公开(公告)号：US20230420357A1

公开(公告)日：2023-12-28

申请号：US17848624

申请日：2022-06-24

申请人： Intel Corporation

发明人： Brandon C. MARIN ,  Suddhasattwa NAD ,  Srinivas V. PIETAMBARAM ,  Gang DUAN ,  Jeremy D. ECTON ,  Kristof DARMAWIKARTA ,  Sameer PAITAL

IPC分类号： H01L23/498 ,  H01L21/02 ,  H01L21/48

CPC分类号： H01L23/49894 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L21/0217 ,  H01L21/486 ,  H01L24/16

摘要： Embodiments herein relate to systems, apparatuses, or processes directed to forming an LGA pad on a side of a substrate, with a layer of silicon nitride between the LGA pad and a dielectric layer of the substrate. The LGA pad may have a reduced footprint, or a reduced lateral dimension with respect to a plane of the substrate, as compared to legacy LGA pads to reduce insertion loss by reducing the resulting capacitance between the reduced LGA footprint and metal routings within the substrate. The layer of silicon nitride may provide additional mechanical support for the reduced footprint. Other embodiments may be described and/or claimed.

公开(公告)号：US20230420322A1

公开(公告)日：2023-12-28

申请号：US17848615

申请日：2022-06-24

申请人： Intel Corporation

发明人： Yi YANG ,  Srinivas V. PIETAMBARAM ,  Suddhasattwa NAD ,  Darko GRUJICIC ,  Marcel WALL

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L23/495

CPC分类号： H01L23/3142 ,  H01L23/49827 ,  H01L23/49513

摘要： Embodiments herein relate to systems, apparatuses, or processes directed to an organic adhesion promoter layer on the surface of a copper trace to reduce delamination between a dielectric material and the surface of the copper trace, and to facilitate a smooth surface interface between the surface of the copper trace and of a copper feature, such as a copper-filled via, placed on the surface of the copper trace. The smooth surface interface reduces insertion loss and enables routing of higher frequency signals on a package, and does not require roughing of the copper trace in order to adhere to the dielectric material. Other embodiments may be described and/or claimed.

公开(公告)号：US20230361043A1

公开(公告)日：2023-11-09

申请号：US18224504

申请日：2023-07-20

申请人： Intel Corporation

发明人： Srinivas V. PIETAMBARAM ,  Rahul N. MANEPALLI

IPC分类号： H01L23/538 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L23/5381 ,  H01L23/5385 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/17 ,  H01L25/0655 ,  H01L24/13 ,  H01L2224/73265 ,  H01L2224/73204 ,  H01L2924/1434 ,  H01L2224/92125 ,  H01L23/5383 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/48227 ,  H01L2924/15192 ,  H01L2224/131 ,  H01L2224/32225 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/1511 ,  H01L2924/15747 ,  H01L2924/1579

摘要： Electrical interconnect bridge technology is disclosed. An electrical interconnect bridge can include a bridge substrate formed of a mold compound material. The electrical interconnect bridge can also include a plurality of routing layers within the bridge substrate, each routing layer having a plurality of fine line and space (FLS) traces. In addition, the electrical interconnect bridge can include a via extending through the substrate and electrically coupling at least one of the FLS traces in one of the routing layers to at least one of the FLS traces in another of the routing layers.

公开(公告)号：US20230089093A1

公开(公告)日：2023-03-23

申请号：US17482804

申请日：2021-09-23

申请人： Intel Corporation

发明人： Srinivas V. PIETAMBARAM ,  Tarek A. IBRAHIM ,  Krishna BHARATH ,  Bharat PENMECHA ,  Anderw COLLINS ,  Kaladhar RADHAKRISHNAN ,  Sriram SRINIVASAN

IPC分类号： H01F27/28 ,  H01F27/24 ,  H01F41/04

摘要： Embodiments disclosed herein include electronic packages and methods of assembling such electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a plug is formed through the core, where the plug comprises a magnetic material. In an embodiment, an inductor is around the plug. In an embodiment, first layers are over the core, wherein where the first layers comprise a dielectric material; and second layers are under the core, where the second layers comprise the dielectric material.

公开(公告)号：US20210358872A1

公开(公告)日：2021-11-18

申请号：US17387836

申请日：2021-07-28

申请人： Intel Corporation

发明人： Srinivas V. PIETAMBARAM ,  Rahul N. MANEPALLI ,  Kristof Kuwawi DARMAWIKARTA ,  Robert Alan MAY ,  Aleksandar ALEKSOV ,  Telesphor KAMGAING

IPC分类号： H01L23/66 ,  H01L21/56 ,  H01L23/00

摘要： Semiconductor packages having a die electrically connected to an antenna by a coaxial interconnect are described. In an example, a semiconductor package includes a molded layer between a first antenna patch and a second antenna patch of the antenna. The first patch may be electrically connected to the coaxial interconnect, and the second patch may be mounted on the molded layer. The molded layer may be formed from a molding compound, and may have a stiffness to resist warpage during fabrication and use of the semiconductor package.

