公开(公告)号：US4989413A

公开(公告)日：1991-02-05

申请号：US485582

申请日：1990-02-27

申请人： Toshiyuki Fukuda

发明人： Toshiyuki Fukuda

IPC分类号： F25B5/02 ,  F25D21/00

CPC分类号： F25B5/02 ,  F25D21/002 ,  F25B2400/22

摘要： A method for controlling the defrosting of evaporators provided for refrigerator-freezer units which are cooled by a single compressor. The method includes the steps of forcedly resetting the defrosting timer to its cooling mode after entering defrosting mode after the defrosting of a preset number of evaporators. The remaining undefrosted evaporators are warmed by their remaining heat after the forced resetting, by supplying electric current to their defrosting heaters sooner than the already defrosted evaporators in the next defrosting, by supplying additional electric current to their defrosting heaters after the forced resetting, by accomplishing a complete defrosting in an unsalable mode, by using outside air for defrosting by stopping their outer fans or by additional heating via auxiliary defrosting heaters. The defrosting of all of the evaporators can be performed sufficiently and uniformly, excessive warming of the inside of any unit can be prevented, and the cooling loads after a defrosting mode can be prevented from increasing too much.

公开(公告)号：US08455902B2

公开(公告)日：2013-06-04

申请号：US13193075

申请日：2011-07-28

申请人： Kiyokazu Itoi ,  Toshiyuki Fukuda ,  Yoshiki Takayama ,  Tetsushi Nishio ,  Tetsumasa Maruo

发明人： Kiyokazu Itoi ,  Toshiyuki Fukuda ,  Yoshiki Takayama ,  Tetsushi Nishio ,  Tetsumasa Maruo

IPC分类号： H01L31/0203

CPC分类号： A61B1/05 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14687 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H04N5/2251 ,  H04N5/2252 ,  H04N5/2254 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical device is equipped with a light receiving region 16a and a peripheral circuit region 22 located around the light receiving region 16a on a major surface of an light receiving element 11a; electrodes for external connection 15 electrically connected to the peripheral circuit region 22 formed on a back surface opposite to the major surface of the light receiving element 11a; a transparent member 12 covering the light receiving region 16a adhered on the major surface of the light receiving element 11a with a light-transmitting adhesive 13; and a molding resin 14 for coating side surfaces of the transparent member 12 and the major surface of the light receiving element 11a excluding the region covered with the transparent member 12.

摘要翻译： 光学装置配备有光接收区域16a和位于光接收元件11a的主表面上的光接收区域16a周围的外围电路区域22; 电连接到形成在与光接收元件11a的主表面相反的背面上的外围电路区域22的外部连接用电极15; 透明构件12，用透光性粘接剂13覆盖粘接在受光元件11a的主表面上的受光区域16a; 以及用于涂覆透明构件12的侧表面和除了透明构件12覆盖的区域之外的光接收元件11a的主表面的模塑树脂14。

公开(公告)号：US08178955B2

公开(公告)日：2012-05-15

申请号：US13079294

申请日：2011-04-04

申请人： Kenichi Itou ,  Noboru Takeuchi ,  Shigetoyo Kawakami ,  Toshiyuki Fukuda

发明人： Kenichi Itou ,  Noboru Takeuchi ,  Shigetoyo Kawakami ,  Toshiyuki Fukuda

IPC分类号： H01L23/495

CPC分类号： H01L21/568 ,  H01L21/4828 ,  H01L21/56 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48644 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/85385 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/20752 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.

