公开(公告)号：US20080204244A1

公开(公告)日：2008-08-28

申请号：US12022933

申请日：2008-01-30

申请人： Curtis Lee Carrender ,  Mark A. Hadley

发明人： Curtis Lee Carrender ,  Mark A. Hadley

IPC分类号： G08B13/14

CPC分类号： G01R31/2822 ,  G01R31/31905 ,  G01R31/31926 ,  G06K7/0095 ,  H01L2924/15153

摘要： A method and apparatus for testing RFID straps. Arrays of RFID straps in a roll-to-roll process are coupled to an array of test elements. RF programming and interrogation signals are frequency and time multiplexed to the RFID array. Return signals are detected to determine sensitivity and programmability parameters of the RFID straps.

公开(公告)号：US20080117051A1

公开(公告)日：2008-05-22

申请号：US11929632

申请日：2007-10-30

申请人： Curtis Lee Carrender ,  Mark A. Hadley

发明人： Curtis Lee Carrender ,  Mark A. Hadley

IPC分类号： G06K7/00 ,  G08B13/14

CPC分类号： G01R31/2822 ,  G01R31/31905 ,  G01R31/31926 ,  G06K7/0095 ,  H01L2924/15153

摘要： A method and apparatus for testing RFID straps. Arrays of RFID straps in a roll-to-roll process are coupled to an array of test elements. RF programming and interrogation signals are frequency and time multiplexed to the RFID array. Return signals are detected to determine sensitivity and programmability parameters of the RFID straps.

摘要翻译： 一种用于测试RFID绑带的方法和装置。 卷对卷过程中的RFID带的阵列耦合到测试元件的阵列。 RF编程和询问信号被频率和时间复用到RFID阵列。 检测返回信号以确定RFID带的灵敏度和可编程性参数。

公开(公告)号：US07301458B2

公开(公告)日：2007-11-27

申请号：US11127697

申请日：2005-05-11

申请人： Curtis Lee Carrender ,  Mark A. Hadley

发明人： Curtis Lee Carrender ,  Mark A. Hadley

IPC分类号： G08B13/14 ,  G06K7/00

CPC分类号： G01R31/2822 ,  G01R31/31905 ,  G01R31/31926 ,  G06K7/0095 ,  H01L2924/15153

摘要： A method and apparatus for testing RFID straps. Arrays of RFID straps in a roll-to-roll process are coupled to an array of test elements. RF programming and interrogation signals are frequency and time multiplexed to the RFID array. Return signals are detected to determine sensitivity and programmability parameters of the RFID straps.

摘要翻译： 一种用于测试RFID绑带的方法和装置。 卷对卷过程中的RFID带的阵列耦合到测试元件的阵列。 RF编程和询问信号被频率和时间复用到RFID阵列。 检测返回信号以确定RFID带的灵敏度和可编程性参数。

公开(公告)号：US08534075B2

公开(公告)日：2013-09-17

申请号：US13118824

申请日：2011-05-31

申请人： Willy S. Ziminsky ,  Gilbert O. Kraemer ,  Girard A. Simons ,  Mark A. Hadley

发明人： Willy S. Ziminsky ,  Gilbert O. Kraemer ,  Girard A. Simons ,  Mark A. Hadley

IPC分类号： F02C1/00

CPC分类号： F23R3/40 ,  F02C3/20 ,  F02C3/22 ,  F02C9/40

摘要： A method of regulating the Wobbe number of a multi-composition gas fuel supplied to one or more combustors of a gas turbine includes: (a) providing a control system for regulating fuel and air flow to the one or more combustors; and (b) reforming a fraction of the gas fuel upstream of the one or more combustors to form hydrogen and carbon monoxide to be supplied to the one or more combustors with a remaining fraction of the fuel; wherein the fraction of fuel reformed is adjusted to maintain the Wobbe number of the fuel supplied to the one or more combustors within a predetermined range.

