公开(公告)号：US4704626A

公开(公告)日：1987-11-03

申请号：US752872

申请日：1985-07-08

Applicant: Deepak Mahulikar ,  Satyam C. Cherukuri

Inventor： Deepak Mahulikar ,  Satyam C. Cherukuri

IPC: H01L23/10 ,  H01L23/373 ,  H01L23/02 ,  H01L23/06 ,  H01L23/48

CPC classification number: H01L23/10 ,  H01L23/373 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195

Abstract: A graded seal assembly adapted for hermetically sealing a semiconductor package is disclosed. First and second members having first and second coefficients of thermal expansion respectively are provided. A leadframe is disposed between the first and second members. A first sealing glass is bonded to opposite surfaces of the leadframe and is disposed between the leadframe and the first member for sealing the leadframe to the first member. The second sealing glass is bonded to the second member. The second sealing glass has a third CTE which has a mismatch of less than about 5.times.10.sup.-7 in/in/.degree.C. with said second member. A graded interface zone having stratified layers fuses the first and second sealing glasses. Each of the layers in the zone has a coefficient of thermal expansion which is mismatched less than about 5.times.10.sup.-7 in/in/.degree.C. with an adjacent layer to absorb thermal stress formed by exposure of the semiconductor package to thermal cycling.

Abstract translation: 公开了一种适于气密密封半导体封装的分级密封组件。 提供具有第一和第二热膨胀系数的第一和第二构件。 引线框设置在第一和第二构件之间。 第一密封玻璃结合到引线框架的相对表面，并且设置在引线框架和第一构件之间，用于将引线框架密封到第一构件。 第二密封玻璃结合到第二构件。 第二密封玻璃具有与所述第二构件不匹配的小于约5×10 -7 in / in /℃的第三CTE。 具有分层的分级界面区使第一和第二密封眼镜融合。 区域中的每个层具有小于约5×10 -7 in / in /℃的失配系数，具有相邻层以吸收由半导体封装暴露于热循环形成的热应力。

公开(公告)号：US08974677B2

公开(公告)日：2015-03-10

申请号：US12850915

申请日：2010-08-05

Applicant: Saeed H. Mohseni ,  Deepak Mahulikar

Inventor： Saeed H. Mohseni ,  Deepak Mahulikar

IPC: C02F1/00 ,  B01D37/00 ,  B01D29/56 ,  B01D35/143 ,  B01D29/00

CPC classification number: B01D35/143 ,  B01D29/56 ,  B01D29/96 ,  B01D2201/265

Abstract: Fluid processing apparatuses and systems are disclosed. In some embodiments the fluid processing apparatuses include a movable enclosure, a plurality of filter housings disposed substantially within the movable enclosure, and a stand disposed within the enclosure. The filter housings are in fluid communication with one another. Each filter housing defines an elongate path and is configured to support a respective filter along the elongate flow path to filter a substantially continuous flow of fluid. The stand supports each filter housing such that the elongate flow path of each filter housing is substantially parallel to a vertical axis, wherein each filter housing is independently rotatable, relative to the stand.

Abstract translation: 公开了流体处理装置和系统。 在一些实施例中，流体处理设备包括可移动的外壳，基本上设置在可移动外壳内的多个过滤器外壳以及设置在外壳内的支架。 过滤器壳体彼此流体连通。 每个过滤器壳体限定细长的路径并且构造成沿着细长流动路径支撑相应的过滤器以过滤基本连续的流体流。 支架支撑每个过滤器壳体，使得每个过滤器壳体的细长流动路径基本上平行于垂直轴线，其中每个过滤器壳体相对于支架独立地可旋转。

公开(公告)号：US08961815B2

公开(公告)日：2015-02-24

申请号：US12828766

申请日：2010-07-01

Applicant: Bin Hu ,  Abhiskek Singh ,  Gert Moyaerts ,  Deepak Mahulikar ,  Richard Wen

