公开(公告)号：US08189342B2

公开(公告)日：2012-05-29

申请号：US11500960

申请日：2006-08-09

Applicant: Hyo-Jae Bang ,  Dong-Chun Lee ,  Ho-Geon Song ,  Seong-Chan Han ,  Kwang-Su Yu ,  Dong-Woo Shin

Inventor： Hyo-Jae Bang ,  Dong-Chun Lee ,  Ho-Geon Song ,  Seong-Chan Han ,  Kwang-Su Yu ,  Dong-Woo Shin

IPC: H05K1/14

CPC classification number: H05K3/403 ,  H01L2224/48091 ,  H01L2224/4824 ,  H05K3/0052 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0919 ,  H05K2203/1189 ,  H01L2924/00014

Abstract: Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.

Abstract translation: 本发明的示例性实施例可以包括印刷电路板，制造印刷电路板的方法和存储器模块/插座组件。 本发明的示例实施例可以增加存储器模块上的接触抽头的数量，此外，可以减少将存储器模块插入模块插座所需的力。

公开(公告)号：US08053889B2

公开(公告)日：2011-11-08

申请号：US12457522

申请日：2009-06-15

Applicant: Seong-chan Han ,  Dong-woo Shin ,  Hyun-jong Oh ,  Nam-yong Oh

Inventor： Seong-chan Han ,  Dong-woo Shin ,  Hyun-jong Oh ,  Nam-yong Oh

IPC: H01L23/34 ,  H05K7/10

CPC classification number: H05K1/0271 ,  H01L2924/0002 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/0133 ,  H05K2201/10159 ,  H05K2201/10265 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

Abstract translation: 提供了一种半导体模块，其包括在模块主体的暴露表面上的模块体和减震构件。 模块体可以包括在衬底上的至少一个半导体封装，并且模块体的暴露表面可以包括衬底和至少一个半导体封装的暴露表面。 根据示例实施例，模块主体还可以在至少一个半导体封装上包括传热构件，并且模块主体的暴露表面可以包括传热构件的暴露表面。

公开(公告)号：US07943071B2

公开(公告)日：2011-05-17

申请号：US12591394

申请日：2009-11-18

Applicant: Dae-Hwan Cho ,  Kyu-Chan Han ,  Dong-Seok Shim

Inventor： Dae-Hwan Cho ,  Kyu-Chan Han ,  Dong-Seok Shim

IPC: B29C49/08

CPC classification number: D01F6/62 ,  D01D5/084 ,  D01D5/16 ,  Y10T428/2913 ,  Y10T428/2933 ,  Y10T428/2969

Abstract: A polyethylene terephthalate monofilament obtained by spinning a polyethylene terephthalate chip having an intrinsic viscosity of 0.8 to 1.3, which gives a stress-strain curve exhibiting an elongation of less than 2.5% at an initial stress of 2.0 g/d, with an initial modulus value of 80 to 160 g/d, an elongation of 7.5% or less in a stress range of from 2.0 g/d to 9.0 g/d, and an elongation of at least 2.0% or more in a stress range of from 10.0 g/d to the point of break, is provided.

Abstract translation: 通过纺丝特性粘度为0.8〜1.3的聚对苯二甲酸乙二醇酯芯片得到的聚对苯二甲酸乙二醇酯单丝，其在2.0g / d的初始应力下呈现出小于2.5％的伸长率的应力 - 应变曲线，初始模量值 80〜160g / d，应力范围为2.0g / d〜9.0g / d的伸长率为7.5％以下，应力范围为10.0g / d以上的伸长率为2.0％以上。 d到断点，提供。

公开(公告)号：US20110068151A1

公开(公告)日：2011-03-24

申请号：US12881439

申请日：2010-09-14

Applicant: Nam-Yong OH ,  Seong-Chan Han ,  Jae-Young Kim ,  Jae-Hoon Choi

Inventor： Nam-Yong OH ,  Seong-Chan Han ,  Jae-Young Kim ,  Jae-Hoon Choi

IPC: B23K31/02 ,  B23K1/018

CPC classification number: B23K1/0016 ,  B23K3/0623 ,  H01L21/4853 ,  H01L23/13 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/98 ,  H01L2224/13017 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13186 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/13566 ,  H01L2224/16058 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/8102 ,  H01L2224/81193 ,  H01L2224/81232 ,  H01L2224/81359 ,  H01L2224/81399 ,  H01L2224/8192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H05K3/225 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10734 ,  H05K2203/1163 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01083

Abstract: In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the pad such that the first material and the second material exothermically react with each other to release heat to adhere the solder ball to the pad using the heat.

