公开(公告)号：US08525353B2

公开(公告)日：2013-09-03

申请号：US13330316

申请日：2011-12-19

申请人： Eugene M. Chow ,  Eric J. Shrader ,  John S. Paschkewitz

发明人： Eugene M. Chow ,  Eric J. Shrader ,  John S. Paschkewitz

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/36 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/473 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06519 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/1161 ,  H01L2224/11618 ,  H01L2224/11825 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1318 ,  H01L2224/13184 ,  H01L2224/1319 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/136 ,  H01L2224/1401 ,  H01L2224/14051 ,  H01L2224/16225 ,  H01L2224/17519 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/81902 ,  H01L2224/81903 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01024 ,  H01L2924/0104 ,  H01L2924/014 ,  H01L2924/00

摘要： In a system for providing temporary or permanent connection of an integrated circuit die to a base substrate using electrical microsprings, a thermal element is provided that assists with cooling of the pad structure during use. The thermal element may be formed of the same material and my similar processes as the microsprings. The thermal element may be one or more block structures or one or more thermal microsprings. The thermal element may be provided with channels to contain and/or direct the flow of a thermal transfer fluid. Cooling of components associated with the pad structure (e.g., ICs) may be provided.

摘要翻译： 在使用电子微弹簧将集成电路管芯临时或永久连接到基底基板的系统中，提供了一种热元件，其有助于在使用期间对焊盘结构进行冷却。 热元件可以由与微弹簧相同的材料和我类似的方法形成。 热元件可以是一个或多个块结构或一个或多个热微型弹簧。 热元件可以设置有容纳和/或引导热传递流体的流动的通道。 可以提供与衬垫结构（例如，IC）相关联的部件的冷却。

公开(公告)号：US08487970B2

公开(公告)日：2013-07-16

申请号：US12245578

申请日：2008-10-03

申请人： Timothy D. Stowe ,  Eugene M. Chow ,  Ashish V. Pattekar ,  Eric Peeters

发明人： Timothy D. Stowe ,  Eugene M. Chow ,  Ashish V. Pattekar ,  Eric Peeters

IPC分类号： B41J2/315

CPC分类号： B41J2/475 ,  B41M1/00 ,  G03G15/228

摘要： An imaging system including an image receiving structure including a material layer having a tunable energy transfer characteristic; and an energy source to emit an energy beam at the material having the tunable energy transfer characteristic such that marking material is pattern-wise transferred to the image receiving structure.An imaging system includes an image receiving structure disposed to be in direct contact with marking material; and an energy source to emit a pattern-wise modulated energy beam at a region of the image receiving structure contacting the marking material to pattern-wise transfer marking material to the image receiving structure.

摘要翻译： 一种成像系统，包括：图像接收结构，包括具有可调能量转移特性的材料层; 以及在具有可调能量转移特性的材料上发射能量束的能量源，使得标记材料被图案化地转印到图像接收结构。 成像系统包括设置成与标记材料直接接触的图像接收结构; 以及能量源，以在图像接收结构的接触标记材料的区域处发射图案调制能量束，以将图案转印标记材料传送到图像接收结构。

公开(公告)号：US20120266464A1

公开(公告)日：2012-10-25

申请号：US13517591

申请日：2012-06-13

申请人： Eugene M. Chow ,  John E. Cunningham ,  James G. Mitchell ,  Ivan Shubin

发明人： Eugene M. Chow ,  John E. Cunningham ,  James G. Mitchell ,  Ivan Shubin

IPC分类号： H01K3/10

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0652 ,  H01L2221/68309 ,  H01L2221/68345 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/13 ,  H01L2224/13016 ,  H01L2224/131 ,  H01L2224/136 ,  H01L2224/16237 ,  H01L2224/81005 ,  H01L2224/81007 ,  H01L2224/81136 ,  H01L2224/81138 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/81901 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15156 ,  H01L2924/15787 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49895 ,  Y10T29/49947 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2924/00

摘要： A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors.

