公开(公告)号：US06653285B1

公开(公告)日：2003-11-25

申请号：US09532709

申请日：2000-03-22

申请人： Akira Takashima ,  Mark E. Mummert ,  Mansour Mohamadzadeh

发明人： Akira Takashima ,  Mark E. Mummert ,  Mansour Mohamadzadeh

IPC分类号： A61K3800

CPC分类号： A61K38/10 ,  A61K38/08

摘要： The present invention provides peptides with a specific affinity for glycosaminoglycan molecules. These peptides may have any number of functions, including but not limited to use as inhibitors of glycosaminoglycan-mediated processes, enhancers of glycosaminoglycan-mediated processes, and as molecular probes to identify the presence of a specific glycosaminoglycan. Peptides of the invention may be directed against any glycosaminoglycan, including hyaluronic acid, chondroitin sulfate A, chondroitin sulfate C, dermatan sulfate, heparin, keratan sulfate, keratosulfate, chitin, chitosan 1, and chitosan 2. These isolated peptides may have therapeutic uses in the treatment or prevention of diseases involving infection, inflammatory diseases, cancer, infections, etc. The peptides may also have other biological functions such as contraception.

摘要翻译： 本发明提供对糖胺聚糖分子具有特异亲和性的肽。 这些肽可以具有任何数量的功能，包括但不限于用作糖胺聚糖介导的过程的抑制剂，糖胺聚糖介导的过程的增强剂，以及用于鉴定特定的糖胺聚糖的存在的分子探针。 本发明的肽可以针对任何糖胺聚糖，包括透明质酸，硫酸软骨素A，硫酸软骨素C，硫酸皮肤素，肝素，硫酸角质素，角硫酸盐，壳多糖，壳聚糖1和壳聚糖2.这些分离的肽可以具有治疗用途 治疗或预防涉及感染，炎性疾病，癌症，感染等的疾病。肽还可具有其他生物学功能，例如避孕。

公开(公告)号：US06528348B2

公开(公告)日：2003-03-04

申请号：US10076580

申请日：2002-02-19

申请人： Fumihiko Ando ,  Akira Takashima ,  Hiroshi Onodera ,  Eiji Yoshida ,  Kazuo Teshirogi

发明人： Fumihiko Ando ,  Akira Takashima ,  Hiroshi Onodera ,  Eiji Yoshida ,  Kazuo Teshirogi

IPC分类号： H01L2940

CPC分类号： H01L25/50 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06593 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A plurality of semiconductor devices can be mounted on a mounting board in a three-dimensional structure by stacking one on another with a simple structure. A semiconductor element is mounted on a first surface of an interposer. Electrode pads connected to the semiconductor element are arranged around the semiconductor element on the first surface of the interposer. Protruding electrodes are provided on the respective electrode pads. Through holes are formed in the interposer so as to extend from a second surface opposite to the first surface of the redistribution substrate to the respective electrode pads. The semiconductor element is encapsulated by a seal resin. Each of the protruding electrodes is higher than the sealed portion of the semiconductor element.

公开(公告)号：US06489676B2

公开(公告)日：2002-12-03

申请号：US09843912

申请日：2001-04-30

申请人： Fumihiko Taniguchi ,  Akira Takashima

发明人： Fumihiko Taniguchi ,  Akira Takashima

IPC分类号： H01L2304

CPC分类号： H01L23/585 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2225/06551 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2225/1011 ,  H01L2225/1052 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/43

摘要： A semiconductor device comprises: a semiconductor element; an external terminal used for an external connection; an interposer having the semiconductor element mounted on a first surface thereof and having the external terminal formed on a second surface thereof opposite to the first surface so as to electrically connect the semiconductor element and the external terminal; a resin sealing the semiconductor element on the first surface; and an interconnecting portion formed within the resin, the interconnecting portion having a first connecting part electrically connected to the external terminal and having a second connecting part exposed on an outer surface of the resin.

