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126 条记录 (耗时 0.019 秒)

    Eccentric rotor and vibration motor having the rotor
    51.
    发明申请
    Eccentric rotor and vibration motor having the rotor 审中-公开
    具有转子的偏心转子和振动电机

    公开(公告)号：US20060255670A1

    公开(公告)日：2006-11-16

    申请号：US11240150

    申请日：2005-09-29

    申请人： Hyun-Seung Ki ,  Myung-Chae Joung ,  Myung-Sam Kang ,  Jae-Kul Lee ,  Du-Ki Kim ,  Duck-Shik Kim

    发明人： Hyun-Seung Ki ,  Myung-Chae Joung ,  Myung-Sam Kang ,  Jae-Kul Lee ,  Du-Ki Kim ,  Duck-Shik Kim

    IPC分类号： H02K7/06 ,  H02K7/10

    CPC分类号： H02K7/063 ,  H02K3/26

    摘要： An eccentric rotor and a vibration motor having the rotor are disclosed. In one embodiment, the eccentric rotor comprises: a board with an insertion hole, patterned coil layers on the upper portion of the board having multiple patterned coils and stacked in several layers, and commutators formed on the lower portion of the board electrically connected to the patterned coils and formed in integer multiples of the patterned coils, wherein the board is eccentric with regards to the insertion hole. In one embodiment, the eccentric rotor and vibration motor having the rotor can significantly increase the amount of vibration even with a small volume, as well as reduce manufacture time and costs.

    摘要翻译： 转子具有形成在板（331）的上部上的一组图案化的线圈层（338），其中板包括插入孔。 图案化的线圈层彼此层叠，并且包括图案化的线圈。 一组换向器形成在板的下部，并连接到图案化的线圈。 板相对于插入孔偏心旋转。 附接单元（335）确保图案化的线圈层上的重量。 对于包括具有插入孔的板的振动马达也包括独立权利要求。

    Fabricating method for a fluxgate sensor integrated in printed circuit board
    52.
    发明授权
    Fabricating method for a fluxgate sensor integrated in printed circuit board 有权
    集成在印刷电路板中的磁通门传感器的制造方法

    公开(公告)号：US07087450B2

    公开(公告)日：2006-08-08

    申请号：US11061611

    申请日：2005-02-22

    申请人： Won-youl Choi ,  Keon-yang Park ,  Byeong-cheon Koh ,  Myung-sam Kang ,  Kyung-won Na ,  Sang-on Choi

    发明人： Won-youl Choi ,  Keon-yang Park ,  Byeong-cheon Koh ,  Myung-sam Kang ,  Kyung-won Na ,  Sang-on Choi

    IPC分类号： H01L21/00

    CPC分类号： G01R33/05 ,  G01R15/185 ,  G01R33/04 ,  Y10T29/49073 ,  Y10T29/49075

    摘要： A fluxgate sensor integrated in a printed circuit board. The fluxgate sensor has soft magnetic cores having a lower core and an upper core mounted on the lower core, for forming a closed magnetic path on a printed circuit board, an excitation coil formed as a metal film, alternately winding the upper and the lower soft magnetic cores substantially in a number ‘8’ pattern, and a pick-up coil formed as a metal film, having a structure of winding the upper and the lower soft magnetic cores substantially in a solenoid pattern, the pick-up coil being placed on the same plane as an external contour of the excitation coil.

    摘要翻译： 集成在印刷电路板中的磁通门传感器。 磁通门传感器具有软磁芯，其具有安装在下芯上的下芯和上芯，用于在印刷电路板上形成闭合磁路，形成为金属膜的励磁线圈，交替地卷绕上软和下软 基本上为“8”图案的磁芯和形成为金属膜的拾取线圈，其具有将上下软磁芯基本上卷绕在螺线管图案中的结构，拾取线圈被放置在 与激励线圈的外部轮廓相同的平面。

    Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same
    53.
    发明授权
    Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same 失效
    使用印刷电路板制造技术的弱磁场传感器及其制造方法

    公开(公告)号：US06759845B2

    公开(公告)日：2004-07-06

    申请号：US10140266

    申请日：2002-05-08

    申请人： Myung-Sam Kang ,  Kyoung-Won Na ,  Sang-On Choi ,  Won-Youl Choi ,  Jeong-Hwan Lee ,  Keon-Yang Park

    发明人： Myung-Sam Kang ,  Kyoung-Won Na ,  Sang-On Choi ,  Won-Youl Choi ,  Jeong-Hwan Lee ,  Keon-Yang Park

