公开(公告)号：US6018191A

公开(公告)日：2000-01-25

申请号：US35104

申请日：1998-03-05

Applicant: Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsurou Matsumoto

Inventor： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsurou Matsumoto

IPC: H01L21/52 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L29/06 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H01L23/52

CPC classification number: H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/49 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

公开(公告)号：US5793099A

公开(公告)日：1998-08-11

申请号：US646031

申请日：1996-05-07

Applicant: Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsurou Matsumoto

Inventor： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsurou Matsumoto

IPC: H01L21/52 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L29/06 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/49 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

公开(公告)号：US5068712A

公开(公告)日：1991-11-26

申请号：US409332

申请日：1989-09-19

Applicant: Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

Inventor： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/31 ,  H01L23/495 ,  H01L25/10 ,  H01L29/06 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L24/32 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/05 ,  H01L24/06 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/73215 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421 ,  Y10T29/49121

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract translation: 由于半导体芯片尺寸大，高集成度和加速度，所以难以将半导体芯片与包装中的引线组合在一起。 鉴于这种困难，已经采用称为半导体和引线堆叠和封装的称为“片上引线”或“引线芯片”结构的封装结构。 在该结构的封装中，根据本发明，内引线和半导体芯片的前端部之间的间隙比除引导端部和半导体芯片之外的内引线部分之间的间隙宽，从而减小 杂散容量，提高信号传输速率和减少电气噪声。

公开(公告)号：US4496658A

公开(公告)日：1985-01-29

申请号：US311327

申请日：1981-10-14

Applicant: Koichi Kondo ,  Susumu Iwasa ,  Isamu Yoshida

Inventor： Koichi Kondo ,  Susumu Iwasa ,  Isamu Yoshida

IPC: C07K14/59 ,  C07K16/26 ,  C12N9/96 ,  G01N33/531 ,  G01N33/535 ,  G01N33/543 ,  G01N33/76 ,  G01N33/54 ,  G01N33/56 ,  G01N33/58

CPC classification number: C07K14/59 ,  C07K16/26 ,  C12N9/96 ,  G01N33/531 ,  G01N33/535 ,  G01N33/54306 ,  G01N33/76 ,  Y10S435/975 ,  Y10S436/80 ,  Y10S436/804 ,  Y10S436/808 ,  Y10S436/813 ,  Y10S436/814 ,  Y10S436/819 ,  Y10S930/11 ,  Y10S930/28

Abstract: In a method for immunochemical assay of human chorionic gonadotropin involving use of an antibody immobilized on a carrier, an antigen and an antibody to which a labeling agent has been attached, when the antibody supported on the carrier and the antibody coupled to a labeling agent are different antibodies which are not overlapping in antigen-determining site and one of said different antibodies is specifically reactive to human chorionic gonadotropin, a high reproducibility of the result of the immunochemical assay is obtained.

Abstract translation: 在涉及使用固定在载体上的抗体，附着有标记试剂的抗原和抗体的人绒毛膜促性腺激素的免疫化学测定方法中，当载体上载有抗体和与标记试剂偶联的抗体时， 在抗原决定部位和所述不同抗体之一中不重叠的不同抗体与人绒毛膜促性腺激素特异性反应，获得了免疫化学测定结果的高再现性。

公开(公告)号：US07215886B2

公开(公告)日：2007-05-08

申请号：US10222163

申请日：2002-08-15

Applicant: Shigenobu Maruyama ,  Kazumi Kawamoto ,  Hiroaki Furuichi ,  Tooru Yoshida ,  Isamu Yoshida ,  Katsuya Oono ,  Osamu Yamada ,  Hiroshi Ibe ,  Shigeru Tokita ,  Tarou Tonoduka ,  Yasunori Iwafuji ,  Katsumi Kuroguchi

Inventor： Shigenobu Maruyama ,  Kazumi Kawamoto ,  Hiroaki Furuichi ,  Tooru Yoshida ,  Isamu Yoshida ,  Katsuya Oono ,  Osamu Yamada ,  Hiroshi Ibe ,  Shigeru Tokita ,  Tarou Tonoduka ,  Yasunori Iwafuji ,  Katsumi Kuroguchi

IPC: H04B10/00 ,  G02B6/36 ,  H01L33/00

CPC classification number: H01S5/02212 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/024 ,  H01S5/0427 ,  H01S5/0683 ,  H01L2924/00 ,  H01L2924/01033

Abstract: The present invention is related to an optical communication module for transmitting high frequency signals (e.g., 10 Gbit/s and higher data rates) between an optical element and an external circuit. In an illustrative embodiment, the optical communication module includes signal transmission lines and ground lines formed on a ceramic substrate, a flexible wiring board, and a printed circuit board. The widths of the signal lines and the ground lines vary, as well as the spacing between the signal and ground lines. This facilitates characteristic impedance matching among the signal lines to within about 50Ω.

Abstract translation: 本发明涉及一种用于在光学元件和外部电路之间传输高频信号（例如，10Gbit / s和更高数据速率）的光通信模块。 在说明性实施例中，光通信模块包括形成在陶瓷基板，柔性布线板和印刷电路板上的信号传输线和接地线。 信号线和接地线的宽度以及信号和接地线之间的间距变化。 这有助于信号线之间的特征阻抗匹配在约50mega以内。

公开(公告)号：US20060068609A1

公开(公告)日：2006-03-30

申请号：US11183972

申请日：2005-07-19

Applicant: Takehide Yokozuka ,  Masahide Harada ,  Shiro Yamashita ,  Isamu Yoshida ,  Masahiko Asano ,  Koji Sato ,  Shuji Eguchi ,  Kaoru Uchiyama

Inventor： Takehide Yokozuka ,  Masahide Harada ,  Shiro Yamashita ,  Isamu Yoshida ,  Masahiko Asano ,  Koji Sato ,  Shuji Eguchi ,  Kaoru Uchiyama

IPC: H05K1/00

CPC classification number: H05K5/069 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0313 ,  H05K3/3447 ,  H05K5/0069 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/10977 ,  H05K2201/2009 ,  Y10S439/935 ,  H01L2924/00

Abstract: An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150° C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.

