公开(公告)号：US10821557B2

公开(公告)日：2020-11-03

申请号：US16098367

申请日：2017-05-02

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana De Avila Ribas ,  Suresh Telu ,  Pritha Choudhury ,  Anil K. N. Kumar ,  Siuli Sarkar

IPC: B23K1/00 ,  B23K35/26 ,  C22C13/02

Abstract: Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150° C., for example up to 175° C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn—Ag—Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.

公开(公告)号：US10710336B2

公开(公告)日：2020-07-14

申请号：US14915067

申请日：2014-08-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Oscar Khaselev ,  Bin Mo ,  Monnir Boureghda ,  Michael T. Marczi ,  Bawa Singh

IPC: B22F7/04 ,  B32B15/01 ,  B22F5/00 ,  C22C32/00 ,  C22C49/00 ,  H01L23/00

Abstract: Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.

公开(公告)号：US20200087528A1

公开(公告)日：2020-03-19

申请号：US16616701

申请日：2018-05-22

Applicant: Alpha Assembly Solutions Inc. ,  MacDermid Autotype Limited

Inventor： Nirmalya Kumar CHAKI ,  Chetan Pravinchandra SHAH ,  Barun DAS ,  Supriya DEVARAJAN ,  Siuli SARKAR ,  Rahul RAUT ,  Bawa SINGH ,  Anubhav RUSTOGI ,  Anna Jane HARRIS ,  Keith Paul PARSONS ,  Jeffrey William BRAHAM

IPC: C09D11/52 ,  C09D11/037 ,  C09D11/033 ,  C09D11/104 ,  H01H13/704

Abstract: This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.

公开(公告)号：US10462908B2

公开(公告)日：2019-10-29

申请号：US15439555

申请日：2017-02-22

Applicant: Alpha Assembly Solutions Inc.

Inventor： Oscar Khaselev ,  Nitin Desai ,  Michael T. Marczi ,  Bawa Singh

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/18 ,  H05K3/20 ,  H05K3/22 ,  H05K3/28 ,  H05K3/46 ,  H01L21/02 ,  H01L21/44 ,  H01L21/48 ,  H01L23/48 ,  B05D3/02 ,  H05K3/24

Abstract: Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

公开(公告)号：US10065274B2

公开(公告)日：2018-09-04

申请号：US14909888

申请日：2014-08-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit Pandher ,  Bawa Singh ,  Rahul Raut ,  Sanyogita Arora ,  Ravindra Bhatkal ,  Bin Mo

IPC: B23K35/36 ,  B23K35/26 ,  B23K35/362 ,  B23K35/02 ,  B23K1/012 ,  B23K1/08 ,  B23K1/19 ,  C22C13/00

Abstract: A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.

公开(公告)号：US20180020554A1

公开(公告)日：2018-01-18

申请号：US15716963

申请日：2017-09-27

Applicant: Alpha Assembly Solutions Inc.

Inventor： Paul Joseph Koep ,  Ellen S. Tormey ,  Girard Sidone

IPC: H05K3/34 ,  B23K35/02 ,  B23K1/20 ,  B23K35/26 ,  B23K1/00 ,  B23K101/42

CPC classification number: H05K3/34 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/42 ,  H05K3/3457 ,  H05K3/3484 ,  Y10T403/479

Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.

公开(公告)号：US09751159B2

公开(公告)日：2017-09-05

申请号：US15390861

申请日：2016-12-27

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Sanyogita Arora ,  Siuli Sarkar ,  Anna Lifton ,  Rahul Raut ,  Bawa Singh

IPC: B23K35/362 ,  B23K35/36 ,  B23K35/02 ,  C08L93/04 ,  C08K11/00 ,  H05K3/34 ,  B23K101/42

CPC classification number: B23K35/362 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  B23K2101/42 ,  C08K11/00 ,  C08L93/04 ,  C08L2205/025 ,  H05K3/3489

Abstract: Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.

公开(公告)号：US20170197281A1

公开(公告)日：2017-07-13

申请号：US15326180

申请日：2015-07-15

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravindra Bhatkal ,  Bawa Singh

IPC: B23K35/26 ,  H01L23/00 ,  B23K1/08 ,  B23K1/00 ,  C22C13/00

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/085 ,  B23K35/00 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K2101/40 ,  B23K2101/42 ,  C22C13/00 ,  C22C13/02 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29117 ,  H01L2224/29123 ,  H01L2224/29124 ,  H01L2224/29138 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29149 ,  H01L2224/29155 ,  H01L2224/29157 ,  H01L2224/2916 ,  H01L2224/29163 ,  H01L2224/29166 ,  H01L2224/29169 ,  H01L2224/29171 ,  H01L2224/29172 ,  H01L2224/2918 ,  H01L2224/83815 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01032 ,  H01L2924/01034 ,  H01L2924/01052 ,  H01L2924/01058

Abstract: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.

公开(公告)号：US20170164484A1

公开(公告)日：2017-06-08

申请号：US15439555

申请日：2017-02-22

Applicant: Alpha Assembly Solutions Inc.

Inventor： Oscar Khaselev ,  Nitin Desai ,  Michael T. Marczi ,  Bawa Singh

IPC: H05K3/12 ,  H05K3/00 ,  H05K3/22 ,  H05K1/09

CPC classification number: H05K3/125 ,  H05K1/09 ,  H05K3/0011 ,  H05K3/1258 ,  H05K3/22 ,  H05K3/245 ,  H05K2201/0203 ,  H05K2201/0224 ,  H05K2201/09909 ,  H05K2203/013 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K2203/1131 ,  H05K2203/1476 ,  Y10T29/49155

Abstract: Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

公开(公告)号：US20230374289A1

公开(公告)日：2023-11-23

申请号：US18247996

申请日：2021-10-07

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Nirmalya Kumar CHAKI ,  Chetan Pravinchandra SHAH ,  Bawa SINGH ,  Rahul RAUT ,  Vasuki Srinivas KAUSHIK ,  Ranjit PANDHER ,  Niveditha NAGARAJAN ,  Sandeesh M KUMAR ,  Anubhav RUSTOGI

IPC: C08L61/28 ,  C08K7/18 ,  C09D11/103 ,  C09D11/104 ,  C09J183/04 ,  C09D11/033 ,  C09J11/08

CPC classification number: C08L61/28 ,  C08K7/18 ,  C09D11/103 ,  C09D11/104 ,  C09J183/04 ,  C09D11/033 ,  C09J11/08 ,  C08L2205/035 ,  C08L2312/00 ,  C08L2201/50 ,  C08L2201/52 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/006

Abstract: A composition for use in the manufacture of an in-mould electronic (IME) component, the composition containing a binder comprising: a cross-linking agent comprising melamine formaldehyde, a thermoplastic resin comprising a hydroxyl group, and a solvent.