公开(公告)号：US20100294543A1

公开(公告)日：2010-11-25

申请号：US12539527

申请日：2009-08-11

申请人： Young Ho Sohn ,  Seog Moon Choi ,  Sung Keun Park ,  Young Ki Lee ,  Bum Sik Jang ,  Ji Hyun Park

发明人： Young Ho Sohn ,  Seog Moon Choi ,  Sung Keun Park ,  Young Ki Lee ,  Bum Sik Jang ,  Ji Hyun Park

IPC分类号： H05K1/00 ,  B05D5/12

CPC分类号： H05K3/4623 ,  H05K1/056 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096

摘要： Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same.

摘要翻译： 本发明公开了一种散热基板，其结构是将两个分别包含发热功能的金属芯片的两层芯基板彼此并联并相互并联，从而实现更好的辐射性能， 制造相同。

公开(公告)号：US20110042699A1

公开(公告)日：2011-02-24

申请号：US12654431

申请日：2009-12-18

申请人： Sung Keun Park ,  Seog Moon Choi ,  Young Ho Sohn ,  Tae Hyun Kim ,  Young Ki Lee

发明人： Sung Keun Park ,  Seog Moon Choi ,  Young Ho Sohn ,  Tae Hyun Kim ,  Young Ki Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L33/60 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4848 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48465

摘要： A substrate for a light emitting diode (LED) package, and an LED package having the same are disclosed. The substrate for an LED package includes: a metal plate; an insulation oxide layer formed on a portion of the surface of the metal plate; a first conductive pattern formed at one region of the insulation oxide layer and providing a light emitting diode mounting area; and a second conductive pattern formed at another region of the insulation oxide layer such that it is separated from the first conductive pattern. In the substrate for an LED package, because regions of the insulation oxide layer other than regions for insulating conductive patterns are removed, heat generated from the light emitting diode can be effectively released. In addition, degradation of reflexibility and luminance of the LED due to the insulation oxide layer can be prevented.

摘要翻译： 公开了一种用于发光二极管（LED）封装的衬底和具有该衬底的LED封装。 用于LED封装的衬底包括：金属板; 绝缘氧化物层，形成在所述金属板的所述表面的一部分上; 形成在所述绝缘氧化物层的一个区域并提供发光二极管安装区域的第一导电图案; 以及形成在所述绝缘氧化物层的另一区域处的第二导电图案，使得其与所述第一导电图案分离。 在LED封装用基板中，除去绝缘性导电图案以外的绝缘氧化物层的区域，能够有效地释放从发光二极管产生的热量。 此外，可以防止由于绝缘氧化物层导致的LED的反射性和亮度的劣化。

公开(公告)号：US08309399B2

公开(公告)日：2012-11-13

申请号：US13246615

申请日：2011-09-27

申请人： Shan Gao ,  Seog Moon Choi ,  Tae Hyun Kim ,  Ju Pyo Hong ,  Bum Sik Jang ,  Ji Hyun Park

发明人： Shan Gao ,  Seog Moon Choi ,  Tae Hyun Kim ,  Ju Pyo Hong ,  Bum Sik Jang ,  Ji Hyun Park

IPC分类号： H01L21/50

CPC分类号： H01L25/072 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/427 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/071 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole at a position corresponding to the first through hole, and the metal plates are attached to both sides of the cooling member. A circuit layer is formed on the anodic oxidation layer and performs an interlayer connection through a via formed in the first and second through holes. A power device is connected to the circuit layer. A resin encapsulant encloses the circuit layer and the power device. A housing is installed to each of the metal plates to form a sealing space for the resin encapsulant.

