公开(公告)号：US20100252315A1

公开(公告)日：2010-10-07

申请号：US12819840

申请日：2010-06-21

申请人： Chih-Chin Liao ,  Han-Shiao Chen ,  Chin-Tien Chiu ,  Ken Jian Ming Wang ,  Cheeman Yu ,  Hem Takiar

发明人： Chih-Chin Liao ,  Han-Shiao Chen ,  Chin-Tien Chiu ,  Ken Jian Ming Wang ,  Cheeman Yu ,  Hem Takiar

IPC分类号： H05K1/18

CPC分类号： H05K1/111 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K3/4038 ,  H05K3/429 ,  H05K2201/0195 ,  H05K2201/0338 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/10159 ,  H05K2201/10689 ,  Y02P70/611 ,  H01L2924/00

摘要： A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.

摘要翻译： 公开了具有共同的电连接器和接触焊盘区域的印刷电路板。 迹线和/或通孔所在接触焊盘区域可被蚀刻掉，以确保迹线，通孔和接触焊盘之间的电气隔离。

公开(公告)号：US20100044861A1

公开(公告)日：2010-02-25

申请号：US12194809

申请日：2008-08-20

申请人： Chin-Tien Chiu ,  Hem Takiar ,  Jia Qing Xi

发明人： Chin-Tien Chiu ,  Hem Takiar ,  Jia Qing Xi

IPC分类号： H01L23/49

CPC分类号： H01L25/0657 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06586 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/92247

摘要： A semiconductor device is disclosed including a support structure for supporting an edge of a semiconductor die that is not supported on the substrate or semiconductor die below. In embodiments, the semiconductor device may in general include a substrate having a plurality of contact pads, a first semiconductor die mounted on the substrate, and a second semiconductor die mounted on the first semiconductor die in an offset configuration so that an edge of the second semiconductor die overhangs the first semiconductor die. A support structure may be affixed to one or more of the contact pads beneath the overhanging edge to support the overhanging edge during a wire bonding process which exerts a downward force on the overhanging edge.

摘要翻译： 公开了一种半导体器件，其包括用于支撑半导体管芯的边缘的支撑结构，所述半导体管芯的边缘不在下面的基板或半导体管芯上。 在实施例中，半导体器件通常可以包括具有多个接触焊盘的衬底，安装在衬底上的第一半导体管芯和以偏移构造安装在第一半导体管芯上的第二半导体管芯，使得第二 半导体模具突出第一半导体管芯。 支撑结构可以固定到突出边缘下方的一个或多个接触垫，以在引线接合过程期间支撑悬垂边缘，其在突出边缘上施加向下的力。

公开(公告)号：US07538438B2

公开(公告)日：2009-05-26

申请号：US11171819

申请日：2005-06-30

申请人： Cheemen Yu ,  Ken Jian Ming Wang ,  Chin-Tien Chiu ,  Chih-Chin Liao ,  Han-Shiao Chen

发明人： Cheemen Yu ,  Ken Jian Ming Wang ,  Chin-Tien Chiu ,  Chih-Chin Liao ,  Han-Shiao Chen

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K1/0271 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0224 ,  H05K1/0253 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2201/09781 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A dummy circuit pattern is disclosed on a surface of a substrate for a semiconductor package. The dummy circuit pattern includes a plurality of straight line segments and a plurality of interrupt patterns to breakup one or more of the straight line segments. The interrupt patterns are provided so as to not electrically isolate areas of the dummy pattern, thus providing electrical continuity across the dummy circuit pattern.

摘要翻译： 在半导体封装用基板的表面上公开了虚设电路图案。 虚拟电路图案包括多条直线段和多条中断模式，以分解一条或多条直线段。 提供中断模式，以便不电隔离虚设图案的区域，从而在虚拟电路图案上提供电连续性。

公开(公告)号：US20090085231A1

公开(公告)日：2009-04-02

申请号：US11864125

申请日：2007-09-28

申请人： Chin-Tien Chiu ,  Chih Chiang Tung ,  Hem Takiar ,  Jack Chang Chien ,  Cheemen Yu

发明人： Chin-Tien Chiu ,  Chih Chiang Tung ,  Hem Takiar ,  Jack Chang Chien ,  Cheemen Yu

IPC分类号： H01L23/28 ,  H01L21/00

CPC分类号： H01L21/561 ,  H01L21/56 ,  H01L21/78 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, a panel of semiconductor packages may undergo a first cutting process which cuts the curvilinear edges of the packages. Next, the partially singulated panel of packages may undergo an abrasion process for smoothing the cut curvilinear edges. The abrasion process may occur by forcing abrasive particles over the jagged side edges of a semiconductor package as a result of a pressure differential above and below the semiconductor packages. Upon completion of the abrasive process, a second cutting process may be performed which cuts along straight edges and singulates the respective packages from the panel.

