公开(公告)号：US20100062597A1

公开(公告)日：2010-03-11

申请号：US12587301

申请日：2009-10-05

申请人： Luc Belanger ,  Stephen L. Buchwalter ,  Leena Paivikki Buchwalter ,  Ajay P. Giri ,  Jonathan H. Griffith ,  Donald W. Henderson ,  Sung Kwon Kang ,  Eric H. Laine ,  Christian Lavoie ,  Paul A. Lauro ,  Valérie Anne Oberson ,  Da-Yuan Shih ,  Kamalesh K. Srivastava ,  Michael J. Sullivan

发明人： Luc Belanger ,  Stephen L. Buchwalter ,  Leena Paivikki Buchwalter ,  Ajay P. Giri ,  Jonathan H. Griffith ,  Donald W. Henderson ,  Sung Kwon Kang ,  Eric H. Laine ,  Christian Lavoie ,  Paul A. Lauro ,  Valérie Anne Oberson ,  Da-Yuan Shih ,  Kamalesh K. Srivastava ,  Michael J. Sullivan

IPC分类号： H01L21/60

CPC分类号： H01L24/12 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/114 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2224/13099

摘要： An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.

摘要翻译： 一种适于将微电子器件芯片倒装连接到封装的互连结构，包括二层，三层或四层限流冶金，包括粘附/反应阻挡层，并且具有与含锡的组分反应的焊料可湿性层 无铅焊料，使得可焊接层在焊接期间可以完全消耗，但在焊接期间与无铅焊料接触后，阻挡层保持不变。 一个或多个无铅焊料球选择性地位于焊料润湿层上，该无铅焊球包含锡作为主要成分和一种或多种合金成分。

公开(公告)号：US07351360B2

公开(公告)日：2008-04-01

申请号：US10986665

申请日：2004-11-12

申请人： Gareth Hougham ,  Paul A. Lauro ,  Brian R. Sundlof ,  Jeffrey D. Gelorme

发明人： Gareth Hougham ,  Paul A. Lauro ,  Brian R. Sundlof ,  Jeffrey D. Gelorme

IPC分类号： H01B1/04

CPC分类号： H01L23/3733 ,  B82Y30/00 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/40 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  Y10S977/788 ,  Y10T156/10 ,  Y10T428/24994 ,  H01L2224/0401

摘要： The present invention relates generally to thermally-conductive pastes for use with integrated circuits, and particularly, but not by way of limitation, to self-orienting microplates of graphite.

摘要翻译： 本发明一般涉及用于集成电路的导热膏，特别是但不限于石墨的自取向微孔板。

公开(公告)号：US07172431B2

公开(公告)日：2007-02-06

申请号：US10928473

申请日：2004-08-27

申请人： Brian S. Beaman ,  George Liang-Tai Chiu ,  Keith Fogel ,  Paul A. Lauro ,  Daniel P. Morris ,  Da-Juan Shih

发明人： Brian S. Beaman ,  George Liang-Tai Chiu ,  Keith Fogel ,  Paul A. Lauro ,  Daniel P. Morris ,  Da-Juan Shih

IPC分类号： H01R12/00

CPC分类号： H01R13/2464 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/07314 ,  G01R1/07357 ,  H01R12/714

摘要： A probe or an electrical connector comprises a substrate with a surface having a plurality of electrical contact locations. A shaped elongated electrical conductor has a first end coupled to one of the electrical contact locations and a second end thereof which projects away from the electrical contact location and through an aperture in a sheet of material. The sheet is disposed to be spaced apart from the surface of the substrate. At the second end of the elongated electrical conductor there is a tip structure, which is larger than the aperture in the sheet of material. The tip structure has a pointed portion thereof. The tip structure is disposed against contact locations of a contact surface. The electronic structure is moved towards the contact surface permitting the tip structure to penetrate into the surface of the electrical contact location thereon and to move, wipe, or vibrate across the surface thereof as the shaped elongated electrical conductor flexes as a result of being compressed by the movement of the electronic structure toward the contact surface.

摘要翻译： 探针或电连接器包括具有多个电接触位置的表面的基底。 成形细长的电导体具有联接到电接触位置之一的第一端和其第二端，其突出远离电接触位置并穿过材料片中的孔。 片材被设置成与衬底的表面间隔开。 在细长电导体的第二端，有一个尖端结构，其大于该材料片中的孔。 尖端结构具有其尖端部分。 尖端结构设置成抵靠接触表面的接触位置。 电子结构朝向接触表面移动，允许尖端结构穿过其中的电接触位置的表面并且随着成形细长电导体由于被...的压缩而弯曲而在其表面上移动，擦拭或振动 电子结构向接触表面移动。

公开(公告)号：US08604623B2

公开(公告)日：2013-12-10

申请号：US13553887

申请日：2012-07-20

申请人： Gareth Hougham ,  Paul A. Lauro ,  Brian R. Sundlof ,  Jeffrey D. Gelorme

发明人： Gareth Hougham ,  Paul A. Lauro ,  Brian R. Sundlof ,  Jeffrey D. Gelorme

IPC分类号： H01L23/04

CPC分类号： H01L23/3733 ,  B82Y30/00 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/40 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  Y10S977/788 ,  Y10T156/10 ,  Y10T428/24994 ,  H01L2224/0401

摘要： The present invention relates generally to thermally-conductive pastes for use with integrated circuits, and particularly, but not by way of limitation, to self-orienting microplates of graphite.