摘要翻译： 半导体器件包括：半导体元件; 安装有半导体元件的管芯焊盘; 多个电极端子，每个电极端子具有与半导体元件电连接的连接部分; 以及用于密封半导体元件，芯片焊盘和电极端子的密封树脂，使得与具有连接部分的表面相反侧的每个电极端子的表面作为外部端子表面露出。 在每个电极端子的与连接部分的表面上形成具有平面形状的凹部，并且凹部布置在从密封树脂的外缘侧面露出的电极端子的端部与连接部 一部分。 尽管通过减轻施加到电极端子的外力来保持用于抑制电极端子和密封树脂之间的剥离的结构的功能，但可以使半导体器件小型化。

公开(公告)号：US08125079B2

公开(公告)日：2012-02-28

申请号：US11806923

申请日：2007-06-05

申请人： Tetsuo Ito ,  Takayuki Yoshida ,  Toshiyuki Fukuda ,  Takao Ochi

发明人： Tetsuo Ito ,  Takayuki Yoshida ,  Toshiyuki Fukuda ,  Takao Ochi

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： B29C45/0025 ,  B29C45/14655 ,  B29C45/2708 ,  B29C45/34 ,  B29C2045/0027 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A resin molding mold 20 with a cavity 21 has a resin injection port 29a from which a molding resin 25 is injected toward the cavity 21, and an air release port 30a from which air from the cavity 21 is released during resin injection. Not only the resin injection port 29a but also the air release port 30a is formed in a top surface portion 21a of the cavity 21. Thus, even if a resin burr remains in the resin injection port 29a or the air release port 30a, it can be prevented from adhering to an external terminal 4A provided on a front surface portion 2a of the substrate 2.

摘要翻译： 具有空腔21的树脂成型模具20具有树脂注入口29a，模塑树脂25从其注入腔21，在树脂注射期间从空腔21释放空气的空气释放口30a。 不仅在空腔21的上表面部分21a中形成树脂注入口29a而且还有空气释放口30a。因此，即使在树脂注入口29a或排气口30a中残留树脂毛刺，也可以 防止粘附到设置在基板2的前表面部分2a上的外部端子4A。

公开(公告)号：US08013350B2

公开(公告)日：2011-09-06

申请号：US11968763

申请日：2008-01-03

申请人： Kiyokazu Itoi ,  Toshiyuki Fukuda ,  Yoshiki Takayama ,  Tetsushi Nishio ,  Tetsumasa Maruo

发明人： Kiyokazu Itoi ,  Toshiyuki Fukuda ,  Yoshiki Takayama ,  Tetsushi Nishio ,  Tetsumasa Maruo

IPC分类号： H01L31/0203

CPC分类号： A61B1/05 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14687 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H04N5/2251 ,  H04N5/2252 ,  H04N5/2254 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical device is equipped with a light receiving region 16a and a peripheral circuit region 22 located around the light receiving region 16a on a major surface of an light receiving element 11a; electrodes for external connection 15 electrically connected to the peripheral circuit region 22 formed on a back surface opposite to the major surface of the light receiving element 11a; a transparent member 12 covering the light receiving region 16a adhered on the major surface of the light receiving element 11a with a light-transmitting adhesive 13; and a molding resin 14 for coating side surfaces of the transparent member 12 and the major surface of the light receiving element 11a excluding the region covered with the transparent member 12.

摘要翻译： 光学装置配备有光接收区域16a和位于光接收元件11a的主表面上的光接收区域16a周围的外围电路区域22; 电连接到形成在与光接收元件11a的主表面相反的背面上的外围电路区域22的外部连接用电极15; 透明构件12，用透光性粘接剂13覆盖粘接在受光元件11a的主表面上的受光区域16a; 以及用于涂覆透明构件12的侧表面和除了透明构件12覆盖的区域之外的光接收元件11a的主表面的模塑树脂14。

公开(公告)号：US07923798B2

公开(公告)日：2011-04-12

申请号：US12045522

申请日：2008-03-10

申请人： Masanori Minamio ,  Yoshiki Takayama ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Yoshiki Takayama ,  Toshiyuki Fukuda

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14625 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14632 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05567 ,  H01L2224/13 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2924/00014 ,  H04N5/2257 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An optical device includes a light receiving element chip having: an active region formed on a principal plane of a substrate and made by arranging a plurality of light receiving pixels; a circuit region disposed around an outer circumference of the active region; a penetrating conductor provided to penetrate the substrate in the thickness direction of the substrate; and an external connection terminal provided on a back surface of the substrate facing the principal plane thereof and connected to the penetrating conductor. The optical device further includes a microlens, a planarization film, and a transparent protective film formed on the planarization film.

