公开(公告)号：US06252305B1

公开(公告)日：2001-06-26

申请号：US09516025

申请日：2000-02-29

Applicant: Chun Hung Lin ,  Kuang-Hui Chen ,  Shyh-Wei Wang ,  Su Tao

Inventor： Chun Hung Lin ,  Kuang-Hui Chen ,  Shyh-Wei Wang ,  Su Tao

IPC: H01L2348

CPC classification number: H01L25/0657 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/01087 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A multichip module comprises at least two semiconductor chips wherein each has a row of bonding pads formed on the active surface thereof and disposed along one side edge thereof. The semiconductor chips are mounted to a substrate in a stacking arrangement wherein the upper chip is attached to the active surface of the lower chip in a manner that no portion of the upper chip interferes with a vertical line of sight of each bond pad of the lower chip to permit wire bonding thereof. Therefore, all semiconductor chips can be wire bonded simultaneously after stacking the chips on the substrate. This allows wire bonding of all chips to be completed in a single step so as to increase UPH (unit per hour), thereby reducing cost for manufacturing the MCM.

Abstract translation: 多芯片模块包括至少两个半导体芯片，其中每个半导体芯片具有在其有效表面上形成并沿着其一个侧边缘设置的一排焊盘。 半导体芯片以堆叠方式安装到基板上，其中上芯片以下述方式附接到下芯片的有源表面，使得上芯片的任何部分不影响下芯片的每个键合焊盘的垂直视线 芯片以允许其引线接合。 因此，在将芯片堆叠在基板上之后，所有半导体芯片都可以同时引线接合。 这允许所有芯片的线接合在一个步骤中完成，以便增加UPH（每小时单位），从而降低制造MCM的成本。

公开(公告)号：US08927314B2

公开(公告)日：2015-01-06

申请号：US13549814

申请日：2012-07-16

Applicant: Sheng Yung Liu ,  Chin-Tien Yang ,  Chun-Hung Lin

Inventor： Sheng Yung Liu ,  Chin-Tien Yang ,  Chun-Hung Lin

IPC: H01L21/00 ,  H01L31/0224 ,  H01L31/0216

CPC classification number: H01L31/022433 ,  H01L31/02168 ,  Y02E10/50 ,  Y02E10/52

Abstract: A method of manufacturing a solar cell includes the steps of: providing a substrate having a front side, a back side and a doped region; forming a conductor layer on the front side; firing the conductor layer at a temperature such that the conductor layer is formed with a first portion embedded into the doped region and a second portion other than the first portion; forming an anti-reflection coating (ARC) layer on the front side and the second portion, wherein the ARC layer covers the conductor layer so that the second portion of the conductor layer is disposed in the ARC layer; and removing the ARC layer on the conductor layer so that the conductor layer has an exposed surface exposed out of the ARC layer, wherein the exposed surface of the conductor layer is substantially flush with a first exposed surface of the ARC layer.

Abstract translation: 一种制造太阳能电池的方法包括以下步骤：提供具有正面，背面和掺杂区域的基板; 在前侧形成导体层; 在使得导体层形成有嵌入掺杂区域的第一部分和除了第一部分之外的第二部分的温度下烧制导体层; 在前侧和第二部分形成防反射涂层（ARC）层，其中ARC层覆盖导体层，使得导体层的第二部分设置在ARC层中; 以及去除所述导体层上的所述ARC层，使得所述导体层具有暴露在所述ARC层外部的暴露表面，其中所述导体层的所述暴露表面基本上与所述ARC层的第一暴露表面齐平。

公开(公告)号：US08728851B2

公开(公告)日：2014-05-20

申请号：US13549877

申请日：2012-07-16

Applicant: Sheng Yung Liu ,  Chin-Tien Yang ,  Chun-Hung Lin

Inventor： Sheng Yung Liu ,  Chin-Tien Yang ,  Chun-Hung Lin

IPC: H01L31/18

CPC classification number: H01L31/022433 ,  H01L31/02168 ,  Y02E10/50 ,  Y02E10/52