摘要翻译： 本发明一般涉及用于集成电路的导热膏，特别是但不限于石墨的自取向微孔板。

公开(公告)号：US08268282B2

公开(公告)日：2012-09-18

申请号：US11758457

申请日：2007-06-05

申请人： Gareth Hougham ,  Paul A. Lauro ,  Brian R. Sundlof ,  Jeffrey D. Gelorme

发明人： Gareth Hougham ,  Paul A. Lauro ,  Brian R. Sundlof ,  Jeffrey D. Gelorme

IPC分类号： H01B1/04

CPC分类号： H01L23/3733 ,  B82Y30/00 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/40 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  Y10S977/788 ,  Y10T156/10 ,  Y10T428/24994 ,  H01L2224/0401

摘要： The present invention relates generally to thermally-conductive pastes for use with integrated circuits, and particularly, but not by way of limitation, to self-orienting microplates of graphite.

摘要翻译： 本发明一般涉及用于集成电路的导热膏，特别是但不限于石墨的自取向微孔板。

公开(公告)号：US08156998B2

公开(公告)日：2012-04-17

申请号：US12710951

申请日：2010-02-23

申请人： Bruce K. Furman ,  Sushumna Iruvanti ,  Paul A. Lauro ,  Yves C. Martin ,  Da Yuan Shih ,  Theodore G. Van Kessel ,  Wei Zou

发明人： Bruce K. Furman ,  Sushumna Iruvanti ,  Paul A. Lauro ,  Yves C. Martin ,  Da Yuan Shih ,  Theodore G. Van Kessel ,  Wei Zou

IPC分类号： F28F7/00

CPC分类号： H01L23/433 ,  F28F13/00 ,  F28F2013/005 ,  H01L2224/73253 ,  Y10T29/4935 ,  Y10T29/53113

摘要： The present invention is a patterned metal thermal interface. In one embodiment a system for dissipating heat from a heat-generating device includes a heat sink having a first surface adapted for thermal coupling to a first surface of the heat generating device and a thermal interface having at least one patterned surface, the thermal interface being adapted to thermally couple the first surface of the heat sink to the first surface of the heat generating device. The patterned surface of the thermal interface allows the thermal interface to deform under compression between the heat sink and the heat generating device, leading to better conformity of the thermal interface to the surfaces of the heat sink and the heat generating device.

摘要翻译： 本发明是图案化的金属热界面。 在一个实施例中，用于从发热装置散热的系统包括具有适于热耦合到发热装置的第一表面的第一表面的散热器和具有至少一个图案化表面的热界面，所述热界面是 适于将散热器的第一表面热耦合到发热装置的第一表面。 热界面的图案化表面允许热界面在散热器和发热装置之间的压缩下变形，导致热界面与散热器和发热装置的表面更好地一致。

公开(公告)号：US20110240279A1

公开(公告)日：2011-10-06

申请号：US12750258

申请日：2010-03-30

申请人： BRUCE K. Furman ,  Paul A. Lauro ,  Yves C. Martin ,  Robert L. Sandstrom ,  Da-Yuan Shih ,  Theodore G. Van Kessel

发明人： BRUCE K. Furman ,  Paul A. Lauro ,  Yves C. Martin ,  Robert L. Sandstrom ,  Da-Yuan Shih ,  Theodore G. Van Kessel

IPC分类号： F28F21/08 ,  B32B15/01 ,  B23K35/02 ,  B32B15/04

CPC分类号： B23K35/0238 ,  B32B15/01 ,  F28F3/02 ,  F28F2013/006 ,  H01L23/3735 ,  H01L23/42 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T428/12222 ,  Y10T428/12493 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12889 ,  Y10T428/12896 ,  H01L2924/00

摘要： The present invention is hybrid liquid metal-solder thermal interface. In one embodiment, a thermal interface for coupling a heat generating device to a heat sink includes a first metal interface layer, a second metal interface layer, and an isolation layer positioned between the first metal interface layer and the second metal interface layer, where at least one of the first metal interface layer and the second metal interface layer comprises a liquid metal.