摘要翻译： 光学装置包括：光接收元件芯片，其具有：形成在基板的主平面上并通过布置多个光接收像素而制成的有源区; 设置在所述有源区域的外周的电路区域; 穿透导体，其设置成在所述基板的厚度方向上穿透所述基板; 以及外部连接端子，其设置在所述基板的与所述基板的主面相对的背面，并与所述贯通导体连接。 光学器件还包括形成在平坦化膜上的微透镜，平坦化膜和透明保护膜。

公开(公告)号：US07876570B2

公开(公告)日：2011-01-25

申请号：US12566186

申请日：2009-09-24

申请人： Masanori Minamio ,  Hideki Takehara ,  Yoshiyuki Arai ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Hideki Takehara ,  Yoshiyuki Arai ,  Toshiyuki Fukuda

IPC分类号： H05K1/16

CPC分类号： H05K3/284 ,  H05K3/3442 ,  H05K2201/0191 ,  H05K2201/10636 ,  Y02P70/611

摘要： In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed relation thereto by using a solder. The electronic components are encapsulated in an encapsulating resin. When the distance between the lower surface of the main body portion of each of the electronic components and the component mounting surface is assumed to be a and the thickness of the portion of the encapsulating resin which is located above the main body portion of the electronic component is assumed to be b, if b/a is set to a value of not more than 6, it becomes possible to prevent, when the module with embedded electronic components is reflow-mounted on a printed wiring substrate or the like, the occurrence of a short circuit failure resulting from the melting and flowing of the solder which causes a short circuit between the two electrode portions.

摘要翻译： 在具有嵌入式电子部件的模块中，在基板的部件安装面上形成有连接电极。 每个电子部件的电极部分被放置在各个连接电极上，并通过使用焊料与固定的关系连接。 电子部件被封装在封装树脂中。 当将每个电子部件的主体部分的下表面与部件安装表面之间的距离假设为a，并且封装树脂的位于电子部件的主体部分上方的部分的厚度 假定为b，如果b / a设定为不大于6的值，则当具有嵌入式电子部件的模块被回流安装在印刷布线基板等上时，可以防止发生 由焊料的熔化和流动导致的短路故障，这导致两个电极部分之间的短路。

公开(公告)号：US07817204B2

公开(公告)日：2010-10-19

申请号：US11979122

申请日：2007-10-31

申请人： Masanori Minamio ,  Yutaka Harada ,  Takahito Ishikawa ,  Toshiyuki Fukuda ,  Yoshiki Takayama

发明人： Masanori Minamio ,  Yutaka Harada ,  Takahito Ishikawa ,  Toshiyuki Fukuda ,  Yoshiki Takayama

IPC分类号： H04N9/07 ,  H04N5/225 ,  H04N9/09

CPC分类号： H04N5/2254 ,  H04N5/2253

摘要： A solid-state image sensor includes a first image sensing device, a first flexible substrate connected to the first image sensing device, a second solid-state image sensing device, and a second flexible substrate connected to the second solid-state image sensing device. The solid-state image sensing devices are disposed adjacently to each other such that light receiving surfaces are perpendicular to each other. The second solid-state image sensing device directly receives incident light. However, the first solid-state image sensing device receives the incident light reflected by a mirror. Electronic components are mounted on the two flexible substrates. The first flexible substrate is bent at two bending positions to face the second flexible substrate and electrically connected thereto.

