公开(公告)号：US08664755B2

公开(公告)日：2014-03-04

申请号：US13247603

申请日：2011-09-28

申请人： Chang Hyun Lim ,  Young Ki Lee ,  Kwang Soo Kim ,  Seog Moon Choi

发明人： Chang Hyun Lim ,  Young Ki Lee ,  Kwang Soo Kim ,  Seog Moon Choi

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49551 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/071 ,  H01L25/50 ,  H01L2224/291 ,  H01L2224/29187 ,  H01L2224/29188 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Disclosed herein is a power module package including: a first substrate; a second substrate having a pad for connection to the first substrate formed on one side or both sides of one surface thereof and having external connection terminals for connection to the outside formed on the other surface thereof; and a lead frame having one end bonded to the first substrate and the other end bonded to the pad of the second substrate to thereby vertically connect the first and second substrates to each other.

摘要翻译： 本文公开了一种功率模块封装，包括：第一基板; 第二基板，其具有用于连接到其一个表面的一侧或两侧上的第一基板的焊盘，并且具有用于连接到形成在其另一个表面上的外部的外部连接端子; 以及引线框架，其一端接合到第一基板，另一端接合到第二基板的焊盘，从而将第一和第二基板彼此垂直连接。

公开(公告)号：US20120319259A1

公开(公告)日：2012-12-20

申请号：US13235176

申请日：2011-09-16

申请人： Kwang Soo Kim ,  Ji Hyun Park ,  Young Ki Lee ,  Seog Moon Choi

发明人： Kwang Soo Kim ,  Ji Hyun Park ,  Young Ki Lee ,  Seog Moon Choi

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L24/43 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/43 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15724 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：布置成彼此面对的第一和第二引线框架，第一和第二框架中的任一个或第二框架由铝制成; 阳极氧化层形成在第一和第二引线框架中由铝制成的引线框架的部分上; 以及安装在第一和第二引线框架的第一表面上的半导体器件。

公开(公告)号：US08553417B2

公开(公告)日：2013-10-08

申请号：US13007545

申请日：2011-01-14

申请人： Ji Hyun Park ,  Seog Moon Choi ,  Young Ki Lee

发明人： Ji Hyun Park ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： H05K7/20

CPC分类号： H05K1/053 ,  H05K2201/09745

摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：具有散热器的基底，具有凹槽; 绝缘层，其通过在其上进行阳极氧化而形成在所述基底基板上; 以及形成在绝缘层上的电路层，由此制造具有由金属材料制成的散热器的散热基板，从而可以保护弱热的器件，从而解决了降低寿命的问题 跨度和可靠性降低。

公开(公告)号：US20120319260A1

公开(公告)日：2012-12-20

申请号：US13484160

申请日：2012-05-30

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Sung Keun Park

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Sung Keun Park

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.

摘要翻译： 本文公开了一种功率模块封装，包括：第一衬底，其上安装有第一半导体芯片; 以及具有安装在其上的第二半导体芯片的第二基板，所述第二基板与所述第一基板结合，使得其厚度方向的侧表面设置在所述第一基板的上表面上。

公开(公告)号：US08134077B2

公开(公告)日：2012-03-13

申请号：US12614405

申请日：2009-11-07

申请人： Hye Sook Shin ,  Seog Moon Choi ,  Shan Gao ,  Chang Hyun Lim ,  Tae Hyun Kim ,  Young Ki Lee

发明人： Hye Sook Shin ,  Seog Moon Choi ,  Shan Gao ,  Chang Hyun Lim ,  Tae Hyun Kim ,  Young Ki Lee

IPC分类号： H05K7/20 ,  H05K1/00

摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.

公开(公告)号：US20110088928A1

公开(公告)日：2011-04-21

申请号：US12631640

申请日：2009-12-04

申请人： Chang Hyun LIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Young Ki Lee ,  Hye Sook Shin ,  Young Ho Sohn

发明人： Chang Hyun LIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Young Ki Lee ,  Hye Sook Shin ,  Young Ho Sohn

IPC分类号： H05K7/20

CPC分类号： H05K7/205 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/053 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/09345 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2203/0315

摘要： Disclosed is a heat dissipating substrate, which includes a metal plate, an insulating film formed on the surface of the metal plate, a circuit pattern formed on the insulating film, and a first via formed to pass through at least a part of the metal plate so that the metal plate and the circuit pattern are electrically connected to each other, and also which exhibits superior heat dissipation effects and enables the configuration of a circuit board to be simple due to no need to additionally provide a ground layer and a power layer.