摘要翻译： 半导体器件包括：半导体元件; 用于外部连接的外部终端; 具有安装在其第一表面上的半导体元件并且具有形成在与第一表面相对的第二表面上的外部端子以便电连接半导体元件和外部端子的插入器; 将所述半导体元件密封在所述第一表面上的树脂; 以及形成在所述树脂内的互连部分，所述互连部分具有电连接到所述外部端子并且具有暴露在所述树脂的外表面上的第二连接部分的第一连接部分。

公开(公告)号：US5801439A

公开(公告)日：1998-09-01

申请号：US804270

申请日：1997-02-21

申请人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Junichi Kasai ,  Masataka Mizukoshi ,  Kosuke Otokita ,  Hiroshi Yoshimura ,  Katsuhiro Hayashida ,  Akira Takashima ,  Masahiko Ishiguri ,  Michio Sono

发明人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Junichi Kasai ,  Masataka Mizukoshi ,  Kosuke Otokita ,  Hiroshi Yoshimura ,  Katsuhiro Hayashida ,  Akira Takashima ,  Masahiko Ishiguri ,  Michio Sono

IPC分类号： H01L23/28 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H01L23/48 ,  H01L27/10

CPC分类号： H01L23/4951 ,  H01L25/105 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/107 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042

摘要： A semiconductor device includes a semiconductor element, a package sealing the semiconductor element, and leads for passing signals between the semiconductor element and an external device. Each of the leads has an inner-lead part sealed within the package and connected with the semiconductor element, and an outer-lead part which extends outward from the package toward a top of the package, and is to be connected to the external device. The outer-lead part includes a first-port part at a lower side of the package, and a second-port part at an upper side of the package.

摘要翻译： 半导体器件包括半导体元件，密封半导体元件的封装以及用于在半导体元件和外部器件之间传递信号的引线。 每个引线具有密封在封装内并与半导体元件连接的内引线部分，以及从封装向外朝向封装顶部延伸并且连接到外部装置的外引线部分。 外引线部分包括在封装的下侧的第一端口部分和在封装的上侧的第二端口部分。

公开(公告)号：US5476012A

公开(公告)日：1995-12-19

申请号：US216720

申请日：1994-03-23

申请人： Akira Takashima

发明人： Akira Takashima

IPC分类号： F02D41/18 ,  G01F1/68 ,  G01F1/684 ,  G01F5/00 ,  G01F15/00 ,  G01F1/34

CPC分类号： G01F5/00 ,  G01F1/6842 ,  G01F15/00

摘要： An air flow sensor includes a duct forming a part of an intake passage, and a detection device. A swirl generating structure is also arranged in the duct to generate a swirl in the duct. A projection extending upstream from the opening at the upstream end of the duct is further disposed on the swirl generating means. Thus, the air flow rate can be accurately detected without requiring a structural member for the intake system.

摘要翻译： 气流传感器包括形成进气通道的一部分的管道和检测装置。 管道中还布置有涡流产生结构，以在管道中产生涡流。 在管道的上游端的开口的上游延伸的突起还设置在涡流产生装置上。 因此，可以精确地检测空气流量，而不需要用于进气系统的结构构件。

公开(公告)号：USD341535S

公开(公告)日：1993-11-23

申请号：US893351

申请日：1992-06-05

申请人： Akira Takashima

设计人： Akira Takashima

公开(公告)号：US4771855A

公开(公告)日：1988-09-20

申请号：US114164

申请日：1987-10-27

申请人： Akira Takashima ,  Shizuo Shimoie

发明人： Akira Takashima ,  Shizuo Shimoie

IPC分类号： E02F3/32 ,  E02F3/34 ,  E02F3/38 ,  E02F9/08 ,  E02F9/12 ,  E02F9/16 ,  E02F9/20 ,  B60K26/00 ,  B62D1/02

CPC分类号： E02F9/0875 ,  E02F3/325 ,  E02F3/384 ,  E02F9/121 ,  E02F9/16 ,  E02F9/2004

摘要： A backhoe vehicle comprising an engine and a driver's seat disposed rearwardly of an oil passage defining rotary joint of a swivel platform rotatably mounted through bearings on a stationary support of a chassis, a swivel guide gear attached to the stationary support, a swivel pinion meshed with the swivel guide gear, a motor for driving the swivel pinion to rotate the swivel platform, and traveling control valves and backhoe control valves mounted in a control box disposed on the swivel platform forwardly of the rotary joint. The motor is disposed below the traveling control valves and the backhoe control valves. The backhoe vehicle further comprises a driver's deck having a bent configuration with step portions thereof disposed laterally of the rotary joint being at a lower level than a cover portion disposed over the rotary joint.