Abstract translation: 一种电子设备包括具有通孔并使用玻璃化转变温度超过150℃的树脂作为基底的电路板，具有开口的金属外壳和安装在所述开口的连接器 金属壳体，其中连接器的销插入通孔中，销和通孔与导电构件连接，并且还在导电构件上设置用于固定连接器和板的加强构件，从而改善 电子设备的可靠性。

公开(公告)号：US07004860B2

公开(公告)日：2006-02-28

申请号：US10156940

申请日：2002-05-30

Applicant: Isamu Yoshida ,  Kiyotake Shibata ,  Masahiro Nobutomo ,  Morihisa Yoshioka

Inventor： Isamu Yoshida ,  Kiyotake Shibata ,  Masahiro Nobutomo ,  Morihisa Yoshioka

IPC: F16H9/04

CPC classification number: F16H25/2214 ,  F16H55/56 ,  F16H63/067

Abstract: A belt type infinite variable-speed drive using a ball-screw mechanism is compact and noise-free. A nut of the ball-screw mechanism is fixed to a casing and a threaded shaft is rotatably coupled to a movable pulley member through a ball bearing so that ball circulating portions on the nut will not rotate while the movable pulley member is movable axially. Also, the ball circulating portions, which are low in load bearing capacity, are oriented in such a direction that a load hardly acts on the ball-screw mechanism. This makes it possible to compactly and rationally design a belt type infinite variable-speed drive and to suppress noise due to vibration of balls in the ball circulating portions.

Abstract translation: 带式无级变速驱动采用滚珠丝杠机构，结构紧凑，无噪音。 滚珠丝杠机构的螺母固定在壳体上，螺纹轴通过滚珠轴承可旋转地连接到可动皮带轮部件上，使可动皮带轮部件轴向移动时，螺母上的球形循环部分不会转动。 此外，承载能力低的滚珠循环部分在负载几乎不作用于滚珠丝杠机构的方向上定向。 这使得可以紧凑且合理地设计带式无限变速驱动器并且抑制由于球循环部分中的球的振动引起的噪声。

公开(公告)号：US06736235B2

公开(公告)日：2004-05-18

申请号：US09989458

申请日：2001-11-21

Applicant: Isamu Yoshida ,  Kiyotake Shibata ,  Yoshinori Ikeda

Inventor： Isamu Yoshida ,  Kiyotake Shibata ,  Yoshinori Ikeda

IPC: F16H2522

CPC classification number: B62D5/0448 ,  B62D5/0427 ,  F16D1/0858 ,  F16H25/2219 ,  F16H25/2223 ,  F16H25/24 ,  F16H2025/2445 ,  Y10T74/19753 ,  Y10T74/19772

Abstract: A portion of a steering shaft 2 capable of being advanced and retracted defines a ball screw shaft 2a of a ball screw mechanism 13. A motor rotor 10 of an electrically driven motor 8 for providing a steering assist force is externally mounted on a rotary nut 14. Mounting of the motor rotor 10 onto the rotary nut 14 is carried out so that the both can be adjustably aligned. By way of example, the rotary nut 14 has an outer peripheral surface formed with an annular protrusion 33 of a arcuate longitudinal sectional shape, having a surface thereof formed with a plurality of axially extending surface indentations 33a arranged side by side in a direction circumferentially of the rotary nut 14.

Abstract translation: 能够进退的转向轴2的一部分限定了滚珠丝杠机构13的滚珠丝杠轴2a。用于提供转向辅助力的电动马达8的马达转子10外部安装在旋转螺母14上 将电动机转子10安装在旋转螺母14上，使得两者可以可调整地对准。 作为示例，旋转螺母14具有形成有弓形纵向截面形状的环形突起33的外周面，其表面形成有沿着圆周方向并排布置的多个轴向延伸的表面凹口33a 旋转螺母14。

公开(公告)号：US06454042B1

公开(公告)日：2002-09-24

申请号：US09704678

申请日：2000-11-03

Applicant: Isamu Yoshida ,  Yoshinori Ikeda

Inventor： Isamu Yoshida ,  Yoshinori Ikeda

IPC: B62D504

CPC classification number: B62D5/0448 ,  F16H25/2223 ,  F16H2025/2242 ,  Y10T74/19753

Abstract: A ball screw (20) includes a bridge member (24) fitted to a rotary nut (22) and provided with a plurality of connecting grooves (28). Each connecting groove (28) connects neighboring convolutions of an inner spiral groove (26) of the rotary nut (22). The ball screw (20) is used as a mechanism for transmitting rotation of a rotor (10) of a motor (8) to a steering shaft (2)in an electrically powered steering device.

Abstract translation: 滚珠丝杠（20）包括安装在旋转螺母（22）上并具有多个连接凹槽（28）的桥接件（24）。 每个连接槽（28）连接旋转螺母（22）的内螺旋槽（26）的相邻卷圈。 滚珠丝杠（20）用作在电动转向装置中将马达（8）的转子（10）的旋转传递到转向轴（2）的机构。

公开(公告)号：US06303982B2

公开(公告)日：2001-10-16

申请号：US09771617

申请日：2001-01-30

Applicant: Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

Inventor： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

IPC: H01L23495

CPC classification number: H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/0695 ,  H01L2224/85399

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.