Abstract: A method of manufacturing a solar cell comprises the steps of: forming a lower conductor layer on a front side of a substrate; firing the lower conductor layer at a first temperature to form a first portion embedded into a doped region of the substrate and a second portion; forming an anti-reflection coating (ARC) layer on the front side and the second portion, wherein the ARC layer covers the lower conductor layer such that the second portion is disposed in the ARC layer; forming an upper conductor layer, corresponding to the lower conductor layer and electrically connected to the lower conductor layer, on the ARC layer; and firing the upper conductor layer at a second temperature to form a first portion embedded into the ARC layer and a second portion, which is exposed out of the ARC layer.

Abstract translation: 一种制造太阳能电池的方法包括以下步骤：在基板的正面形成下导体层; 在第一温度下焙烧下导体层以形成嵌入衬底的掺杂区域中的第一部分和第二部分; 在前侧和第二部分形成防反射涂层（ARC）层，其中ARC层覆盖下导体层，使得第二部分设置在ARC层中; 在ARC层上形成对应于下导体层并电连接到下导体层的上导体层; 以及在第二温度下烧制所述上导体层以形成嵌入到所述ARC层中的第一部分和暴露在所述ARC层外的第二部分。

公开(公告)号：US08603723B2

公开(公告)日：2013-12-10

申请号：US13014285

申请日：2011-01-26

Applicant: Hsi-Wen Chang ,  Wei-Jen Lai ,  Pi-Ju Chiang ,  Chun-Hung Lin ,  Jung Ya Hsieh

Inventor： Hsi-Wen Chang ,  Wei-Jen Lai ,  Pi-Ju Chiang ,  Chun-Hung Lin ,  Jung Ya Hsieh

IPC: G03C5/16 ,  G03F1/00 ,  G02F1/03

CPC classification number: G03C11/12 ,  D06P1/0012 ,  D06P5/2005

Abstract: The present invention relates to an image transfer process. The process includes the steps of: a) providing an image carrying device including at least one photoluminescent surface; b) displaying a luminous image on a display surface of a light-emitting medium; and c) positioning the display surface of the light-emitting medium that is displaying the luminous image at a distance from the at least one photoluminescent surface of the image carrying device shorter than a predetermined effective distance, for a predetermined period of time.

Abstract translation: 本发明涉及图像转印处理。 该方法包括以下步骤：a）提供包括至少一个光致发光表面的图像承载装置; b）在发光介质的显示表面上显示发光图像; 以及c）将显示所述发光图像的所述发光介质的显示表面定位在比所述图像承载装置的所述至少一个光致发光表面短一预定有效距离的预定时间段。

公开(公告)号：US20130221522A1

公开(公告)日：2013-08-29

申请号：US13406031

申请日：2012-02-27

Applicant: Yu-Feng CHEN ,  Chun-Hung LIN ,  Han-Ping PU ,  Ming-Da CHENG ,  Kai-Chiang WU

Inventor： Yu-Feng CHEN ,  Chun-Hung LIN ,  Han-Ping PU ,  Ming-Da CHENG ,  Kai-Chiang WU

IPC: H01L23/498 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/03334 ,  H01L2224/0384 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05075 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05571 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/1184 ,  H01L2224/1191 ,  H01L2224/13005 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13078 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/207 ,  H01L2924/206 ,  H01L2924/00 ,  H01L2224/05552

Abstract: The described embodiments of mechanisms of forming connectors for package on package enable smaller connectors with finer pitch, which allow smaller package size and additional connections. The conductive elements on one package are partially embedded in the molding compound of the package to bond with contacts or metal pads on another package. By embedding the conductive elements, the conductive elements may be made smaller and there are is gaps between the conductive elements and the molding compound. A pitch of the connectors can be determined by adding a space margin to a maximum width of the connectors. Various types of contacts on the other package can be bonded to the conductive elements.