    IPC分类号： G01R3304

    CPC分类号： G01R33/05 ,  G01C17/30 ,  H05K1/165 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/09536 ,  H05K2201/10416

    摘要： A weak-magnetic field sensor using printed circuit board manufacturing technique and a method of manufacturing the same which detects the Earth's magnetic field to obtain positional information is disclosed. The sensor comprises a first base board which is formed at its upper and lower surfaces with first driving patterns such that the upper and lower first driving patterns are electrically connected to each other, a pair of first stacked boards which are stacked on upper and lower surfaces of the first base board and which are formed with magnetic layers to be parallel to each other and patterned in a certain shape, and a pair of second stacked boards which are stacked on outer surfaces of the pair of first stacked boards and which are formed with second driving patterns electrically connected to the first driving patterns of the first base board to surround magnetic layers and formed with pickup patterns to surround the first and second driving patterns.

    摘要翻译： 公开了使用印刷电路板制造技术的弱磁场传感器及其制造方法，其检测地球磁场以获得位置信息。 传感器包括第一基板，其在其上表面和下表面处形成有第一驱动图案，使得上和下第一驱动图案彼此电连接;一对第一堆叠板，其堆叠在上表面和下表面上 并且形成有彼此平行并且形成一定形状的磁性层的一对第二堆叠板，并且堆叠在一对第一堆叠板的外表面上并且形成有 第二驱动图案，电连接到第一基板的第一驱动图案以包围磁性层并形成有拾取图案以包围第一和第二驱动图案。

    Printed circuit board and method of manufacturing the same
    55.
    发明授权
    Printed circuit board and method of manufacturing the same 失效
    印刷电路板及其制造方法

    公开(公告)号：US08541096B2

    公开(公告)日：2013-09-24

    申请号：US12654446

    申请日：2009-12-18

    申请人： Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

    发明人： Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

    IPC分类号： H05K1/03 ,  H05K7/02

    CPC分类号： H05K3/10 ,  H05K1/0271 ,  H05K1/09 ,  H05K3/4602 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/068 ,  H05K2201/09136

    摘要： There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.

    摘要翻译： 提供了印刷电路板。 印刷电路板可以被构造为包括：芯层，其中至少两层的弯曲防止部分插入在多个绝缘构件之间并且包括具有不同热膨胀系数的金属层; 形成为在芯层的内部和芯层的外表面中的至少一个上具有期望图案的电路图案; 以及形成在芯层上并包括露出电路图案的开口部分的绝缘层，以及制造印刷电路板的方法。 根据上述印刷电路板和印刷电路板的制造方法，通过在印刷电路板内设置弯曲防止部，能够提高进度和生产率的印刷电路板，以及制造印刷电路板的方法 可以提供印刷电路板。

    Manufacturing method of printed circuit board
    57.
    发明授权
    Manufacturing method of printed circuit board 有权
    印刷电路板的制造方法

    公开(公告)号：US08187479B2

    公开(公告)日：2012-05-29

    申请号：US12273961

    申请日：2008-11-19

    申请人： Myung-Sam Kang

    发明人： Myung-Sam Kang

    IPC分类号： B44C1/22

    CPC分类号： H05K3/421 ,  H05K3/0035 ,  H05K3/108 ,  H05K3/427 ,  H05K3/4652 ,  H05K2201/0341 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0361 ,  H05K2203/0384 ,  H05K2203/1388

    摘要： Disclosed is a manufacturing method of a printed circuit board. The method in accordance with an embodiment of the present invention includes: providing a laminated substrate having an insulator as well as a first metal layer and a second metal layer, which are sequentially laminated on one side of the insulator; processing a via hole in the laminated substrate; forming a seed layer on an inner wall of the via hole and on a surface of the second metal layer; plating an inside of the via hole and the surface of the second metal layer with a conductive material that is different from a material of the second metal layer; etching the seed layer and the conductive material, formed on the second metal layer; etching the second metal layer; and forming a first circuit pattern by selectively etching the first metal layer.

    摘要翻译： 公开了一种印刷电路板的制造方法。 根据本发明的实施例的方法包括：提供具有绝缘体的层叠基板以及依次层压在绝缘体的一侧上的第一金属层和第二金属层; 处理层压基板中的通孔; 在所述通孔的内壁上和所述第二金属层的表面上形成种子层; 用与第二金属层的材料不同的导电材料电镀通孔内表面和第二金属层表面; 蚀刻形成在第二金属层上的种子层和导电材料; 蚀刻第二金属层; 以及通过选择性地蚀刻所述第一金属层来形成第一电路图案。