公开(公告)号：US20140076623A1

公开(公告)日：2014-03-20

申请号：US14022611

申请日：2013-09-10

Applicant: FUJITSU COMPONENT LIMITED

Inventor： Shinya YAMAMOTO

IPC: H05K1/11 ,  H05K3/42

CPC classification number: H05K1/113 ,  H05K1/09 ,  H05K1/116 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/38 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/099 ,  Y10T29/49155

Abstract: A printed circuit board includes: a substrate; a land that is disposed on a surface of the substrate, and includes a central portion and a plurality of extended portions, the central portion having the same shape and the same size as a land of a surface mount device, and the extended portions being up-and-down symmetry and right-and-left symmetry with respect to a straight line which passes through the center of the central portion; gaps that are disposed on the surface of the substrate, each of the gaps being disposed on a periphery of the central portion and between the extended portions; and a resist that is disposed on the surface of the substrate, and has an opening portion formed at a position corresponding to the central portion and the gaps.

Abstract translation: 印刷电路板包括：基板; 设置在所述基板的表面上并且包括中心部分和多个延伸部分的区域，所述中心部分具有与表面安装装置的平台相同的形状和尺寸相同的尺寸，并且所述延伸部分向上 相对于穿过中心部分的中心的直线对称和右对称; 设置在基板的表面上的间隙，每个间隙设置在中心部分的周边和延伸部分之间; 以及设置在基板的表面上的抗蚀剂，并且具有形成在与中心部分和间隙相对应的位置处的开口部分。

公开(公告)号：US08661665B2

公开(公告)日：2014-03-04

申请号：US13315821

申请日：2011-12-09

Applicant: Sho Akai ,  Tatsuya Imai ,  Iku Tokihisa

Inventor： Sho Akai ,  Tatsuya Imai ,  Iku Tokihisa

IPC: H01K3/10

CPC classification number: H05K3/3452 ,  H05K3/244 ,  H05K3/389 ,  H05K3/4644 ,  H05K2201/099 ,  H05K2203/025

Abstract: A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.

Abstract translation: 一种多层印刷线路板，包括第一层间树脂绝缘层，形成在第一层间树脂绝缘层上的焊盘，形成在第一层间树脂绝缘层上的阻焊层和焊盘，形成在焊盘的一部分上的保护膜 由阻焊层的开口暴露，以及形成在焊盘和阻焊层之间的涂层。 垫安装电子元件。 涂层具有金属层和涂膜。 金属层形成在焊盘的表面上，涂膜形成在金属层上。

公开(公告)号：US08624132B2

公开(公告)日：2014-01-07

申请号：US13109745

申请日：2011-05-17

Applicant: Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

Inventor： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

IPC: H05K1/11

CPC classification number: H05K3/3478 ,  B23K3/0623 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/544 ,  H01L24/81 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A printed wiring board including a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. In the printed wiring board, since the at least one conductor pad is aligned at a pitch of about 200 μm or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is about 1.05 to about 1.7, connection reliability and insulation reliability can be easily improved.

Abstract translation: 一种印刷电路板，包括设置有至少一个导体电路的布线基板，设置在所述布线基板的表面上的阻焊层，至少一个导体焊盘，所述导体焊盘由设置在所述焊料中的开口露出的所述导体电路的一部分形成 抗蚀剂层和用于将电子部件安装在导体焊盘上的至少一个焊料凸块。 在印刷布线板中，由于至少一个导体焊盘以约200μm或更小的间距对准，并且焊料凸块的直径W与形成的开口的开口直径D的比（W / D） 在阻焊层中约1.05〜约1.7，可以容易地提高连接可靠性和绝缘可靠性。

公开(公告)号：US08581388B2

公开(公告)日：2013-11-12

申请号：US12976427

申请日：2010-12-22

Applicant: Shinnosuke Maeda ,  Tetsuo Suzuki ,  Atsuhiko Sugimoto ,  Tatsuya Ito ,  Takuya Hando ,  Satoshi Hirano

Inventor： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Atsuhiko Sugimoto ,  Tatsuya Ito ,  Takuya Hando ,  Satoshi Hirano

IPC: H01L23/053 ,  H01L21/4763

CPC classification number: H05K3/3452 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/205 ,  H05K3/383 ,  H05K3/4682 ,  H05K2201/068 ,  H05K2201/094 ,  H05K2201/09527 ,  H05K2201/099 ,  H05K2203/0346 ,  H05K2203/0369 ,  H01L2924/00

Abstract: A multilayered wiring substrate, comprising: a plurality of first main surface side connecting terminals arranged in a first main surface of a stack structure; and a plurality of second main surface side connecting terminals being arranged in a second main surface of the stack structure; wherein a plurality of conductor layers are alternately formed in a plurality of stacked resin insulation layers and are operably connected to each other through via conductors tapered such that diameters thereof are widened toward the first or the second main surface, wherein a plurality of openings are formed in an exposed outermost resin insulation layer in the second main surface, and terminal outer surfaces of the second main surface side connecting terminals arranged to match with the plurality of the openings are positioned inwardly from an outer main surface of the exposed outermost resin insulation layer, and edges of terminal inner surfaces are rounded.