Abstract translation: 在焊球附着的方法中，将第一材料涂覆在焊球上。 将第二材料涂覆在要焊接焊锡球的基板的焊盘上以与第一材料放热反应。 焊球与焊盘接触，使得第一材料和第二材料彼此放热反应以释放热量，以使用热将焊球粘附到焊盘。

公开(公告)号：US07906423B2

公开(公告)日：2011-03-15

申请号：US12650093

申请日：2009-12-30

Applicant: Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

Inventor： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

IPC: H01L21/44

CPC classification number: H05K3/303 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

Abstract translation: 半导体器件包括半导体封装，电路板和间隔保持元件。 半导体封装具有从主体突出的主体和引线。 电路板具有与引线电连接的第一焊盘。 间隔保持构件插入在电路板和主体之间。 间隔保持构件保持引线与第一焊盘之间的间隔。 因此，均匀地保持引线和焊盘之间的间隔，从而提高了半导体器件的热和/或机械可靠性。

公开(公告)号：US20100098945A1

公开(公告)日：2010-04-22

申请号：US12591394

申请日：2009-11-18

Applicant: Dae-Hwan Cho ,  Kyu-Chan Han ,  Dong-Seok Shim

Inventor： Dae-Hwan Cho ,  Kyu-Chan Han ,  Dong-Seok Shim

IPC: D01F6/62 ,  D01D5/12

CPC classification number: D01F6/62 ,  D01D5/084 ,  D01D5/16 ,  Y10T428/2913 ,  Y10T428/2933 ,  Y10T428/2969

Abstract: A polyethylene terephthalate monofilament obtained by spinning a polyethylene terephthalate chip having an intrinsic viscosity of 0.8 to 1.3, which gives a stress-strain curve exhibiting an elongation of less than 2.5% at an initial stress of 2.0 g/d, with an initial modulus value of 80 to 160 g/d, an elongation of 7.5% or less in a stress range of from 2.0 g/d to 9.0 g/d, and an elongation of at least 2.0% or more in a stress range of from 10.0 g/d to the point of break, is provided.

Abstract translation: 通过纺丝特性粘度为0.8〜1.3的聚对苯二甲酸乙二醇酯芯片得到的聚对苯二甲酸乙二醇酯单丝，其在2.0g / d的初始应力下呈现出小于2.5％的伸长率的应力 - 应变曲线，初始模量值 80〜160g / d，应力范围为2.0g / d〜9.0g / d的伸长率为7.5％以下，应力范围为10.0g / d以上的伸长率为2.0％以上。 d到断点，提供。

公开(公告)号：US20090056979A1

公开(公告)日：2009-03-05

申请号：US12231196

申请日：2008-08-29

Applicant: Seong-Chan Han ,  Dong-Chun Lee ,  Young-Soo Lee

Inventor： Seong-Chan Han ,  Dong-Chun Lee ,  Young-Soo Lee

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K1/0272 ,  H05K1/0203 ,  H05K2201/064 ,  Y10T29/49124

Abstract: A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through which a cooling fluid can flow. The circuit pattern can be formed on the insulating member. Thus, high heat in the circuit pattern can be rapidly dissipated by the cooling fluid flowing through the cooling passageway.

Abstract translation: PCB可以包括绝缘构件，冷却构件和电路图案。 冷却构件可以内置在绝缘构件中。 冷却部件可以具有冷却流体可以流过的冷却通道。 电路图案可以形成在绝缘构件上。 因此，流经冷却通道的冷却流体可快速消散电路图形中的高热。

公开(公告)号：US20080130254A1

公开(公告)日：2008-06-05

申请号：US11950280

申请日：2007-12-04

Applicant: Seong-Chan HAN ,  Dong-Woo SHIN ,  Young-Soo LEE ,  Hyo-Jae BANG ,  Hun HAN

Inventor： Seong-Chan HAN ,  Dong-Woo SHIN ,  Young-Soo LEE ,  Hyo-Jae BANG ,  Hun HAN

IPC: B23P19/00 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K1/183 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/98 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/24227 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/225 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/176 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53274 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic device with a reworkable electronic component, a method of manufacturing the electronic device, and a method of reworking the electronic component are disclosed. The electronic device includes a first cavity provided in a board body. A first metal pattern is provided on the board body and adjacent to the first cavity. A first electronic component is provided in the first cavity. A first connection pattern is provided adjacent to an upper edge portion of the first electronic component and extends to the first metal pattern so that the first metal pattern is electrically connected to the first electronic component.