Inventor： Bin Hu ,  Abhiskek Singh ,  Gert Moyaerts ,  Deepak Mahulikar ,  Richard Wen

IPC: C09K13/04 ,  C09K3/14 ,  C09G1/02 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/768 ,  H01L29/66

CPC classification number: H01L21/30625 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/0475 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/76819 ,  H01L29/66545

Abstract: The present disclosure is directed to a highly dilutable chemical mechanical polishing concentrate comprising an abrasive, an acid, a stabilizer, and water with a point-of-use pH ranging from 2.2-3.5 for planarizing current and next generation semiconductor integrated circuit FEOL/BEOL substrates.

Abstract translation: 本公开涉及一种高度可稀释的化学机械抛光浓缩物，其包含研磨剂，酸，稳定剂和水，其使用点pH为2.2-3.5，用于平坦化电流和下一代半导体集成电路FEOL / BEOL 底物。

公开(公告)号：US20120055865A1

公开(公告)日：2012-03-08

申请号：US13159915

申请日：2011-06-14

Applicant: Saeed H. Mohseni ,  Deepak Mahulikar ,  Elizabeth Gramm

Inventor： Saeed H. Mohseni ,  Deepak Mahulikar ,  Elizabeth Gramm

IPC: B01D29/00 ,  B08B3/12 ,  B08B3/00 ,  C09K13/00 ,  C11D17/00 ,  C09K13/04 ,  C09K13/02 ,  B08B7/04 ,  B08B9/00

CPC classification number: B08B3/08 ,  B01D41/04 ,  B08B3/14 ,  C11D3/43 ,  C11D7/50

Abstract: A method for removing particles or deposits from a surface having particles or deposits thereon. The method involves contacting a surface with a chemical composition sufficient to selectively dissolve and remove at least a portion of the particles or deposits from the surface. The chemical composition is compatible with the surface. This disclosure also relates to a system of specially designed equipment for removing particles or deposits from a surface having particles or deposits thereon. The disclosure is useful, for example, in cleaning porous surfaces, media for cartridge, pleated and membrane surfaces, and internal walls of tanks or filter housings.

Abstract translation: 从其上具有颗粒或沉积物的表面去除颗粒或沉积物的方法。 该方法包括将表面与足以选择性地溶解并从表面去除至少一部分颗粒或沉积物的化学组合物接触。 化学成分与表面相容。 本公开还涉及一种用于从其上具有颗粒或沉积物的表面去除颗粒或沉积物的专门设计的设备的系统。 本公开可用于例如清洁多孔表面，用于筒的介质，褶皱和膜表面以及罐或过滤器壳体的内壁。

公开(公告)号：US20060124593A1

公开(公告)日：2006-06-15

申请号：US11141162

申请日：2005-05-31

Applicant: Gert Moyaerts ,  Ken Delbridge ,  Nichole Koontz ,  Saeed Mohseni ,  Gerome Sayles ,  Deepak Mahulikar

Inventor： Gert Moyaerts ,  Ken Delbridge ,  Nichole Koontz ,  Saeed Mohseni ,  Gerome Sayles ,  Deepak Mahulikar

IPC: C09K3/14 ,  C09G1/02 ,  C09K13/00 ,  H01L21/461 ,  B44C1/22 ,  H01L21/302 ,  C09C1/68 ,  C23F1/00 ,  B24D3/02

CPC classification number: H01L21/3212 ,  C09G1/02 ,  C09K3/1463 ,  C09K3/1472 ,  C23F3/04 ,  H01L21/30625

Abstract: A composition for chemical mechanical polishing a surface of a substrate having a plurality of ultra high purity sol gel processed colloidal silica particles for chemical mechanical polishing having alkali metals Li, Na, K, Rb, Cs, Fr and a combination thereof, at a total alkali concentration of about 300 ppb or less, with the proviso that the concentration of Na, if present, is less than 200 ppb; and a medium for suspending the particles is provided. Also, provided are methods of chemical mechanical polishing which included a step of contacting a substrate and a composition according to the present invention. The contacting is carried out at a temperature and for a period of time sufficient to planarize the substrate.