摘要翻译： 一种反铲车辆，包括发动机和驾驶员座位，所述驾驶员座位设置在通过旋转平台的油通道的后方，所述旋转接头可旋转地安装在底盘的固定支撑件上的轴承上，附接到固定支撑件的旋转引导齿轮，与 旋转导向齿轮，用于驱动旋转小齿轮以旋转旋转平台的马达，以及安装在设置在旋转接头前方的旋转台上的控制箱中的行驶控制阀和反铲控制阀。 电动机设置在行驶控制阀和反铲控制阀的下方。 反铲车辆还包括具有弯曲构造的驾驶员甲板，其中设置在旋转接头侧面的台阶部分处于比设置在旋转接头上的盖部分更低的水平。

公开(公告)号：US08779503B2

公开(公告)日：2014-07-15

申请号：US13424544

申请日：2012-03-20

申请人： Daisuke Matsushita ,  Akira Takashima

发明人： Daisuke Matsushita ,  Akira Takashima

IPC分类号： H01L29/792

CPC分类号： H01L21/28273 ,  H01L21/28282 ,  H01L21/764 ,  H01L27/11521 ,  H01L27/11568

摘要： According to one embodiment, a nonvolatile semiconductor memory includes a semiconductor layer, a first insulating layer on the semiconductor layer, a charge storage layer on the first insulating layer, a second insulating layer on the charge storage layer, and a control gate electrode on the second insulating layer. The second insulating layer comprises a stacked structure provided in order of a first lanthanum aluminate layer, a lanthanum aluminum silicate layer and a second lanthanum aluminate layer from the charge storage layer side to the control gate electrode side.

摘要翻译： 根据一个实施例，非易失性半导体存储器包括半导体层，半导体层上的第一绝缘层，第一绝缘层上的电荷存储层，电荷存储层上的第二绝缘层，以及控制栅电极 第二绝缘层。 第二绝缘层包括按照从电荷存储层侧到控制栅电极侧的第一铝酸镧层，硅酸铝镧层和第二铝酸镧层的顺序提供的叠层结构。

公开(公告)号：US20130234087A1

公开(公告)日：2013-09-12

申请号：US13605917

申请日：2012-09-06

申请人： Takashi Yamauchi ,  Yoshifumi Nishi ,  Jiezhi Chen ,  Akira Takashima ,  Minoru Amano

发明人： Takashi Yamauchi ,  Yoshifumi Nishi ,  Jiezhi Chen ,  Akira Takashima ,  Minoru Amano

IPC分类号： H01L45/00

CPC分类号： H01L45/085 ,  H01L27/2463 ,  H01L45/1233 ,  H01L45/148 ,  H01L45/1675

摘要： A non-volatile resistance change device includes a first electrode made of a metallic element, a second electrode, a variable resistance layer formed between the first electrode and the second electrode, first wiring formed on the first electrode on a side opposite to the variable resistance layer, and second wiring formed on the second electrode on a side opposite to the variable resistance layer. If the width of the first wiring is represented as A (nm), the width of the second wiring represented as B (nm), and the distance between the first electrode and the second electrode represented as L0 (nm), the following equation is satisfied: 3 2  AB

摘要翻译： 非易失性电阻变化装置包括由金属元件构成的第一电极，第二电极，形成在第一电极和第二电极之间的可变电阻层，在与可变电阻相反的一侧形成在第一电极上的第一布线 层和在与可变电阻层相反的一侧形成在第二电极上的第二布线。 如果将第一布线的宽度表示为A（nm），则表示为B（nm）的第二布线的宽度以及表示为L0（nm）的第一电极和第二电极之间的距离，下式为 满意：3 2 AB

公开(公告)号：US08076785B2

公开(公告)日：2011-12-13

申请号：US11474406

申请日：2006-06-26

申请人： Takao Nishimura ,  Yoshikazu Kumagaya ,  Akira Takashima ,  Kouichi Nakamura ,  Kazuyuki Aiba

发明人： Takao Nishimura ,  Yoshikazu Kumagaya ,  Akira Takashima ,  Kouichi Nakamura ,  Kazuyuki Aiba

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14 ,  H01L2224/1411 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17107 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2225/06558 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.

摘要翻译： 半导体器件包括具有设置有外部连接端子焊盘的主表面的半导体元件。 半导体元件经由设置在外部连接端子焊盘上的多个凸形外部连接端子和连接构件连接到支撑板上的导电层; 并且连接构件通常覆盖凸形外部连接端子。