摘要翻译： 这里公开了功率半导体模块。 模块包括各自具有第一通孔的金属板，阳极氧化层形成在金属板的表面和第一通孔的内部。 冷却构件在与第一通孔对应的位置具有第二通孔，并且金属板附接到冷却构件的两侧。 在阳极氧化层上形成电路层，通过在第一和第二通孔中形成的通孔进行层间连接。 电源设备连接到电路层。 树脂密封剂包围电路层和功率器件。 每个金属板上安装有一个壳体，以形成树脂密封剂的密封空间。

公开(公告)号：US20110012252A1

公开(公告)日：2011-01-20

申请号：US12551238

申请日：2009-08-31

申请人： Shan GAO ,  Seog Moon Choi ,  Tae Hyun Kim ,  Ju Pyo Hong ,  Bum Sik Jang ,  Ji Hyun Park

发明人： Shan GAO ,  Seog Moon Choi ,  Tae Hyun Kim ,  Ju Pyo Hong ,  Bum Sik Jang ,  Ji Hyun Park

IPC分类号： H01L23/46 ,  H01L23/48 ,  H01L21/50

CPC分类号： H01L25/072 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/427 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/071 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole at a position corresponding to the first through hole, and the metal plates are attached to both sides of the cooling member. A circuit layer is formed on the anodic oxidation layer and performs an interlayer connection through a via formed in the first and second through holes. A power device is connected to the circuit layer. A resin encapsulant encloses the circuit layer and the power device. A housing is installed to each of the metal plates to form a sealing space for the resin encapsulant.

摘要翻译： 这里公开了功率半导体模块。 模块包括各自具有第一通孔的金属板，阳极氧化层形成在金属板的表面和第一通孔的内部。 冷却构件在与第一通孔对应的位置具有第二通孔，并且金属板附接到冷却构件的两侧。 在阳极氧化层上形成电路层，通过在第一和第二通孔中形成的通孔进行层间连接。 电源设备连接到电路层。 树脂密封剂包围电路层和功率器件。 每个金属板上安装有一个壳体，以形成树脂密封剂的密封空间。

公开(公告)号：US20100295172A1

公开(公告)日：2010-11-25

申请号：US12538042

申请日：2009-08-07

申请人： Shan Gao ,  Seog Moon Choi ,  Do Jae Yoo ,  Tae Hyun Kim ,  Bum Sik Jang ,  Ji Hyun Park

发明人： Shan Gao ,  Seog Moon Choi ,  Do Jae Yoo ,  Tae Hyun Kim ,  Bum Sik Jang ,  Ji Hyun Park

IPC分类号： H01L23/34

CPC分类号： H01L23/467 ,  H01L23/142 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/427 ,  H01L25/071 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Disclosed is a power semiconductor module having improved heat dissipation performance, including an anodized metal substrate including a metal plate, an anodized layer formed on a surface of the metal plate, and a circuit layer formed on the anodized layer on the metal plate, a power device connected to the circuit layer, and a housing mounted on the metal plate and for defining a sealing space which accommodates a resin sealing material for sealing the circuit layer and the power device.

摘要翻译： 公开了一种具有改善的散热性能的功率半导体模块，包括阳极化金属基板，其包括金属板，形成在金属板的表面上的阳极氧化层和形成在金属板上的阳极氧化层上的电路层， 连接到电路层的器件，以及安装在金属板上并用于限定容纳用于密封电路层和功率器件的树脂密封材料的密封空间的壳体。

公开(公告)号：US08058722B2

公开(公告)日：2011-11-15

申请号：US12551238

申请日：2009-08-31

申请人： Shan Gao ,  Seog Moon Choi ,  Tae Hyun Kim ,  Ju Pyo Hong ,  Bum Sik Jang ,  Ji Hyun Park

发明人： Shan Gao ,  Seog Moon Choi ,  Tae Hyun Kim ,  Ju Pyo Hong ,  Bum Sik Jang ,  Ji Hyun Park

IPC分类号： H01L23/46

CPC分类号： H01L25/072 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/427 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/071 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole at a position corresponding to the first through hole, and the metal plates are attached to both sides of the cooling member. A circuit layer is formed on the anodic oxidation layer and performs an interlayer connection through a via formed in the first and second through holes. A power device is connected to the circuit layer. A resin encapsulant encloses the circuit layer and the power device. A housing is installed to each of the metal plates to form a sealing space for the resin encapsulant.