Abstract translation: 所描述的形成用于封装封装的连接器的机构的实施例使得具有更细间距的较小连接器能够实现更小的封装尺寸和附加的连接。 一个封装上的导电元件部分地嵌入封装的模制化合物中，以与另一封装上的触点或金属焊盘结合。 通过嵌入导电元件，可以使导电元件更小，并且在导电元件和模塑料之间存在间隙。 可以通过将连接器的最大宽度添加空间余量来确定连接器的间距。 另一个封装上的各种类型的触点可以结合到导电元件上。

公开(公告)号：US20130206369A1

公开(公告)日：2013-08-15

申请号：US13371480

申请日：2012-02-13

Applicant: Wei-I Lin ,  Chien-Chih Yeh ,  Wen-Shiang Chen ,  Chun-Hung Lin

Inventor： Wei-I Lin ,  Chien-Chih Yeh ,  Wen-Shiang Chen ,  Chun-Hung Lin

IPC: F28D15/04

CPC classification number: F28D15/043

Abstract: A heat dissipating device includes a chamber body, a heat sink, a pipe, a first capillary structure and N vapor channels. The chamber body has an evaporation chamber and a compensation chamber, wherein the evaporation chamber has a vapor outlet and the compensation chamber has a liquid inlet. The heat sink is disposed on an outer wall of a first side of the chamber body and at least covers the compensation chamber. The pipe is installed within the heat sink, wherein a first end of the pipe is connected to the vapor outlet and a second end of the pipe is connected to the liquid inlet. The first capillary structure is formed in the evaporation chamber. The N vapor channels are formed in the first capillary structure. The N vapor channels and the compensation chamber are isolated by the first capillary structure.

Abstract translation: 散热装置包括室主体，散热器，管，第一毛细管结构和N个蒸气通道。 腔体具有蒸发室和补偿室，其中蒸发室具有蒸汽出口，并且补偿室具有液体入口。 散热器设置在室主体的第一侧的外壁上，并且至少覆盖补偿室。 管道安装在散热器内，其中管道的第一端连接到蒸汽出口，并且管道的第二端连接到液体入口。 第一毛细结构形成在蒸发室中。 N蒸汽通道形成在第一毛细管结构中。 N蒸气通道和补偿室由第一毛细管结构隔离。

公开(公告)号：US20130187277A1

公开(公告)日：2013-07-25

申请号：US13443556

申请日：2012-04-10

Applicant: Yu-Feng Chen ,  Chun-Hung Lin ,  Han-Ping Pu ,  Chih-Hang Tung ,  Kai-Chiang Wu ,  Ming-Che Ho

Inventor： Yu-Feng Chen ,  Chun-Hung Lin ,  Han-Ping Pu ,  Chih-Hang Tung ,  Kai-Chiang Wu ,  Ming-Che Ho

IPC: H01L23/48

CPC classification number: H01L24/13 ,  H01L23/488 ,  H01L24/02 ,  H01L24/05 ,  H01L24/10 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05111 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05186 ,  H01L2224/05551 ,  H01L2224/05555 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05686 ,  H01L2224/10125 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13012 ,  H01L2224/13076 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01047 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A semiconductor die includes a crack stopper on an under-bump metallization (UBM) layer. The crack stopper is in the shape of hollow cylinder with at least two openings.

Abstract translation: 半导体管芯包括在凸块下金属化（UBM）层上的裂纹阻挡层。 裂缝止动器为具有至少两个开口的中空圆筒形状。

公开(公告)号：US20130175705A1

公开(公告)日：2013-07-11

申请号：US13348449

申请日：2012-01-11

Applicant: Chun-Hung Lin ,  Yu-Feng Chen ,  Han-Ping Pu ,  Hung-Jui Kuo

Inventor： Chun-Hung Lin ,  Yu-Feng Chen ,  Han-Ping Pu ,  Hung-Jui Kuo

IPC: H01L23/52 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00

Abstract: A stress compensation for use in packaging, and a method of forming, is provided. The stress compensation layer is placed on an opposing side of a substrate from an integrated circuit die. The stress compensation layer is designed to counteract at least some of the stress exerted structures on the die side of the substrate, such as stresses exerted by a molding compound that at least partially encapsulates the first integrated circuit die. A package may also be electrically coupled to the substrate.