摘要翻译： 公开了一种散热基板，其包括金属板，形成在金属板的表面上的绝缘膜，形成在绝缘膜上的电路图案，以及形成为穿过金属板的至少一部分的第一通孔 使得金属板和电路图形彼此电连接，并且还表现出优异的散热效果，并且由于不需要另外提供接地层和功率层，能够使电路板的构造简单。

公开(公告)号：US20110042699A1

公开(公告)日：2011-02-24

申请号：US12654431

申请日：2009-12-18

申请人： Sung Keun Park ,  Seog Moon Choi ,  Young Ho Sohn ,  Tae Hyun Kim ,  Young Ki Lee

发明人： Sung Keun Park ,  Seog Moon Choi ,  Young Ho Sohn ,  Tae Hyun Kim ,  Young Ki Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L33/60 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4848 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48465

摘要： A substrate for a light emitting diode (LED) package, and an LED package having the same are disclosed. The substrate for an LED package includes: a metal plate; an insulation oxide layer formed on a portion of the surface of the metal plate; a first conductive pattern formed at one region of the insulation oxide layer and providing a light emitting diode mounting area; and a second conductive pattern formed at another region of the insulation oxide layer such that it is separated from the first conductive pattern. In the substrate for an LED package, because regions of the insulation oxide layer other than regions for insulating conductive patterns are removed, heat generated from the light emitting diode can be effectively released. In addition, degradation of reflexibility and luminance of the LED due to the insulation oxide layer can be prevented.

摘要翻译： 公开了一种用于发光二极管（LED）封装的衬底和具有该衬底的LED封装。 用于LED封装的衬底包括：金属板; 绝缘氧化物层，形成在所述金属板的所述表面的一部分上; 形成在所述绝缘氧化物层的一个区域并提供发光二极管安装区域的第一导电图案; 以及形成在所述绝缘氧化物层的另一区域处的第二导电图案，使得其与所述第一导电图案分离。 在LED封装用基板中，除去绝缘性导电图案以外的绝缘氧化物层的区域，能够有效地释放从发光二极管产生的热量。 此外，可以防止由于绝缘氧化物层导致的LED的反射性和亮度的劣化。

公开(公告)号：US20100294543A1

公开(公告)日：2010-11-25

申请号：US12539527

申请日：2009-08-11

申请人： Young Ho Sohn ,  Seog Moon Choi ,  Sung Keun Park ,  Young Ki Lee ,  Bum Sik Jang ,  Ji Hyun Park

发明人： Young Ho Sohn ,  Seog Moon Choi ,  Sung Keun Park ,  Young Ki Lee ,  Bum Sik Jang ,  Ji Hyun Park

IPC分类号： H05K1/00 ,  B05D5/12

CPC分类号： H05K3/4623 ,  H05K1/056 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096

摘要： Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same.

摘要翻译： 本发明公开了一种散热基板，其结构是将两个分别包含发热功能的金属芯片的两层芯基板彼此并联并相互并联，从而实现更好的辐射性能， 制造相同。

公开(公告)号：US08729683B2

公开(公告)日：2014-05-20

申请号：US13235176

申请日：2011-09-16

申请人： Kwang Soo Kim ,  Ji Hyun Park ,  Young Ki Lee ,  Seog Moon Choi

发明人： Kwang Soo Kim ,  Ji Hyun Park ,  Young Ki Lee ,  Seog Moon Choi

IPC分类号： H01L23/495

CPC分类号： H01L24/43 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/43 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15724 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：布置成彼此面对的第一和第二引线框架，第一和第二框架中的任一个或第二框架由铝制成; 阳极氧化层形成在第一和第二引线框架中由铝制成的引线框架的部分上; 以及安装在第一和第二引线框架的第一表面上的半导体器件。

公开(公告)号：US08242371B2

公开(公告)日：2012-08-14

申请号：US12614405

申请日：2009-11-07

申请人： Hye Sook Shin ,  Seog Moon Choi ,  Shan Gao ,  Chang Hyun Lim ,  Tae Hyun Kim ,  Young Ki Lee

发明人： Hye Sook Shin ,  Seog Moon Choi ,  Shan Gao ,  Chang Hyun Lim ,  Tae Hyun Kim ,  Young Ki Lee

IPC分类号： H05K7/20 ,  H05K1/00

CPC分类号： H05K7/205 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/053 ,  H05K3/202 ,  H05K3/24 ,  H05K3/341 ,  H05K2201/066 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155

摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.

摘要翻译： 公开了一种散热电路板，其包括金属芯，该金属芯包括在其表面上形成的绝缘层，形成在绝缘层上的电路层，包括种子层和第一电路图案，以及散热框架层， 使用焊料并具有第二电路图案的电路层，其中散热框架层不是通过电镀工艺而是通过使用焊料结合到电路层上，因此降低了电镀工艺的成本和时间并减轻了施加的应力 由于电镀过程而导致散热电路板。 还提供了制造散热电路板的方法。