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    TRANSFER SUPPORT AND TRANSFER MODULE
    42.
    发明申请
    TRANSFER SUPPORT AND TRANSFER MODULE 审中-公开

    公开(公告)号：US20190019718A1

    公开(公告)日：2019-01-17

    申请号：US16026080

    申请日：2018-07-03

    Applicant: Industrial Technology Research Institute

    Inventor： Ming-Hsien Wu ,  Yih-Der Guo ,  Yen-Hsiang Fang ,  Yao-Jun Tsai ,  Yi-Chen Lin

    IPC: H01L21/683 ,  H01L21/67

    Abstract: A transfer support adapted to contact a plurality of elements is provided. The transfer support has a first surface, a second surface opposite to the first surface, a recess located on the second surface, a plurality of platforms protruded from the first surface, a plurality of supporting pillars distributed in the recess and a plurality of through holes. The platforms have carry surfaces adapted to contact the plurality of elements. The through holes extend from the carry surfaces of the platforms to the recess, and two of the adjacent supporting pillars are spaced apart from each other to form an air passage. In addition, a transfer module is also provided.

    Light emitting device and driving method thereof
    45.
    发明授权
    Light emitting device and driving method thereof 有权

    公开(公告)号：US09692509B2

    公开(公告)日：2017-06-27

    申请号：US14975864

    申请日：2015-12-21

    Applicant: Industrial Technology Research Institute

    Inventor： Chia-Hsin Chao ,  Yen-Hsiang Fang ,  Ming-Hsien Wu

    IPC: H04B10/116 ,  H05B33/08

    CPC classification number: H04B10/116 ,  H05B33/0845

    Abstract: A driving method of a light emitting device including visible light emitting elements is provided. In a first visible light communication mode, a first portion of the visible light emitting elements is driven and a second portion of the visible light emitting elements is idled for the first portion of the visible light emitting elements having a first current density. In a second visible light communication mode, each of the visible light emitting elements is driven so as to have a second current density. An illumination brightness difference of the light emitting device between the first visible light communication mode and the second visible light communication mode is smaller than 15%.

    DISPLAY PANEL
    48.
    发明申请
    DISPLAY PANEL 有权
    显示面板

    公开(公告)号：US20150108508A1

    公开(公告)日：2015-04-23

    申请号：US14586847

    申请日：2014-12-30

    Applicant: Industrial Technology Research Institute

    Inventor： Ming-Hsien Wu ,  Chia-Hsin Chao ,  Yen-Hsiang Fang ,  Yi-Chen Lin ,  Ying-Chien Chu ,  Mu-Tao Chu

    IPC: H01L31/173

    CPC classification number: H01L31/173 ,  G02F1/157 ,  G02F2001/13324 ,  G02F2201/44 ,  H01L27/3209 ,  H01L27/3211 ,  H01L27/322 ,  H01L27/3227 ,  H01L27/3232 ,  H01L27/3246 ,  H01L27/3272 ,  H01L27/3283 ,  H01L51/5284 ,  H01L2251/5323

    Abstract: A display panel comprising a substrate, a meshed shielding pattern, a plurality of light-emitting devices and a solar cell is provided. The substrate has a first surface and a second surface opposite to the first surface, the substrate comprises a first circuit layer disposed over the first surface and a second circuit layer disposed over the second surface. The meshed shielding pattern is disposed on first surface of the substrate to define a plurality of pixel regions over the substrate. The light-emitting devices are disposed on the first surface of the substrate and electrically connected to the first circuit layer, and at least one of the light-emitting devices is disposed in one of the pixel regions. The solar cell is disposed on the second surface of the substrate and electrically connected to the second circuit layer.

    Abstract translation: 提供了包括基板，网状屏蔽图案，多个发光装置和太阳能电池的显示面板。 衬底具有与第一表面相对的第一表面和第二表面，衬底包括设置在第一表面上的第一电路层和设置在第二表面上的第二电路层。 网状屏蔽图案设置在基板的第一表面上以在基板上限定多个像素区域。 发光装置设置在基板的第一表面上并电连接到第一电路层，并且至少一个发光装置设置在一个像素区域中。 太阳能电池设置在基板的第二表面上并电连接到第二电路层。

    NITRIDE SEMICONDUCTOR DEVICE
    49.
    发明申请
    NITRIDE SEMICONDUCTOR DEVICE 审中-公开
    氮化物半导体器件

    公开(公告)号：US20140097442A1

    公开(公告)日：2014-04-10

    申请号：US13647389

    申请日：2012-10-09

    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

    Inventor： Yen-Hsiang Fang ,  Chen-Zi Liao ,  Rong Xuan ,  Chien-Pin Lu ,  Yi-Keng Fu ,  Chih-Wei Hu ,  Hsun-Chih Liu

    IPC: H01L33/32

    CPC classification number: H01L33/12 ,  H01L33/025 ,  H01L33/32

    Abstract: A nitride semiconductor device includes a silicon substrate, a nucleation layer, a first buffer layer, a first type nitride semiconductor layer, a light-emitting layer and a second type nitride semiconductor layer is provided. The nucleation layer is disposed on the silicon substrate. The first buffer layer is disposed on the nucleation layer. The first buffer layer includes a dopant and Gallium, and an atomic radius of the dopant is larger than an atomic radius of Gallium. The first type nitride semiconductor layer is disposed over the first buffer layer. The light-emitting layer is disposed on the first type nitride semiconductor layer. The second type nitride semiconductor layer is disposed on the light-emitting layer.

    Abstract translation: 氮化物半导体器件包括硅衬底，成核层，第一缓冲层，第一氮化物半导体层，发光层和第二氮化物半导体层。 成核层设置在硅衬底上。 第一缓冲层设置在成核层上。 第一缓冲层包括掺杂剂和镓，并且掺杂剂的原子半径大于镓的原子半径。 第一种氮化物半导体层设置在第一缓冲层上。 发光层设置在第一氮化物半导体层上。 第二种氮化物半导体层设置在发光层上。

    Spliced display
    50.
    发明授权
    Spliced display 有权

    公开(公告)号：US11810484B2

    公开(公告)日：2023-11-07

    申请号：US17483812

    申请日：2021-09-24

    Applicant: Industrial Technology Research Institute

    Inventor： Chia-Hsin Chao ,  Ming-Hsien Wu ,  Yen-Hsiang Fang ,  Po-Hsun Wang ,  Li-Chun Huang

    IPC: G09F9/302 ,  G09G3/32 ,  H01L27/15 ,  H01L27/142 ,  H01L33/62

    CPC classification number: G09F9/3026 ,  G09G3/32 ,  H01L27/142 ,  H01L27/156 ,  H01L33/62 ,  G09G2300/026

    Abstract: A spliced display including a transparent substrate, a plurality of micro (light-emitting diodes) LEDs, and a plurality of light sensors is provided. The transparent substrate has a display surface and a back surface opposite to each other. The driving backplanes are disposed on the back surface of the transparent substrate to be spliced with each other. The micro LEDs are disposed on the driving backplanes respectively and located between the micro LEDs and the transparent substrate. Each of the driving backplanes is corresponding to parts of the micro LEDs. The light sensors are disposed on the transparent substrate and located between the driving backplanes and the transparent substrate. Each of the light sensors is adjacent to at least two of the micro LEDs, and at least one of the at least two of the micro LEDs is adjacent to two of the light sensor.

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