摘要翻译： 一种调节供应给燃气轮机的一个或多个燃烧器的多组分气体燃料的沃泊数的方法包括：（a）提供用于调节燃料和空气流向一个或多个燃烧器的控制系统; 和（b）在所述一个或多个燃烧器的上游重整所述气体燃料的一部分，以形成供给所述一个或多个燃烧器的剩余部分燃料的氢和一氧化碳; 其中，重整燃料的燃料馏分被调节以将供给一个或多个燃烧器的燃料的沃泊数保持在预定范围内。

公开(公告)号：US08350703B2

公开(公告)日：2013-01-08

申请号：US12987995

申请日：2011-01-10

申请人： Glenn W. Gengel ,  Mark A. Hadley ,  Torn Pounds ,  Kenneth D. Schatz ,  Paul S. Drzaic

发明人： Glenn W. Gengel ,  Mark A. Hadley ,  Torn Pounds ,  Kenneth D. Schatz ,  Paul S. Drzaic

IPC分类号： G08B13/14

CPC分类号： G06K19/07749 ,  D10B2401/18 ,  G06K19/027 ,  G06K19/07722 ,  G06K19/07758 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3011 ,  Y10T29/49018 ,  Y10T29/49155 ,  H01L2924/00

摘要： A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.

公开(公告)号：US07980082B2

公开(公告)日：2011-07-19

申请号：US11882376

申请日：2007-08-01

申请人： Willy S. Ziminsky ,  Gilbert O. Kraemer ,  Girard A. Simons ,  Mark A. Hadley

发明人： Willy S. Ziminsky ,  Gilbert O. Kraemer ,  Girard A. Simons ,  Mark A. Hadley

IPC分类号： F02C6/18

CPC分类号： F23R3/40 ,  F02C3/20 ,  F02C3/22 ,  F02C9/40

摘要： A method of regulating the Wobbe number of a multi-composition gas fuel supplied to one or more combustors of a gas turbine comprising: (a) providing a control system for regulating fuel and air flow to the one or more combustors; and (b) reforming a fraction of the gas fuel upstream of the one or more combustors to form hydrogen and carbon monoxide to be supplied to the one or more combustors with a remaining fraction of the fuel; wherein the fraction of fuel reformed is adjusted to maintain the Wobbe number of the fuel supplied to the one or more combustors within a predetermined range.

摘要翻译： 一种调节供应给燃气轮机的一个或多个燃烧器的多组分气体燃料的沃泊数的方法，包括：（a）提供用于调节燃料和空气流向所述一个或多个燃烧器的控制系统; 和（b）在所述一个或多个燃烧器的上游重整所述气体燃料的一部分，以形成供给所述一个或多个燃烧器的剩余部分燃料的氢和一氧化碳; 其中，重整燃料的燃料馏分被调节以将供给一个或多个燃烧器的燃料的沃泊数保持在预定范围内。

公开(公告)号：US20100075463A1

公开(公告)日：2010-03-25

申请号：US11810937

申请日：2007-06-06

申请人： John Stephen Smith ,  Hsi-Jen J. Yeh ,  Mark A. Hadley ,  Ashish K. Verma

发明人： John Stephen Smith ,  Hsi-Jen J. Yeh ,  Mark A. Hadley ,  Ashish K. Verma

IPC分类号： H01L21/50

CPC分类号： H01L24/95 ,  G02F1/136 ,  G02F1/1362 ,  G02F1/1368 ,  H01L21/02002 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/147 ,  H01L24/24 ,  H01L24/26 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68359 ,  H01L2224/24227 ,  H01L2224/83136 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/30105 ,  H01L2924/30107 ,  Y10S438/978 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method and apparatus for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks self-align into recessed regions located on a substrate such that the microstructure becomes integral with the substrate. The improved method includes a step of transferring the shaped blocks into a fluid to create a slurry. Such slurry is then dispensed evenly or circulated over the top surface of a substrate having recessed regions thereon. The microstructure via the shape and fluid tumbles onto the surface of the substrate, self-aligns, and engages into a recessed region.

公开(公告)号：US07551141B1

公开(公告)日：2009-06-23

申请号：US11269305

申请日：2005-11-07

申请人： Mark A. Hadley ,  Curt L. Carrender ,  John Stephen Smith

发明人： Mark A. Hadley ,  Curt L. Carrender ,  John Stephen Smith

IPC分类号： H01Q1/38 ,  H01Q1/40

CPC分类号： H01L24/95 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07756 ,  G06K19/07786 ,  H01L21/56 ,  H01L23/48 ,  H01L24/19 ,  H01L24/24 ,  H01L24/83 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83136 ,  H01L2224/83851 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01Q1/2225 ,  H01Q7/00 ,  H01Q9/28 ,  H01Q23/00 ,  H01L2224/82 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic assembly with integrated circuit capacitively coupled to antenna. The electronic assembly includes a strap assembly and an antenna assembly. The antenna assembly includes a first substrate and antenna elements. The strap assembly includes a second substrate and an integrated circuit embedded within the second substrate and substantially flush with a surface of the second substrate. Interconnections are formed to the integrated circuit. The interconnections are formed on the surface of the second substrate. The antenna assembly and the strap assembly are affixed to one another with the surface of the second substrate facing the antenna elements. The antenna elements capacitively couples to the integrated circuit through the interconnections with no direct contact. A non-conductive layer is disposed between the antenna elements and the interconnections providing the capacitive coupling.