公开(公告)号：US20190206786A1

公开(公告)日：2019-07-04

申请号：US15857454

申请日：2017-12-28

申请人： Intel Corporation

发明人： Aleksandar ALEKSOV ,  Kristof DARMAWIKARTA ,  Sandeep GAAN ,  Srinivas V. PIETAMBARAM ,  Sameer R. PAITAL

IPC分类号： H01L23/50 ,  H01L23/498 ,  H01L49/02 ,  H01L23/64 ,  H01L21/48

CPC分类号： H01L23/50 ,  H01L21/4857 ,  H01L23/49822 ,  H01L28/20 ,  H01L28/40

摘要： An apparatus is provided which comprises: one or more first conductive contacts on a first surface, one or more second conductive contacts on a second surface opposite the first surface, a dielectric layer between the first and the second surfaces, and an embedded capacitor on the dielectric layer conductively coupled with one of the first conductive contacts, wherein the embedded capacitor comprises a first metal layer on the dielectric layer, a thin film dielectric material on a surface of the metal layer, a second metal layer on the surface of the first metal layer, and a third metal layer on the thin film dielectric material. Other embodiments are also disclosed and claimed.

公开(公告)号：US20240332125A1

公开(公告)日：2024-10-03

申请号：US18128848

申请日：2023-03-30

申请人： Intel Corporation

发明人： Kyle ARRINGTON ,  Clay ARRINGTON ,  Bohan SHAN ,  Haobo CHEN ,  Srinivas V. PIETAMBARAM ,  Gang DUAN ,  Ziyin LIN ,  Hongxia FENG ,  Yiqun BAI ,  Xiaoying GUO ,  Dingying XU ,  Bai NIE

IPC分类号： H01L23/373 ,  H01L21/48 ,  H01L23/24 ,  H01L23/498

CPC分类号： H01L23/3737 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/24 ,  H01L23/49822 ,  H01L23/49827

摘要： Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a first layer and a second layer over the first layer. In an embodiment, the second layer comprises a dielectric material including sulfur. In an embodiment, fillers are within the second layer. In an embodiment, the fillers have a volume fraction that is less than approximately 0.2.

公开(公告)号：US20240222130A1

公开(公告)日：2024-07-04

申请号：US18091026

申请日：2022-12-29

申请人： Intel Corporation

发明人： Shaojiang CHEN ,  Jeremy D. ECTON ,  Oladeji FADAYOMI ,  Hsin-Wei WANG ,  Changhua LIU ,  Bin MU ,  Hongxia FENG ,  Brandon C. MARIN ,  Srinivas V. PIETAMBARAM

IPC分类号： H01L21/306 ,  H01L21/321 ,  H01L21/48 ,  H01L21/768

CPC分类号： H01L21/30604 ,  H01L21/3212 ,  H01L21/486 ,  H01L21/7688 ,  H01L21/76898 ,  H01L21/268

摘要： Embodiments disclosed herein include electronic packages and methods of forming electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a through glass via (TGV) is provided through a thickness of the core. In an embodiment, the TGV comprises a top surface that is non-planar and includes a symmetric ridge on the non-planar top surface.

公开(公告)号：US20240213111A1

公开(公告)日：2024-06-27

申请号：US18088360

申请日：2022-12-23

申请人： Intel Corporation

发明人： Mohammad Mamunur RAHMAN ,  Je-Young CHANG ,  Jeremy D. ECTON ,  Rahul N. MANEPALLI ,  Srinivas V. PIETAMBARAM ,  Gang DUAN ,  Brandon C. MARIN ,  Suddhasattwa NAD

IPC分类号： H01L23/367 ,  G06F1/20 ,  H01L23/15 ,  H01L23/427 ,  H01L23/473 ,  H01L23/498

CPC分类号： H01L23/367 ,  G06F1/20 ,  H01L23/15 ,  H01L23/427 ,  H01L23/473 ,  H01L23/49816

摘要： Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a core with a first surface and a second surface opposite from the first surface, and where the core comprises glass. In an embodiment, a channel is disposed into the first surface of the core, and a lid is provided over the channel. In an embodiment, the lid seals the channel between a first end and a second end of the channel.

公开(公告)号：US20240178157A1

公开(公告)日：2024-05-30

申请号：US18071257

申请日：2022-11-29

申请人： Intel Corporation

发明人： Vinith BEJUGAM ,  Whitney BRYKS ,  Brandon C. MARIN ,  Vishal Bhimrao ZADE ,  Deniz TURAN ,  Srinivas V. PIETAMBARAM

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L23/562 ,  H01L23/49822

摘要： Embodiments disclosed herein include package substrates. In a particular embodiment, the package substrate comprises a core. The core may be a glass core. In an embodiment, buildup layers are provided over the core, and a shape memory polymer (SMP) is provided over the core.