公开(公告)号：US20180166404A1

公开(公告)日：2018-06-14

申请号：US15375146

申请日：2016-12-11

Applicant: CYNTEC CO., LTD.

Inventor： Chun-Fu Hu ,  Chih-Yu Hu ,  Shu-Wei Chang

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L23/50

Abstract: A wireless package includes a package substrate, a RFIC chip, a resilient connector, a molding compound encapsulating the RFIC chip, the resilient connector, and the top surface of the package substrate, and an antenna disposed on a top surface of the molding compound. The resilient connector has a terminal bonded to a pad on the top surface of the package substrate, a horizontal contact portion, and an oblique support portion integrally coupled to the horizontal contact portion and extending between the horizontal contact portion and the terminal. The antenna is in direct contact with the horizontal contact portion.

公开(公告)号：US20180156990A1

公开(公告)日：2018-06-07

申请号：US15367152

申请日：2016-12-01

Applicant: CYNTEC CO., LTD.

Inventor： Po-Kuei Chou ,  Sheng-Hong Yu ,  Chieh Huang

IPC: G02B6/42 ,  H04B10/25

CPC classification number: G02B6/423 ,  G02B6/421 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/4249 ,  G02B6/4256 ,  G02B6/4284 ,  G02B6/4292 ,  H04B10/2504

Abstract: An optical fiber strip has a stair-shaped base element, a cover element, an adapter and an internal optical fiber array. The stair-shaped base element has a plurality of holes and a first bearing surface. The holes are integrally formed and extends from the first receiving surface to a bottom surface of the stair-shaped base element. The cover element includes an internal curved space between the first curved part and second curved part. The internal optical fiber array is selectively and optically coupled to tan optical-electrical conversion unit via the holes. A curved portion of the internal optical fiber array is located in the internal curved space for changing direction of the internal optical fiber array.

公开(公告)号：US09959965B2

公开(公告)日：2018-05-01

申请号：US14941647

申请日：2015-11-15

Applicant: CYNTEC CO., LTD.

Inventor： Chun-Tiao Liu ,  Lan-Chin Hsieh ,  Tsung-Chan Wu ,  Chi-Hsun Lee ,  Chih-Siang Chuang

IPC: H01F27/02 ,  H01F27/29 ,  H01F27/24 ,  H01F17/04 ,  H01F27/255 ,  H01F27/28 ,  H01F1/147

CPC classification number: H01F27/022 ,  H01F1/14741 ,  H01F1/14766 ,  H01F1/14791 ,  H01F17/045 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/29

Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein the volume of the base is V1 and the volume of the pillar is V2; a coil wound on the pillar; and a magnetic body encapsulating the pillar, the coil and a portion of the base, wherein the ratio of V1 to V2 (V1/V2) is configured in a pre-determined range so as to reduce the total core loss of the inductor with the equivalent permeability of the inductor being between 28.511 and 52.949.

公开(公告)号：US20170323720A1

公开(公告)日：2017-11-09

申请号：US15585176

申请日：2017-05-03

Applicant: CYNTEC CO., LTD.

Inventor： SEN-HUEI CHEN

IPC: H01F27/32 ,  H01F1/153 ,  H01F41/00 ,  H01F27/02 ,  H01F7/02 ,  H01F17/04 ,  H01F41/076 ,  H01F3/10

CPC classification number: H01F27/321 ,  H01F1/15383 ,  H01F7/0221 ,  H01F17/04 ,  H01F27/022 ,  H01F27/29 ,  H01F41/005 ,  H01F41/076 ,  H01F2003/106 ,  H01F2017/048

Abstract: Multiple methods are provided to paint a body of an inductor so that there is no residual glue remained in the lead that may cause extra cleaning work and soldering issues when the lead is soldered with an external circuit.

公开(公告)号：US09691710B1

公开(公告)日：2017-06-27

申请号：US14959768

申请日：2015-12-04

Applicant: CYNTEC CO., LTD.

Inventor： Joseph D. S. Deng ,  Chia-Hsien Shen ,  Shu-Wei Chang ,  Kuan-Chih Huang

IPC: H01L21/00 ,  H01L23/552 ,  H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/561 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/97 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81

Abstract: A semiconductor package includes a substrate, a plurality of pin pads, a radio frequency (RF) pad, a semiconductor component, at least one surface mount device (SMD) component, a mold compound, a printed circuit board (PCB) antenna and a conductive solder. The RF pad is used to receive or transmit an RF signal on the top side of the substrate. The SMD component is mounted on the RF pad. The mold compound on the top side of the substrate covers the semiconductor component and the SMD component. The PCB antenna is located on the mold compound. Wherein, the conductive solder and the SMD component are stacked between the RF pad and a feeding structure of the PCB antenna.

公开(公告)号：US20170154724A1

公开(公告)日：2017-06-01

申请号：US15046423

申请日：2016-02-17

Applicant: CYNTEC CO., LTD.