Abstract translation: 提供了用于包装的应力补偿，以及形成方法。 应力补偿层从集成电路管芯放置在衬底的相对侧上。 应力补偿层被设计成抵抗基板的模具侧上的应力施加结构中的至少一些，例如由至少部分地封装第一集成电路管芯的模制化合物施加的应力。 封装还可以电耦合到衬底。

公开(公告)号：US20130037241A1

公开(公告)日：2013-02-14

申请号：US13206359

申请日：2011-08-09

Applicant: Chun-Hung LIN ,  Han-Lin Chen ,  Chang-Yin Chen

Inventor： Chun-Hung LIN ,  Han-Lin Chen ,  Chang-Yin Chen

IPC: F28D15/04

CPC classification number: F28D15/046 ,  F28D15/0233

Abstract: The heat pipe of the invention includes an evaporation section and two condensation sections. The evaporation section is located at a part of the heat pipe. The two condensation sections are separately located at two opposite sides of the evaporation section. The evaporation section and the two condensation sections communicate with each other, and a peripheral size of the evaporation section is larger than that of each of the condensation sections.

Abstract translation: 本发明的热管包括蒸发部和两个冷凝部。 蒸发段位于热管的一部分。 两个冷凝部分分别位于蒸发部分的相对两侧。 蒸发部和两个冷凝部彼此连通，蒸发部的周边尺寸大于各冷凝部的周长。

公开(公告)号：US20130000872A1

公开(公告)日：2013-01-03

申请号：US13198230

申请日：2011-08-04

Applicant: Chun-Hung LIN

Inventor： Chun-Hung LIN

IPC: F28D15/04 ,  B21D53/02

CPC classification number: B21D53/08 ,  B21D53/022 ,  F28D15/0275 ,  F28D2021/0029 ,  F28F1/32 ,  F28F2240/00 ,  Y10T29/4935

Abstract: The invention relates to the technical field of heat sinks, in particular to a fin heat sink with an improved structure and a processing method thereof. The fin heat sink with the improved structure comprises a pedestal and a plurality of cooling fins, wherein roots of the cooling fins are connected with the pedestal and provided with clamping grooves the bottoms of which are opened; clamping pieces corresponding to the clamping grooves are extended out of the pedestal; the cooling fins are clamped and connected with the clamping pieces through the clamping grooves; and the plurality of the cooling fins are subjected to layered arrangement to form a cooling fin group. The clamping grooves at the roots of the cooling fins are easy to mold through a die; the clamping pieces extended out of the pedestal are simple and convenient to process; the clamping grooves are connected with the clamping pieces by means of clamping, so the connection between the clamping grooves and the clamping pieces is reliable; and the clamping process can be completed through a stamping die. Therefore, compared with the prior art, the fin heat sink with the improved structure and the processing method thereof, which are provided by the invention, overcome the technical prejudice and can greatly reduce the processes, reduce the production cost and improve the production efficiency.

Abstract translation: 本发明涉及散热片的技术领域，特别涉及具有改进结构的散热片散热片及其加工方法。 具有改进结构的翅片散热器包括基座和多个散热片，其中散热片的根部与基座连接并设置有底部开口的夹紧槽; 对应于夹紧槽的夹紧件延伸出基座; 冷却翅片夹紧并通过夹紧槽与夹紧件连接; 并且多个散热片经受分层布置以形成散热片组。 散热片根部的夹紧槽容易通过模具成型; 从基座伸出的夹紧件简单方便; 夹紧槽通过夹紧与夹紧件连接，因此夹紧槽和夹紧件之间的连接是可靠的; 并且夹紧过程可以通过冲压模具完成。 因此，与现有技术相比，本发明提供的具有改进的结构及其加工方法的散热片散热器克服了技术偏见，可以大大降低工艺，降低生产成本，提高生产效率。