Abstract translation: 一种多层布线基板，包括：布置在堆叠结构的第一主表面中的多个第一主表面侧连接端子; 并且多个第二主表面侧连接端子布置在所述堆叠结构的第二主表面中; 其中多个导体层交替地形成在多个堆叠的树脂绝缘层中，并且通过锥形的通孔导体可操作地连接，使得其直径朝向第一或第二主表面加宽，其中形成多个开口 在第二主表面中暴露的最外层树脂绝缘层中，并且布置成与多个开口相匹配的第二主表面侧连接端子的端子外表面从暴露的最外层树脂绝缘层的外主表面位于内侧， 并且端子内表面的边缘是圆形的。

公开(公告)号：US20130221075A1

公开(公告)日：2013-08-29

申请号：US13759960

申请日：2013-02-05

Applicant: Flextronics AP, LLC

Inventor： Glen C. Shepherd ,  Anthony Aaron Lynn Burton ,  Michael Ryan Ng ,  Mimi Munson Tantillo ,  Dieu-Huong Nguyen Tran

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K1/114 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.

Abstract translation: 本发明涉及一种具有通孔和衬垫结构以减少焊料芯吸的衬底。 每个通孔和焊盘结构将组件连接到与衬底相关联的导电层。 衬底包括一个或多个电镀通孔，围绕镀覆通孔的焊接掩模，以及具有连接到每个电镀通孔的导电迹线的导电焊盘。 导电焊盘延伸超过端子侧以增加焊料形成，并且焊接掩模减少部件终端处的焊料形成。 通孔和焊盘结构适用于各种组件和高组件密度。 本发明还提供一种用于计算延伸超过部件的端子侧的导电焊盘的最大距离的计算机实现的方法。

公开(公告)号：US20130213692A1

公开(公告)日：2013-08-22

申请号：US13544994

申请日：2012-07-10

Applicant: Chen-Yueh Kung

Inventor： Chen-Yueh Kung

IPC: H05K3/00 ,  H05K1/03

CPC classification number: H05K3/4007 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/81193 ,  H01L2924/12042 ,  H05K1/111 ,  H05K3/108 ,  H05K3/28 ,  H05K3/3452 ,  H05K2201/0341 ,  H05K2201/099 ,  H05K2203/0588 ,  H05K2203/1383 ,  Y02P70/611 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of fabricating a circuit board includes the following steps. A first and a second patterned conductive layer are plated on the first and the second surface of a core substrate, respectively. A first and a second extending pad are individually plated on a first and a second pad of the first and the second patterned conductive layer, respectively. A first and a second thermal-curing type dielectric layer are individually formed on the first and the second surface to cover the first and the second patterned conductive layer and the first and the second extending pad, respectively. A portion of the first and the second thermal-curing type dielectric layer respectively covering the top of the first and the second extending pad are removed. A protective film covers the second extending pad. The extending pad is removed by an etching process.

Abstract translation: 制造电路板的方法包括以下步骤。 第一和第二图案化导电层分别电镀在芯基板的第一和第二表面上。 第一和第二延伸焊盘分别电镀在第一和第二图案化导电层的第一和第二焊盘上。 第一和第二热固化型电介质层分别形成在第一和第二表面上以分别覆盖第一和第二图案化导电层以及第一和第二延伸焊盘。 分别覆盖第一和第二延伸垫的顶部的第一和第二热固化型电介质层的一部分被去除。 保护膜覆盖第二延伸垫。 通过蚀刻工艺去除延伸垫。

公开(公告)号：US20130206456A1

公开(公告)日：2013-08-15

申请号：US13717901

申请日：2012-12-18

Applicant: Sony Corporation

Inventor： Motohiko Ootani ,  Norikimi Moriuchi

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K1/0269 ,  H05K3/3421 ,  H05K2201/09381 ,  H05K2201/099 ,  Y02P70/611

Abstract: There is provided a circuit board including a land provided on a mounting surface for joining a distal end portion of a connection terminal of a lead component by a solder, wherein the land is formed to extend in a predetermined direction such that the predetermined direction is a longitudinal direction and a lateral direction orthogonal to the longitudinal direction is a width direction, wherein the land includes a terminal-facing portion facing the distal end portion of the connection terminal and a distal end side continuous portion continuously extending from the terminal-facing portion in the distal end portion of the connection terminal, and wherein the land includes a narrow portion having a width smaller than a width of the distal end side continuous portion in the terminal-facing portion.