Inventor： Wei Zhang ,  Chu-Keng Lin ,  Hung-Chih Lin ,  Hsieh-Shen Hsieh

IPC: H01F27/34 ,  H01F27/29

CPC classification number: H01F27/341 ,  H01F3/14 ,  H01F27/2852 ,  H01F27/2871 ,  H01F27/29 ,  H01F27/306

Abstract: A planar reactor includes a core and a coil. The core includes an upper board, a lower board and a pillar. The pillar is located between the upper board and the lower board. A winding space is located among the upper board, the lower board and the pillar. The coil is wound around the pillar and located in the winding space. The pillar and at least one of the upper board and the lower board are coplanar at a first side of the planar reactor. The pillar is sunk into the winding space from a second side of the planar reactor, wherein the first side is opposite to the second side. A first end of the coil is exposed from the first side of the planar reactor. A second end of the coil is hidden in the winding space partially or wholly at the second side of the planar reactor.

公开(公告)号：US20170047273A1

公开(公告)日：2017-02-16

申请号：US15334308

申请日：2016-10-26

Applicant: CYNTEC CO., LTD.

Inventor： BAU-RU LU ,  JENG-JEN LI ,  KUN-HONG SHIH ,  KAIPENG CHIANG

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/49537 ,  H01L21/563 ,  H01L23/13 ,  H01L23/49506 ,  H01L23/49534 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15321 ,  H05K1/021 ,  H05K1/186 ,  Y10T29/49124 ,  H01L2924/00

Abstract: The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.

Abstract translation: 本发明公开了一种由装置载体和可修改基底的组合制成的封装结构。 在一个实施例中，在器件载体中形成凹部，并且导电元件设置在衬底上，其中衬底设置在器件载体上，并且导电元件位于器件载体的凹部中。 衬底中的导电图案电连接到器件载体和第一导电元件的I / O端子。 本发明还公开了一种用于制造由器件载体和可修改基底的组合制成的封装结构的方法。 在一个实施例中，衬底中的导电图案的一部分可以被修改。

公开(公告)号：US09544989B2

公开(公告)日：2017-01-10

申请号：US14945073

申请日：2015-11-18

Applicant: CYNTEC CO., LTD.

Inventor： Chih-Tse Chen ,  Joseph D. S. Deng ,  Shih-Hsien Tseng

IPC: H01H9/28 ,  H05K5/00 ,  H05K1/02 ,  H05K9/00 ,  H05K1/00 ,  H05K7/00 ,  H05K1/11 ,  H05K1/18 ,  H02B5/00

CPC classification number: H05K1/0216 ,  H05K1/00 ,  H05K1/0233 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/111 ,  H05K1/181 ,  H05K5/00 ,  H05K5/0026 ,  H05K7/00 ,  H05K9/0022 ,  H05K2201/08 ,  H05K2201/1003

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. Any two adjacent Ethernet transformers are separately arranged with a gap having a second specific length.

Abstract translation: 公开了一种网络通信设备。 网络通信设备包括电路板，网络连接器，网络芯片和多个网络磁性组件。 网络连接器，网络芯片和网络磁性组件设置在电路板上。 网络磁性组件分别与网络连接器和网络芯片电连接。 每个网络磁性组件包括以太网变压器和至少一个电感器。 以太网变压器通过电路板的导电迹线与电感器串联电连接。 任何两个相邻的以太网变压器分别布置有具有第二特定长度的间隙。

公开(公告)号：US09451701B2

公开(公告)日：2016-09-20

申请号：US14594083

申请日：2015-01-10

Applicant: CYNTEC CO., LTD.

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Bau-Ru Lu

IPC: H05K7/00 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01F27/02 ,  H05K3/34 ,  H01L23/24 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00

CPC classification number: H05K1/181 ,  H01F27/022 ,  H01F27/027 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

公开(公告)号：US20150371773A1

公开(公告)日：2015-12-24

申请号：US14746854

申请日：2015-06-23

Applicant: Cyntec Co., Ltd.

Inventor： Hsieh-Shen Hsieh ,  Shih-Feng Chien ,  Yu-Lun Chang ,  Chih-Hung Wei

IPC: H01F41/02

CPC classification number: H01F41/0233 ,  H01F27/24 ,  H01F27/245 ,  Y10T156/1052

Abstract: A method of manufacturing magnetic core elements includes preparing a plurality of magnetic green sheets and a plurality of non-magnetic green sheets; alternately laminating the plurality of magnetic green sheets and non-magnetic green sheets directly upon one another, thereby forming a green sheet laminate; cutting the green sheet laminate into individual bodies with desired dimension; and sintering the individual bodies, thereby forming a magnetic core element with discretely distributed gaps.

Abstract translation: 制造磁芯元件的方法包括制备多个磁性生坯片和多个非磁性生坯片; 交替地将多个磁性生片和非磁性生片彼此直接层叠，从而形成生片层压体; 将生片层压材料切割成具有所需尺寸的各个体; 并烧结各个体，从而形成具有离散分布间隙的磁芯元件。