摘要翻译： 描述了包括多层插入板的多层插入板和多芯片模块（MCM）。 多层插入板的不同区域中的第一表面和第二表面具有相关联的不同厚度。 此外，第一微弹簧连接器和第二微弹簧连接器分别设置在第一表面和第二表面上。 在MCM中，多级插入板的给定的一个第一表面面向MCM中芯片阵列的第一层中的桥式芯片，使得设置在桥式芯片上的第一连接器机械地和电耦合到 第一个微型弹簧连接器。 类似地，多层插入板的给定的一个第二表面面向芯片阵列中的第二层中的岛状芯片，使得设置在岛状芯片上的第二连接器机械地和电耦合到第二微型弹簧 连接器

公开(公告)号：US08283566B2

公开(公告)日：2012-10-09

申请号：US12404294

申请日：2009-03-14

申请人： JengPing Lu ,  Eugene M. Chow

发明人： JengPing Lu ,  Eugene M. Chow

IPC分类号： H05K1/00

CPC分类号： H05K1/142 ,  H05K1/0286 ,  H05K1/14 ,  H05K3/368 ,  H05K2201/09963 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155

摘要： A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern. A circuit substrate, has a desired circuit pattern on a substrate, the substrate made up of at least two unit cells having conductive lines electrically connected together.

摘要翻译： 形成互连衬底的方法包括提供至少两个单元电池，布置单元电池以形成期望的电路图案，以及连接单元电池以形成具有所需电路图案的互连衬底。 电路基板在基板上具有期望的电路图案，该基板由具有电连接在一起的导电线的至少两个单电池构成。

公开(公告)号：US08181336B2

公开(公告)日：2012-05-22

申请号：US12754230

申请日：2010-04-05

申请人： Eugene M. Chow ,  Jeng Ping Lu ,  Meng H. Lean ,  David K. Biegelsen

发明人： Eugene M. Chow ,  Jeng Ping Lu ,  Meng H. Lean ,  David K. Biegelsen

IPC分类号： B23P19/00

CPC分类号： B81C99/002 ,  H01L24/95 ,  H01L2224/95085 ,  H01L2224/95145 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.

摘要翻译： 一种静电复印微组装系统，方法和装置，其包括适于接收多个微物体的分类单元。 微物体也可以在分选单元上分类和定向，然后转移到基底。 系统，方法和装置还可以包括用于检测分类单元中的至少一个微物体中的错误的装置和用于防止不适当的微物体被转移到基板的保护装置。 系统，方法和装置还可以包括有组织的微物体馈送器组件，其可以将多个微物体中的至少一个传送到分类单元或直接传送到衬底。

公开(公告)号：US20120068331A1

公开(公告)日：2012-03-22

申请号：US12887775

申请日：2010-09-22

申请人： Eugene M. Chow ,  Eric Peeters

发明人： Eugene M. Chow ,  Eric Peeters

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H05K3/32 ,  G01R1/06727 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3157 ,  H01L23/48 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L2221/68331 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/1161 ,  H01L2224/1182 ,  H01L2224/1191 ,  H01L2224/13008 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2224/1355 ,  H01L2224/13564 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/819 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49147 ,  H01L2224/13099 ,  H01L2924/00

摘要： At least one microspring has applied thereover a laminate structure to provide: mechanical protection during handling and wafer processing, a spring spacer layer, strengthening of the anchor between spring and substrate, provision of a gap stop during spring deflection, and moisture and contaminant protection. A fully-formed laminate structure may be applied over the microspring structure or a partly-formed laminate structure may be applied over the microspring structure then cured or hardened. The tip portion of the microspring may protrude through the laminate structure and be exposed for contact or may be buried within the contact structure. The laminate structure may remain in place in the final microspring structure or be removed in whole or in part. The laminate structure may be photolithographically patternable material, patterned and etched to remove some or all of the structure, forming for example additional structural elements such as a gap stop for the microspring.

