合到电容器元件的端部。