Abstract translation: 一种用于化学机械抛光基底表面的组合物，其具有多个超高纯度溶胶凝胶加工的用于具有碱金属Li，Na，K，Rb，Cs，Fr及其组合的化学机械抛光的胶体二氧化硅颗粒，其总计 碱浓度为约300ppb以下，条件是Na（如果存在）的浓度小于200ppb; 并提供用于悬浮颗粒的介质。 此外，提供了化学机械抛光的方法，其包括使基底和根据本发明的组合物接触的步骤。 接触在足以使基材平坦化的温度下进行一段时间。

公开(公告)号：US5969414A

公开(公告)日：1999-10-19

申请号：US249104

申请日：1994-05-25

Applicant: Arvind Parthasarathi ,  Deepak Mahulikar

Inventor： Arvind Parthasarathi ,  Deepak Mahulikar

IPC: H01L23/433 ,  H01L23/495 ,  H01L23/02 ,  H01L23/28 ,  H01L23/36 ,  H01L23/48

CPC classification number: H01L23/4334 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/85447 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752

Abstract: There is provided a leadframe assembly for encapsulation in a polymer resin which prevents post-assembly fracture or swelling of the resin. The leadframe is coated with an adhesion enhancing layer that increases the shear stress required for delamination to in excess of about 3.4 MPa. In combination with this adhesion enhancing layer is a compliant die attach adhesive bonding an integrated circuit device to a central die attach paddle. This compliant die attach adhesive has a compliancy factor, E.multidot.a of less than 1.5 MPa/.degree.C. and a thickness of from about 0.01 mm to about 0.08 mm.

Abstract translation: 提供了一种用于封装在聚合物树脂中的引线框架组件，其防止树脂的组装后破裂或膨胀。 引线框架涂有粘附增强层，其将分层所需的剪切应力增加到超过约3.4MPa。 与该粘合增强层结合是将集成电路装置粘合到中央管芯附接浆板上的柔性管芯附着粘合剂。 这种适合的芯片附着粘合剂具有小于1.5MPa /℃的合并因子，Exa为约0.01mm至约0.08mm的厚度。

公开(公告)号：US5952719A

公开(公告)日：1999-09-14

申请号：US891446

申请日：1997-07-10

Applicant: Peter W. Robinson ,  Deepak Mahulikar ,  Paul R. Hoffman

Inventor： Peter W. Robinson ,  Deepak Mahulikar ,  Paul R. Hoffman

IPC: H01L23/06 ,  H01L23/08 ,  H01L23/13 ,  H01L23/14 ,  H01L23/24 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H05K1/02 ,  H05K3/30 ,  H01L23/48

CPC classification number: H01L23/13 ,  H01L23/142 ,  H01L23/24 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/49816 ,  H01L24/32 ,  H05K3/305 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/0271 ,  H05K2201/10477 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613

Abstract: The bending of a ball grid array electronic package having a metallic base is reduced minimizing stresses applied to the innermost row of solder balls when the package base is cyclically heated and cooled. Reducing the stresses applied to the solder balls increases the number of thermal cycles before solder ball fracture causes device failure. Among the means disclosed to reduce the bending moment are a bimetallic composite base, an integral stiffener, a centrally disposed cover bonded to an external structure and a package base with a stress accommodating depressed portion.