摘要翻译： 本发明是混合液态金属 - 焊料热界面。 在一个实施例中，用于将发热装置耦合到散热器的热界面包括第一金属界面层，第二金属界面层和位于第一金属界面层和第二金属界面层之间的隔离层，其中在 第一金属界面层和第二金属界面层中的至少一个包括液态金属。

公开(公告)号：US20110192887A1

公开(公告)日：2011-08-11

申请号：US13088727

申请日：2011-04-18

申请人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

发明人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

IPC分类号： B23K1/20

CPC分类号： B23K3/0638 ,  B23K3/08 ,  B23K2101/42 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/111 ,  H05K3/3457 ,  H05K2201/09472 ,  H05K2203/0126 ,  Y10T29/49826 ,  Y10T156/1062 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

公开(公告)号：US20110156256A1

公开(公告)日：2011-06-30

申请号：US12647999

申请日：2009-12-28

申请人： Sung K. Kang ,  Paul A. Lauro ,  Minhua Lu ,  Da-Yuan Shih

发明人： Sung K. Kang ,  Paul A. Lauro ,  Minhua Lu ,  Da-Yuan Shih

IPC分类号： H01L23/485 ,  H01L21/768

CPC分类号： H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05562 ,  H01L2224/05564 ,  H01L2224/05655 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/16503 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01063 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0109 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/01026 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2224/05552

摘要： A process comprises manufacturing an electromigration-resistant under-bump metallization (UBM) flip chip structure comprising a Cu layer by applying to the Cu layer a metallic reaction barrier layer comprising NiFe. The solder employed in the flip chip structure comprise substantially lead-free tin. A structure comprises a product produced by this process. In another embodiment a process comprises manufacturing an electromigration-resistant UBM Sn-rich Pb-free solder bump flip chip structure wherein the electromigration-resistant UBM structure comprises a four-layer structure, or a three-layer structure, wherein the four layer structure is formed by providing 1) an adhesion layer, 2) a Cu seed layer for plating, 3) a reaction barrier layer, and 4) a wettable layer for joining to the solder, and the three-layer structure is formed by providing 1) an adhesion layer, 2) a reaction barrier layer, and 3) a wettable layer. In a further embodiment, the reaction barrier layer comprises metals selected from Ni, Fe, Pd, Pt, Co, Cu and their alloys, and combinations thereof. A structure comprises a product produced by the immediately foregoing process.

摘要翻译： 一种方法包括通过向Cu层施加包含NiFe的金属反应阻挡层来制造包含Cu层的电迁移性凸块下金属化（UBM）倒装芯片结构。 在倒装芯片结构中使用的焊料基本上包括无铅锡。 一种结构包括通过该方法生产的产品。 在另一个实施方案中，一种方法包括制造抗电镀UBM Sn的无铅焊料凸块倒装芯片结构，其中电迁移阻挡UBM结构包括四层结构或三层结构，其中四层结构是 通过提供1）粘合层形成，2）用于电镀的Cu籽晶层，3）反应阻挡层，以及4）用于与焊料接合的可湿性层，并且通过提供1）一种 粘合层，2）反应阻挡层，和3）可湿性层。 在另一个实施方案中，反应阻挡层包含选自Ni，Fe，Pd，Pt，Co，Cu及其合金的金属及其组合。 一种结构包括由上述方法生产的产品。

公开(公告)号：US20100193949A1

公开(公告)日：2010-08-05

申请号：US12364684

申请日：2009-02-03

申请人： Luc L. Belanger ,  Marc A. Bergendahl ,  Ajay P. Giri ,  Paul A. Lauro ,  Valerie A. Oberson ,  Da-Yuan Shih

发明人： Luc L. Belanger ,  Marc A. Bergendahl ,  Ajay P. Giri ,  Paul A. Lauro ,  Valerie A. Oberson ,  Da-Yuan Shih

IPC分类号： H01L23/48 ,  H01L21/302

CPC分类号： H01L24/11 ,  H01L24/12 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/01028 ,  H01L2924/04941

摘要： Methods and UBM structures having bilayer or trilayer UBM layers that include a thin TiW adhesion layer and a thick Ni-based barrier layer thereover both deposited under sputtering operating conditions that provide the resultant bilayer or trilayer UBM layers with minimal composite stresses. The Ni-based barrier layer may be pure Ni or a Ni alloy. These UBM layers may be patterned to fabricate bilayer or trilayer UBM capture pads, followed by joining a lead-free solder thereto for providing lead-free solder joints that maintain reliability after multiple reflows. Optionally, the top layer of the trilayer UBM structures may include soluble or insoluble metals for doping the lead-free solder connections.

摘要翻译： 具有双层或三层UBM层的方法和UBM结构，其在包括薄TiW粘附层和厚Ni基阻挡层的两个或三层UBM层上沉积在溅射操作条件下，以最小的复合应力提供所得到的双层或三层UBM层。 Ni基阻挡层可以是纯Ni或Ni合金。 这些UBM层可以被图案化以制造双层或三层UBM捕获垫，随后将无铅焊料接合到其上以提供在多次回流之后保持可靠性的无铅焊点。 任选地，三层UBM结构的顶层可以包括用于掺杂无铅焊料连接的可溶性或不溶性金属。