摘要翻译： 这里公开了功率半导体模块。 模块包括各自具有第一通孔的金属板，阳极氧化层形成在金属板的表面和第一通孔的内部。 冷却构件在与第一通孔对应的位置具有第二通孔，并且金属板附接到冷却构件的两侧。 在阳极氧化层上形成电路层，通过在第一和第二通孔中形成的通孔进行层间连接。 电源设备连接到电路层。 树脂密封剂包围电路层和功率器件。 每个金属板上安装有一个壳体，以形成树脂密封剂的密封空间。

公开(公告)号：US20110031608A1

公开(公告)日：2011-02-10

申请号：US12562829

申请日：2009-09-18

申请人： Tae Hyun KIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Bum Sik Jang ,  Ji Hyun Park

发明人： Tae Hyun KIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Bum Sik Jang ,  Ji Hyun Park

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/24 ,  H01L23/04 ,  H01L23/13 ,  H01L23/142 ,  H01L23/36 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a power device package, which has high heat dissipation performance and includes an anodized metal substrate including a metal plate having a cavity formed on one surface thereof and an anodized layer formed on both the surface of the metal plate and the inner wall of the cavity and a circuit layer formed on the metal plate, a power device mounted in the cavity of the metal plate so as to be connected to the circuit layer, and a resin sealing material charged in the cavity of the metal plate. A method of fabricating the power device package is also provided.

摘要翻译： 公开了一种功率器件封装，其具有高散热性能，并且包括阳极氧化金属基板，其包括金属板，金属板的一个表面上形成有空腔，阳极氧化层形成在金属板的表面和金属板的内壁上 空腔和形成在金属板上的电路层，安装在金属板的空腔中以连接到电路层的功率器件，以及填充在金属板的空腔中的树脂密封材料。 还提供了制造功率器件封装的方法。

公开(公告)号：US08686295B2

公开(公告)日：2014-04-01

申请号：US12614407

申请日：2009-11-07

申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K7/20

CPC分类号： H05K3/02 ,  H05K1/0201 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2203/0315

摘要： Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括由形成在分割区域中的第一绝缘体分割的镀层。 金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。

公开(公告)号：US08502374B2

公开(公告)日：2013-08-06

申请号：US13281285

申请日：2011-10-25

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Sung Keun Park ,  Seog Moon Choi ,  Chang Hyun Lim

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Sung Keun Park ,  Seog Moon Choi ,  Chang Hyun Lim

IPC分类号： H01L23/34

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：具有形成在多个半导体器件安装区域之间的沟槽的基底基板; 安装在基底基板的半导体器件安装区域上的半导体器件; 以及形成在基底基板上和凹槽的内部中的模制件。

公开(公告)号：US20110088928A1

公开(公告)日：2011-04-21

申请号：US12631640

申请日：2009-12-04

申请人： Chang Hyun LIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Young Ki Lee ,  Hye Sook Shin ,  Young Ho Sohn

发明人： Chang Hyun LIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Young Ki Lee ,  Hye Sook Shin ,  Young Ho Sohn

IPC分类号： H05K7/20

CPC分类号： H05K7/205 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/053 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/09345 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2203/0315

摘要： Disclosed is a heat dissipating substrate, which includes a metal plate, an insulating film formed on the surface of the metal plate, a circuit pattern formed on the insulating film, and a first via formed to pass through at least a part of the metal plate so that the metal plate and the circuit pattern are electrically connected to each other, and also which exhibits superior heat dissipation effects and enables the configuration of a circuit board to be simple due to no need to additionally provide a ground layer and a power layer.

摘要翻译： 公开了一种散热基板，其包括金属板，形成在金属板的表面上的绝缘膜，形成在绝缘膜上的电路图案，以及形成为穿过金属板的至少一部分的第一通孔 使得金属板和电路图形彼此电连接，并且还表现出优异的散热效果，并且由于不需要另外提供接地层和功率层，能够使电路板的构造简单。