Abstract translation: 提供一种电路板，其包括设置在安装表面上的焊盘，用于通过焊料接合引线部件的连接端子的远端部分，其中，焊盘形成为沿预定方向延伸，使得预定方向为 纵向方向和与纵向方向垂直的横向方向是宽度方向，其中，所述平台包括面向所述连接端子的远端部的端子对置部以及从所述端子对置部连续延伸的前端侧连续部 连接端子的前端部，并且其中，所述平台包括宽度小于所述端子侧部分中的所述前端侧连续部分的宽度的窄部。

公开(公告)号：US20120325538A1

公开(公告)日：2012-12-27

申请号：US13606164

申请日：2012-09-07

Applicant: Peter Chiang

Inventor： Peter Chiang

IPC: H05K1/18

CPC classification number: H05K3/3484 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2203/0545 ,  Y02P70/611 ,  Y02P70/613

Abstract: A printed circuit board assembly includes: a base material of printed boards; a solder pad formed on a pad-forming portion of the base material of printed boards and having a lead-coupling portion, a soldermask-covered portion, and an intermediate portion interposed therebetween; a soldermask having a solder pad-covering portion formed on the soldermask-covered portion of the solder pad and a remainder portion formed on the base material of printed boards; and a solder paste having one portion formed on the lead-coupling portion of the solder pad and attached to a lead of an electronic component, and the other portion formed on the intermediate portion of the solder pad, the solder pad-covering portion of the soldermask being substantially free of solder paste thereabove.

Abstract translation: 印刷电路板组件包括：印刷电路板的基材; 焊盘，形成在印刷电路板的基材的焊盘形成部分上，并具有引线耦合部分，焊接掩模覆盖部分和介于其间的中间部分; 焊料掩模，其具有形成在焊盘的焊料掩模覆盖部分上的焊料覆盖部分和形成在印刷板的基材上的剩余部分; 以及焊锡膏，其一部分形成在焊盘的引线耦合部分上并附着到电子部件的引线上，而另一部分形成在焊盘的中间部分上，焊膏覆盖部分 焊膏基本上没有上面的焊膏。

公开(公告)号：US08319114B2

公开(公告)日：2012-11-27

申请号：US12061453

申请日：2008-04-02

Applicant: Sun-Wen Cyrus Cheng ,  Paulette Lemond ,  Carl Milton Wildrick

Inventor： Sun-Wen Cyrus Cheng ,  Paulette Lemond ,  Carl Milton Wildrick

IPC: H05K1/16

CPC classification number: H05K3/3442 ,  H05K1/141 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09663 ,  H05K2201/099 ,  H05K2201/09954 ,  Y02P70/613

Abstract: A dual footprint mounting package for a surface mount power converter modules and its method of manufacture. Castellated regions are formed on the edge of the component package using the appropriate sized drill or milling bit. Edge plating is applied to the castellated surfaces to create edge pads. The edge plating provides electrical continuity between the edge pads and the SMT pads. Solder mask, or other materials, is applied to prevent solder from wicking between each SMT pad and its respective edge pad. Such component may be attached to a larger device PWB using either the edge pads or the SMT pads, or may even be attached using a combination of the two, such as in the event of a pad failure or other defect.

Abstract translation: 一种用于表面贴装功率转换器模块及其制造方法的双重封装安装封装。 使用适当尺寸的钻头或铣削钻头在组件封装的边缘上形成铸造区域。 将边缘电镀施加到cast形表面以形成边缘焊盘。 边缘电镀提供边缘焊盘和SMT焊盘之间的电气连续性。 施加焊接掩模或其他材料以防止焊料在每个SMT焊盘和其相应的边缘焊盘之间芯吸。 这样的组件可以使用边缘焊盘或SMT焊盘连接到更大的设备PWB，或者甚至可以使用两者的组合来连接，例如在焊盘故障或其他缺陷的情况下。

公开(公告)号：US20120292091A1

公开(公告)日：2012-11-22

申请号：US13563258

申请日：2012-07-31

Applicant: Sang-Guk Han ,  Seok-Joon Moon

Inventor： Sang-Guk Han ,  Seok-Joon Moon

IPC: H05K1/11

CPC classification number: H01L25/0657 ,  G01R31/2808 ,  G01R31/2818 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C29/04 ,  G11C29/12 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/09 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0912 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H05K1/0268 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/002 ,  H05K3/245 ,  H05K3/28 ,  H05K3/288 ,  H05K3/323 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2201/10159 ,  H05K2203/162 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

Abstract translation: 提供具有印刷电路板的电子设备。 在一个实施例中，印刷电路板包括要与外部装置耦合的多个外部焊盘和用于测试电路的多个旁路焊盘。 外部焊盘被暴露，并且多个旁路焊盘中的至少一个不暴露于PCB的外表面。 还提供了使用电子设备的系统和测试电子设备的方法。