摘要翻译： 公开了一种形成具有平滑边缘的半导体封装的方法，以及由此形成的半导体封装。 在实施例中，在封装之后，半导体封装的面板可经历切割封装的曲线边缘的第一切割工艺。 接下来，部分分割的包装面板可以进行用于平滑切割的曲线边缘的磨损过程。 磨损过程可能是由于在半导体封装之上和之下的压力差导致磨料颗粒超过半导体封装的锯齿形侧边缘而发生的。 在研磨过程完成之后，可以进行第二切割处理，其沿直线边缘切割并从面板上分离各个包装。

公开(公告)号：US07485501B2

公开(公告)日：2009-02-03

申请号：US11265337

申请日：2005-11-02

申请人： Hem Takiar ,  Shrikar Bhagath ,  Chin-Tien Chiu

发明人： Hem Takiar ,  Shrikar Bhagath ,  Chin-Tien Chiu

IPC分类号： H01L21/44

CPC分类号： H01L21/561 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method is disclosed for forming semiconductor packages by a process of punching and cutting the packages from a panel of integrated circuits. During an encapsulation process for encapsulating the packages in a molding compound, portions of the panel may be left free of molding compound. Portions of the panel left free of molding compound may subsequently be punched from the panel. These punched areas may define chamfers, notches or a variety of other curvilinear, rectilinear or irregular shapes in the outer edges of the finished semiconductor package. After the panel is punched, the integrated circuits may be singulated. By punching areas from the panel, and then cutting along straight edges, a simple, effective and cost efficient method is disclosed for obtaining finished semiconductor packages of a variety of desired shapes.

摘要翻译： 公开了一种用于通过从集成电路板冲压和切割封装件的工艺来形成半导体封装件的方法。 在将包装封装在模塑料中的封装过程中，面板的部分可以不含模塑料。 随后可以从面板冲压出没有模塑料的板的部分。 这些冲压区域可以在完成的半导体封装的外边缘中限定倒角，凹口或各种其它曲线，直线形或不规则形状。 在打孔面板之后，可以将集成电路分割。 通过从面板冲压区域，然后沿直边切割，公开了一种简单，有效和成本有效的方法来获得各种期望形状的成品半导体封装。

公开(公告)号：US07355283B2

公开(公告)日：2008-04-08

申请号：US11106699

申请日：2005-04-14

申请人： Chin-Tien Chiu ,  Chih-Chin Liao ,  Ken Jian Ming Wang ,  Han-Shiao Chen ,  Cheemen Yu ,  Hem Takiar

发明人： Chin-Tien Chiu ,  Chih-Chin Liao ,  Ken Jian Ming Wang ,  Han-Shiao Chen ,  Cheemen Yu ,  Hem Takiar

IPC分类号： H01L23/48 ,  H01R9/00 ,  H05K1/11

CPC分类号： H01L23/562 ,  H01L21/56 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/48 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/528 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05015 ,  H01L2224/05023 ,  H01L2224/0605 ,  H01L2224/06151 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1438 ,  H01L2924/15313 ,  H01L2924/15323 ,  H01L2924/15333 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.

摘要翻译： 形成在半导体管芯封装中的衬底的第一侧上的刚性波形图案。 刚性波形图案与形成在基板的第二侧上的接触指状物对准并覆盖在其上。 当模制过程中衬底和裸片被封装时，刚性波形有效地减少了模具的变形和应力，从而大大减轻了模具开裂。

公开(公告)号：US20070284727A1

公开(公告)日：2007-12-13

申请号：US11449493

申请日：2006-06-08

申请人： Chih-Chin Liao ,  Han-Shiao Chen ,  Chin-Tien Chiu ,  Ken Jian Ming Wang ,  Cheemen Yu ,  Hem Takiar

发明人： Chih-Chin Liao ,  Han-Shiao Chen ,  Chin-Tien Chiu ,  Ken Jian Ming Wang ,  Cheemen Yu ,  Hem Takiar

IPC分类号： H01L23/12 ,  H01L23/48

CPC分类号： H05K1/111 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K3/4038 ,  H05K3/429 ,  H05K2201/0195 ,  H05K2201/0338 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/10159 ,  H05K2201/10689 ,  Y02P70/611 ,  H01L2924/00

摘要： A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.