Abstract translation: 公开了一种具有可再加工电子部件的电子装置，电子装置的制造方法以及电子部件的再加工方法。 电子设备包括设置在板体中的第一腔。 第一金属图案设置在板体上并与第一腔相邻。 第一电子部件设置在第一腔中。 第一连接图案被设置成与第一电子部件的上边缘部分相邻并且延伸到第一金属图案，使得第一金属图案电连接到第一电子部件。

公开(公告)号：US20070109758A1

公开(公告)日：2007-05-17

申请号：US11598755

申请日：2006-11-14

Applicant: Seong-Chan Han ,  Dong-Chun Lee ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Hyo-Jae Bang ,  Hyun-Seok Choi ,  Si-Suk Kim

Inventor： Seong-Chan Han ,  Dong-Chun Lee ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Hyo-Jae Bang ,  Hyun-Seok Choi ,  Si-Suk Kim

IPC: H05K7/00

CPC classification number: H05K3/3421 ,  H05K3/243 ,  H05K3/282 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10689 ,  H05K2203/046 ,  Y02P70/613

Abstract: Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.

Abstract translation: 示例性实施例可以涉及具有绝缘基板，设置在绝缘基板的表面上的焊盘，阻焊剂和焊料移动部分的印刷电路板。 半导体封装的引线可以安装在绝缘基板上。 连接半导体封装的引线的焊盘可以设置在绝缘基板的表面上。 阻焊层可以覆盖绝缘基板，但也可以包含露出半导体封装的引线连接到的焊盘的至少一部分的开口。 在每个半导体引线连接到焊盘的过程中，焊盘上的焊料移动部分可以允许将半导体封装的每个引线的每个引线的焊锡涂层移动到半导体封装引线的肩部。

公开(公告)号：US06630247B1

公开(公告)日：2003-10-07

申请号：US09921810

申请日：2001-08-03

Applicant: Richard T. Fox ,  Chan Han ,  Aleksander J. Pyzik

Inventor： Richard T. Fox ,  Chan Han ,  Aleksander J. Pyzik

IPC: C22C2100

CPC classification number: B22D19/14 ,  C22C1/058 ,  C22C1/1036 ,  C22C2001/1057 ,  Y10T428/12007

Abstract: A ceramic-metal composite that is tough and stiff has been prepared and is comprised of an inert ceramic (e.g., alumina) embedded and dispersed in a matrix comprised of a metal (e.g., aluminum), a reactive ceramic (e.g., boron carbide) and a reactive ceramic-metal reaction product (e.g., AlB2, Al4BC, Al3B48C2, AlB12, Al4C3, AlB24C4 or mixtures thereof) wherein grains of the inert ceramic have an average grain size greater than or equal to the average grain size of grains of the reactive ceramic. The ceramic-metal composite may be prepared by forming a mixture comprised of an inert ceramic powder (e.g., alumina) and a reactive ceramic powder (e.g., boron carbide), the inert ceramic powder having an average particle size equal to or greater than the average particle size of the reactive ceramic powder, forming the mixture into a porous body and consolidating the porous body in the presence of a metal (e.g., aluminum) to form the ceramic-metal composite.

Abstract translation: 已经制备了韧性和刚性的陶瓷 - 金属复合材料，其包括嵌入和分散在由金属（例如铝），反应性陶瓷（例如碳化硼）组成的基体中的惰性陶瓷（例如氧化铝） 和反应性陶瓷 - 金属反应产物（例如，AlB2，Al4BC，Al3B48C2，AlB12，Al4C3，AlB24C4或其混合物），其中惰性陶瓷的晶粒的平均晶粒尺寸大于或等于晶粒的平均晶粒尺寸 活性陶瓷。 陶瓷 - 金属复合材料可以通过形成由惰性陶瓷粉末（例如氧化铝）和反应性陶瓷粉末（例如碳化硼）组成的混合物来制备，惰性陶瓷粉末的平均粒度等于或大于 反应性陶瓷粉末的平均粒度，将混合物形成多孔体，并在金属（例如铝）的存在下固化多孔体以形成陶瓷 - 金属复合材料。