摘要翻译： 固态图像传感器包括第一图像感测装置，连接到第一图像感测装置的第一柔性基板，第二固态图像感测装置和连接到第二固态图像感测装置的第二柔性基板。 固态图像感测装置彼此相邻设置，使得光接收表面彼此垂直。 第二固体摄像装置直接接收入射光。 然而，第一固态图像感测装置接收由反射镜反射的入射光。 电子部件安装在两个柔性基板上。 第一柔性基板在两个弯曲位置处弯曲以面对第二柔性基板并与其电连接。

公开(公告)号：US07816777B2

公开(公告)日：2010-10-19

申请号：US11607001

申请日：2006-12-01

申请人： Masanori Minamio ,  Noboru Takeuchi ,  Kenichi Itou ,  Toshiyuki Fukuda ,  Hideki Sakota

发明人： Masanori Minamio ,  Noboru Takeuchi ,  Kenichi Itou ,  Toshiyuki Fukuda ,  Hideki Sakota

IPC分类号： H01L21/48

CPC分类号： H01L25/0655 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/28 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/10161 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/0665

摘要： A semiconductor-element mounting substrate is a substrate for mounting a semiconductor element, and includes a substrate body. The substrate body has a mounting surface, and the center portion of the mounting surface is provided with a die pattern. Through conductors are provided in a portion of the substrate body located outside the die pattern to penetrate the substrate body in the thicknesswise direction. First terminals and second terminals are connected to the through conductors, respectively. The first terminals each extend toward the outer edge of the mounting surface, and they are electrically connected to the semiconductor element. The second terminals are provided on a surface of the substrate body opposite to the mounting surface.

摘要翻译： 半导体元件安装基板是用于安装半导体元件的基板，并且包括基板主体。 基板主体具有安装面，安装面的中心部设置有模具图案。 通过导体设置在位于模具图案外部的基板主体的一部分中，以在厚度方向上穿透基板主体。 第一端子和第二端子分别连接到贯通导体。 第一端子各自朝向安装表面的外边缘延伸，并且它们电连接到半导体元件。 第二端子设置在基板主体的与安装表面相对的表面上。

公开(公告)号：US07629687B2

公开(公告)日：2009-12-08

申请号：US11553766

申请日：2006-10-27

申请人： Yukihiro Kozaka ,  Toshiyuki Fukuda ,  Nozomi Shimoishizaka ,  Kazuhiko Matsumura

发明人： Yukihiro Kozaka ,  Toshiyuki Fukuda ,  Nozomi Shimoishizaka ,  Kazuhiko Matsumura

IPC分类号： H01L23/488

CPC分类号： H01L24/10 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/4985 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/81895 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device includes a wiring board having a plurality of conductive wires aligned on an insulating base material and a board bump with a plated metal formed on each conductive wire so as to cover an upper surface and both sides of the conductive wire; and a semiconductor chip mounted on the wiring board, with electrodes of the semiconductor chip being connected to the conductive wires via the board bumps. Chip bumps are formed on the electrodes of the semiconductor chip. The electrodes of the semiconductor chip are connected to the conductive wires via a bond between the chip bumps and the board bumps. Protruding portions are formed by part of the plated metal of the board bumps at the bonded portion peeling off and protruding outwardly from a bonding surface of the chip bumps and the board bumps. Mechanical damage to the semiconductor chip caused by ultrasonic vibrations applied during process of mounting the semiconductor chip.

摘要翻译： 一种半导体器件包括布线板，其具有在绝缘基材上排列的多根导线和形成在每根导线上的电镀金属的板凸起，以覆盖导线的上表面和两侧; 以及安装在所述布线板上的半导体芯片，其中所述半导体芯片的电极经由所述板凸块连接到所述导线。 在半导体芯片的电极上形成芯片凸块。 半导体芯片的电极通过芯片凸块和板凸块之间的接合连接到导线。 在接合部分剥离并从芯片凸块的接合表面和板凸起向外突出的部分，由电路板凸块的电镀金属的一部分形成突出部分。 在半导体芯片的安装过程中由超声波振动引起的对半导体芯片的机械损伤。