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73 条记录 (耗时 0.022 秒)

    Soldering material and procedure
    53.
    发明授权
    Soldering material and procedure 失效
    焊接材料和程序

    公开(公告)号：US5385290A

    公开(公告)日：1995-01-31

    申请号：US158131

    申请日：1993-11-24

    申请人： Yinon Degani

    发明人： Yinon Degani

    IPC分类号： B23K35/363 ,  B23K1/00 ,  B23K35/22 ,  H05K3/34 ,  B23K31/02

    CPC分类号： B23K1/0016 ,  H05K3/3484 ,  B23K2201/42 ,  H05K2201/0266

    摘要： The quality of soldering produced on devices such as printed circuit boards and multichip modules is significantly improved through use of a specific size distribution of solder particles. In particular, the solder includes a vehicle and solder particles of specific size. In general, an appropriate distribution of both large and small particles should be employed. Through this expedient short circuits and soldering defects in fine line devices are reduced.

    摘要翻译： 通过使用焊料颗粒的特定尺寸分布，显着提高了在诸如印刷电路板和多芯片组件的器件上产生的焊接的质量。 特别地，焊料包括车辆和特定尺寸的焊料颗粒。 通常，应该使用大颗粒和小颗粒的适当分布。 通过这种方便的方式，减少细线装置中的短路和焊接缺陷。

    High performance multi-chip IC package
    56.
    发明授权
    High performance multi-chip IC package 有权
    高性能多芯片IC封装

    公开(公告)号：US06678167B1

    公开(公告)日：2004-01-13

    申请号：US09498005

    申请日：2000-02-04

    申请人： Yinon Degani ,  Thomas Dixon Dudderar ,  King Lien Tai

    发明人： Yinon Degani ,  Thomas Dixon Dudderar ,  King Lien Tai

    IPC分类号： H05K702

    CPC分类号： H01L23/36 ,  H01L25/0652 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/15321 ,  H05K1/141 ,  H05K1/189 ,  H05K3/3436

    摘要： The specification describes a multi-chip IC package in which IC chips are flip-chip bonded to both sides of a flexible substrate. The upper (or lower) surface of the flexible substrate is bonded to a rigid support substrate with openings in the support substrate to accommodate the IC chips bonded to the upper (or lower) surface of the flexible substrate. In a preferred embodiment a plurality of IC memory chips are mounted on one side of the flexible substrate and one or more logic chips to the other. A very thin flexible substrate is used to optimize the length of through hole interconnections between the memory and logic devices. If logic chips are flip-chip mounted in the cavity formed by the openings, a heat sink plate can be used to both cap the cavity and make effective thermal contact the backside of the logic chips.

    摘要翻译： 该说明书描述了一种多芯片IC封装，其中IC芯片倒装芯片结合到柔性基板的两侧。 柔性基板的上表面（或下表面）与支撑基板上具有开口的刚性支撑基板接合，以容纳粘合到柔性基板的上（或下）表面的IC芯片。 在优选实施例中，多个IC存储器芯片安装在柔性基板的一侧和一个或多个逻辑芯片之间。 使用非常薄的柔性基板来优化存储器和逻辑器件之间的通孔互连的长度。 如果将逻辑芯片倒装安装在由开口形成的空腔中，则可以使用散热板来盖住空腔并使逻辑芯片的背面有效的热接触。

    Packaging micromechanical devices
    58.
    发明授权
    Packaging micromechanical devices 有权
    包装微机械装置

    公开(公告)号：US06433411B1

    公开(公告)日：2002-08-13

    申请号：US09575883

    申请日：2000-05-22

    申请人： Yinon Degani ,  Thomas Dixon Dudderar ,  King Lien Tai

    发明人： Yinon Degani ,  Thomas Dixon Dudderar ,  King Lien Tai

    IPC分类号： H01L2302

    CPC分类号： B81B7/0041 ,  B81B7/0048 ,  B81B7/0067 ,  B81B7/007 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The specification describes packaging assemblies for micro-electronic machined mechanical systems (MEMS). The MEMS devices in these package assemblies are based on silicon MEMS devices on a silicon support and the MEMS devices and the silicon support are mechanically isolated from foreign materials. Foreign materials pose the potential for differential thermal expansion that deleteriously affects optical alignment in the MEMS devices. In a preferred embodiment the MEMS devices are enclosed in an all-silicon chamber. Mechanical isolation is also aided by using a pin contact array for interconnecting the silicon support substrate for the MEMS devices to the next interconnect level. The use of the pin contact array also allows the MEMS devices to be easily demountable for replacement or repair.

    摘要翻译： 该规范描述了用于微电子机械加工机械系统（MEMS）的包装组件。 这些封装组件中的MEMS器件基于硅载体上的硅MEMS器件，并且MEMS器件和硅支撑体与异物机械隔离。 外来材料构成差分热膨胀的潜力，这有害影响MEMS器件中的光学对准。 在优选实施例中，MEMS器件封装在全硅室中。 通过使用针式接触阵列来将MEMS器件的硅支撑衬底互连到下一个互连级别也有助于机械隔离。 使用引脚触点阵列也可以使MEMS器件容易拆卸以进行更换或维修。

    Interposer for recessed flip-chip package
    59.
    发明授权
    Interposer for recessed flip-chip package 有权
    插入式倒装芯片封装

    公开(公告)号：US06175158B1

    公开(公告)日：2001-01-16

    申请号：US09149803

    申请日：1998-09-08

    申请人： Yinon Degani ,  Thomas Dixon Dudderar ,  Robert Charles Frye ,  King Lien Tai

    发明人： Yinon Degani ,  Thomas Dixon Dudderar ,  Robert Charles Frye ,  King Lien Tai

    IPC分类号： H01L2348

    CPC分类号： H01L23/49833 ,  H01L23/49838 ,  H01L2224/16

    摘要： The specification describes a recessed chip IC package in which the IC chip is bonded to a silicon translator, and power and ground planes for IC power and ground interconnections are formed on separate interconnect levels of the translator. The multilevel interconnection capability of the translator allows crossovers, and allows power and ground pins from the IC chip to be both isolated from signal I/Os, and consolidated into fewer interconnections going to the next board level. The thermal mismatch between the silicon translator and conventional printed wiring board materials is addressed by using an interposer which is essentially a ball grid array of plated-through holes that transfers the interconnect pattern from the translator to the printed wiring board. The interposer may have a composition with a coefficient of thermal expansion (CTE) that lies between the CTE of silicon and the CTE of the board material. It may also be provided with holes or slots for additional stress relief.

    摘要翻译： 该说明书描述了一种嵌入式芯片IC封装，其中IC芯片被结合到硅转换器，并且用于IC电源和接地互连的电源和接地层形成在转换器的分开的互连级上。 转换器的多电平互联能力允许交叉，并允许IC芯片的电源和接地引脚与信号I / O隔离，并且整合到进入下一个电路板级别的较少互连。 硅转换器和常规印刷线路板材料之间的热失配通过使用插入器来解决，该插入器本质上是将互连图案从转换器传送到印刷线路板的电镀通孔的球栅阵列。 插入件可以具有位于硅的CTE和板材料的CTE之间的热膨胀系数（CTE）的组成。 它还可以设置有用于额外的应力释放的孔或槽。