Abstract translation: 当包装基底被循环加热和冷却时，具有金属基底的球栅阵列电子封装的弯曲减小了最小化施加到最内排焊球的应力。 减少施加到焊球上的应力增加了焊球破裂导致装置故障之前的热循环次数。 公开的用于减小弯矩的手段是双金属复合基座，整体加强件，结合到外部结构的中心布置的盖子和具有应力容纳凹陷部分的封装基座。

公开(公告)号：US5324888A

公开(公告)日：1994-06-28

申请号：US959571

申请日：1992-10-13

Applicant: Derek E. Tyler ,  Deepak Mahulikar ,  Anthony M. Pasqualoni ,  Jeffrey S. Braden ,  Paul R. Hoffman

Inventor： Derek E. Tyler ,  Deepak Mahulikar ,  Anthony M. Pasqualoni ,  Jeffrey S. Braden ,  Paul R. Hoffman

IPC: H01L23/28 ,  H01L23/02 ,  H01L23/057 ,  H01L23/10 ,  H01L23/24 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L24/32 ,  H01L23/057 ,  H01L23/10 ,  H01L23/24 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15747 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181

Abstract: There is provided an electronic package where the package components define a cavity. A semiconductor device and a portion of a leadframe occupy part of the cavity. Substantially the remainder of the cavity is filled with a compliant polymer, such as a silicone gel. Since the cavity is no longer susceptible to gross leak failure, the seal width of adhesives used to assemble the package may be reduced, thereby increasing the area available for mounting the semiconductor device.

Abstract translation: 提供了一种电子封装，其中封装元件限定一个空腔。 半导体器件和引线框架的一部分占据腔的一部分。 基本上，空腔的其余部分填充有柔性聚合物，例如硅凝胶。 由于空腔不再容易发生严重的泄漏故障，所以可以减少用于组装封装的粘合剂的密封宽度，从而增加可用于安装半导体器件的面积。

公开(公告)号：US5320689A

公开(公告)日：1994-06-14

申请号：US24057

申请日：1993-03-01

Applicant: Deepak Mahulikar ,  Brian Mravic

Inventor： Deepak Mahulikar ,  Brian Mravic

IPC: C23C8/80 ,  C23C14/48 ,  C22C9/00

CPC classification number: C23C8/80 ,  C23C14/48 ,  Y10T428/12493 ,  Y10T428/12576 ,  Y10T428/12903

Abstract: There is provided a composite copper alloy having a copper alloy core and a modified surface layer containing a nitride or carbide film. Alternatively, the modified surface layer may contain a carbo-nitride film. The alloy is formed by reacting a copper alloy with nitrogen, carbon or a nitrogen/carbon mixture at elevated temperatures. The resultant surface layer improves the tribological and mechanical properties of the alloy while maintaining useful electrical conductivity.

Abstract translation: 提供了具有铜合金芯和含有氮化物或碳化物膜的改性表面层的复合铜合金。 或者，改性表面层可以含有氮化碳膜。 该合金通过在高温下使铜合金与氮，碳或氮/碳混合物反应而形成。 所得的表面层改善了合金的摩擦学和机械性能，同时保持有用的导电性。

公开(公告)号：US5213638A

公开(公告)日：1993-05-25

申请号：US828329

申请日：1992-01-30

Applicant: Deepak Mahulikar ,  Brian Mravic

Inventor： Deepak Mahulikar ,  Brian Mravic

IPC: C23C8/80 ,  C23C14/48

CPC classification number: C23C14/48 ,  C23C8/80 ,  Y10T428/12882

Abstract: There is provided a composite copper alloy having a copper alloy core and a modified surface layer containing a nitride or carbide film. Alternatively, the modified surface layer may contain a carbo-nitride film. The alloy is formed by reacting a copper alloy with nitrogen, carbon or a nitrogen/carbon mixture at elevated temperatures. The resultant surface layer improves the tribological and mechanical properties of the alloy while maintaining useful electrical conductivity.

Abstract translation: 提供了具有铜合金芯和含有氮化物或碳化物膜的改性表面层的复合铜合金。 或者，改性表面层可以含有氮化碳膜。 该合金通过在高温下使铜合金与氮，碳或氮/碳混合物反应而形成。 所得的表面层改善了合金的摩擦学和机械性能，同时保持有用的导电性。