摘要翻译： 具有电容耦合到天线的集成电路的电子组件。 电子组件包括带组件和天线组件。 天线组件包括第一基板和天线元件。 带组件包括第二基板和嵌入在第二基板内的基本上与第二基板的表面齐平的集成电路。 与集成电路形成互连。 互连形成在第二基板的表面上。 天线组件和带组件彼此固定，第二衬底的表面面向天线元件。 天线元件通过互连而电容耦合到集成电路，而不直接接触。 在天线元件和提供电容耦合的互连之间设置非导电层。

公开(公告)号：US07542301B1

公开(公告)日：2009-06-02

申请号：US11159574

申请日：2005-06-22

申请人： Lily Liong ,  Kenneth D. Schatz ,  Gordon Craig ,  Mark A. Hadley ,  Eric Kanemoto

发明人： Lily Liong ,  Kenneth D. Schatz ,  Gordon Craig ,  Mark A. Hadley ,  Eric Kanemoto

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/24 ,  H01L24/95 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24101 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K3/0014 ,  H05K3/321 ,  H05K3/368 ,  H05K2201/09036 ,  H05K2201/0949 ,  H05K2201/09827 ,  H05K2201/10674 ,  H05K2201/10727 ,  H05K2203/0108 ,  H05K2203/0143 ,  H05K2203/1545 ,  H01L2224/82 ,  H01L2924/00

摘要： An embossing die, the die comprises one or more protruding features configured to create one or more corresponding recessed regions in a substrate; and a left side edge and a right side edge. Either the left side edge or the right side edge is a gradually sloping edge. The embossing die can be used to form an assembly. The assembly comprises a substrate including a more than one defined frames. Each of the defined frames comprises a plurality of recessed regions and a plurality of functional blocks, each functional block being deposited in one of the recessed regions. Each of the defined frames is separated from another frame by a region. The region can be a flattened region, a sloped region, or a plateau shaped region having a plateau top and two sloped sides, wherein each sloped side forms about 10-15 degree angle to a surface of the substrate.

摘要翻译： 压模包括一个或多个突出特征，其被配置为在基底中产生一个或多个相应的凹陷区域; 以及左侧边缘和右侧边缘。 左侧边缘或右侧边缘都是逐渐倾斜的边缘。 压花模具可用于形成组件。 组件包括包括多于一个定义的框架的基板。 每个定义的框架包括多个凹陷区域和多个功能块，每个功能块被沉积在一个凹进区域中。 每个定义的帧与另一个帧分开一个区域。 该区域可以是具有平台顶部和两个倾斜侧面的扁平区域，倾斜区域或平台形区域，其中每个倾斜侧面与基底的表面形成约10-15度的角度。

公开(公告)号：US20080156445A1

公开(公告)日：2008-07-03

申请号：US11820603

申请日：2007-06-19

申请人： Gordon S.W. Craig ,  Kenneth D. Schatz ,  Mark A. Hadley ,  Paul S. Drzaic

发明人： Gordon S.W. Craig ,  Kenneth D. Schatz ,  Mark A. Hadley ,  Paul S. Drzaic

IPC分类号： B32B37/00

CPC分类号： G06K19/07718 ,  G06K19/07745 ,  H01L21/673 ,  H01L21/6835 ,  H01L23/49855 ,  H01L23/544 ,  H01L24/19 ,  H01L24/76 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2223/54473 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/7665 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/95085 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K3/303 ,  H05K2201/10636 ,  H05K2203/0173 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T156/17 ,  Y10T156/171 ,  Y10T156/1744 ,  Y10T156/1798 ,  H01L2924/00

摘要： A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.

摘要翻译： 一种组装装置的方法。 该方法包括将功能元件放置在形成于模板衬底中的第一开口中，并将功能元件转移到具有形成在其中的第二开口的器件衬底，其中功能元件保持在第二开口内并抵靠与该器件相连的粘合膜 基质。