摘要翻译： 公开了具有共同的电连接器和接触焊盘区域的印刷电路板。 迹线和/或通孔所在接触焊盘区域可被蚀刻掉，以确保迹线，通孔和接触焊盘之间的电气隔离。

公开(公告)号：US20070252254A1

公开(公告)日：2007-11-01

申请号：US11414526

申请日：2006-04-28

申请人： Chin-Tien Chiu ,  Hem Takiar ,  Hui Liu ,  Jiang hua Java Zhu ,  Jack Chang-Chien ,  Cheemen Yu

发明人： Chin-Tien Chiu ,  Hem Takiar ,  Hui Liu ,  Jiang hua Java Zhu ,  Jack Chang-Chien ,  Cheemen Yu

IPC分类号： H01L23/02

CPC分类号： H01L23/562 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H05K3/303 ,  H05K3/3421 ,  H05K3/3484 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  H05K2203/041 ,  H05K2203/043 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit, and a semiconductor die package formed therefrom, are disclosed including solder columns for adding structural support to the package during the fabrication process.

摘要翻译： 公开了集成电路和由其形成的半导体管芯封装，其包括用于在制造工艺期间向封装件添加结构支撑的焊料柱。

公开(公告)号：US20070210444A1

公开(公告)日：2007-09-13

申请号：US11373941

申请日：2006-03-13

申请人： Che-Jung Chang ,  Chin-Tien Chiu ,  Cheemen Yu ,  Hem Takiar ,  Jack Chien ,  Ning Liu

发明人： Che-Jung Chang ,  Chin-Tien Chiu ,  Cheemen Yu ,  Hem Takiar ,  Jack Chien ,  Ning Liu

IPC分类号： H01L23/12

CPC分类号： G06K19/077 ,  B29C45/14311 ,  B29C45/14647 ,  B29C2045/14327 ,  G06K19/07724 ,  G06K19/07732 ,  H01L23/10 ,  H01L23/544 ,  H01L24/48 ,  H01L24/97 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.

摘要翻译： 公开了一种闪存卡及其制造方法。 卡包括制造成接收单面或双面盖的半导体封装。 半导体封装的表面可以形成有孔，沟槽和/或戳记。 在形成孔，沟和/或标记之后，可以在注射成型工艺中将盖子附接到包装表面。 在注射成型过程中，熔融的塑料流入与半导体封装的表面互连的孔，沟槽和/或戳痕。 因此，当熔融塑料硬化时，孔，沟槽和/或戳痕确保盖保持牢固地附接到半导体封装。

公开(公告)号：US20070207568A1

公开(公告)日：2007-09-06

申请号：US11365211

申请日：2006-03-01

申请人： Hem Takiar ,  Chin-Tien Chiu ,  Chih Tung

发明人： Hem Takiar ,  Chin-Tien Chiu ,  Chih Tung

IPC分类号： H01L21/00

CPC分类号： H05K3/0052 ,  B23K26/1224 ,  B23K26/40 ,  B23K2103/50 ,  H01L21/481 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/544 ,  H01L24/48 ,  H01L24/97 ,  H01L25/16 ,  H01L25/50 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K3/0032 ,  H05K2203/0776 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A single-lid flash memory card and methods of manufacturing same are disclosed. The single-sided lid flash memory card may be formed from a semiconductor package having two or more tapered, stepped or otherwise shaped edges capable of securing a single-sided lid thereon. The taper, step or other shape may be fabricated by various methods, including during the molding step or during the singulation step. A semiconductor package having shaped edges may be enclosed within an external lid to form a finished flash memory card. The lid may be applied to a single side of the semiconductor package by various processes, including over-molding, or by pre-forming the lid with interior edges to match the exterior edges of the semiconductor package, and then sliding the lid over the package to form a tight fit therebetween. The shaped edge of the semiconductor package effectively holds the lid securely on the memory card without any adhesives and prevents the lid from dislodging from the semiconductor package.

摘要翻译： 公开了一种单盖式闪存卡及其制造方法。 单面盖闪存卡可以由具有两个或更多个锥形，阶梯形或其他形状的边缘的半导体封装形成，其能够在其上固定单面盖。 锥形，台阶或其他形状可以通过各种方法制造，包括在成型步骤期间或在分割步骤期间。 具有成形边缘的半导体封装可以封装在外部盖中以形成完成的闪存卡。 盖可以通过各种方法施加到半导体封装的单个侧面，包括过模制，或者通过用内部边缘预先形成盖子以匹配半导体封装的外部边缘，然后将盖子滑过封装 以在它们之间形成紧密配合。 半导体封装的成形边缘有效地将盖子牢固地保持在存储卡上而没有任何粘合剂，并且防止盖子从半导体封装件移出。