摘要翻译： 至少一个微小弹簧已经施加在层压结构之上，以提供：在处理和晶片加工期间的机械保护，弹簧间隔层，弹簧和基底之间的锚固件的加强，在弹簧偏转期间提供间隙止挡，以及水分和污染物保护。 可以将完全成型的层压结构施加在微小弹簧结构上，或者可以将部分形成的层压结构施加到微弹体结构上，然后固化或硬化。 微小弹簧的尖端部分可以突出穿过层压结构并暴露以进行接触或者可以埋在接触结构内。 层压结构可以保留在最终微型结构中的适当位置或全部或部分去除。 层压结构可以是光刻图案化的材料，图案化和蚀刻以除去部分或全部结构，形成例如附加的结构元件，例如用于微弹簧的间隙止动件。

公开(公告)号：US08119315B1

公开(公告)日：2012-02-21

申请号：US12854962

申请日：2010-08-12

申请人： Matthew A. Heuft ,  Eugene M. Chow ,  Adrien P. Cote ,  Nan-Xing Hu

发明人： Matthew A. Heuft ,  Eugene M. Chow ,  Adrien P. Cote ,  Nan-Xing Hu

IPC分类号： G03G5/00

CPC分类号： G03G15/10 ,  G03G5/0589 ,  G03G5/0592 ,  G03G5/0596 ,  G03G5/071 ,  G03G5/075 ,  G03G5/076 ,  G03G5/14786 ,  G03G5/14791 ,  G03G5/14795 ,  G03G15/75

摘要： An imaging member for ink-based digital printing having an outermost layer including a structured organic film (SOF) having a plurality of segments and a plurality of linkers arranged as a covalent organic framework, wherein the structured organic film may be multi-segment thick.

摘要翻译： 一种用于油墨数字印刷的成像构件，其具有包括具有多个段的结构化有机膜（SOF）的最外层和布置为共价有机骨架的多个接头，其中所述结构化有机膜可以是多段厚度。

公开(公告)号：US20120021170A1

公开(公告)日：2012-01-26

申请号：US13248660

申请日：2011-09-29

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, JR.

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, JR.

IPC分类号： B32B3/22

CPC分类号： B81C1/00666 ,  G01R1/06755 ,  G01R1/07357 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/4092 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T428/13 ,  Y10T428/1317 ,  Y10T428/24174 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

摘要翻译： 微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。 封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材​​料形成。 封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

公开(公告)号：US08082660B2

公开(公告)日：2011-12-27

申请号：US11959030

申请日：2007-12-18

申请人： Jeng Ping Lu ,  Eugene M. Chow

发明人： Jeng Ping Lu ,  Eugene M. Chow

IPC分类号： B23P19/00

CPC分类号： H01L25/50 ,  H01L21/67271 ,  H01L21/67282 ,  H01L21/67294 ,  H01L24/95 ,  H01L2224/95085 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53004 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53278 ,  H01L2924/00

摘要： Xerographic micro-assembler systems and methods are disclosed. The systems and methods involve manipulating charge-encoded micro-objects. The charge encoding identifies each micro-object and specifies its orientation for sorting. The micro-objects are sorted in a sorting unit so that they have defined positions and orientations. The sorting unit has the capability of electrostatically and magnetically manipulating the micro-objects based on their select charge encoding. The sorted micro-objects are provided to an image transfer unit. The image transfer unit is adapted to receive the sorted micro-objects, maintain them in their sorted order and orientation, and deliver them to a substrate. Maintaining the sorted order as the micro-objects are delivered to the substrate may be accomplished through the use of an electrostatic image, as is done in xerography. The substrate with the micro-objects is further processed to interconnect the micro-objects—through electrical wiring, for example—to form the final micro-assembly.

摘要翻译： 公开了静电印刷微组装系统和方法。 系统和方法涉及操纵电荷编码的微物体。 电荷编码识别每个微物体并指定其排列方向。 微物体在分类单元中排序，使得它们具有定义的位置和取向。 分选单元具有基于其选择电荷编码的静电和磁性操纵微物体的能力。 分类的微物体被提供给图像传送单元。 图像传送单元适于接收分类的微物体，将它们保持在排列顺序和方位，并将其传送到基底。 将排序的顺序作为微物体传送到基底可以通过使用静电图像来实现，如在静电复印中所做的那样。 具有微物体的衬底被进一步处理以使例如微通孔电线互连，以形成最终的微组件。

公开(公告)号：US07943504B2

公开(公告)日：2011-05-17

申请号：US12256060

申请日：2008-10-22

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  David K. Fork ,  Eugene M. Chow

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  David K. Fork ,  Eugene M. Chow

IPC分类号： H01L21/4763

CPC分类号： G01R1/06716 ,  G01R3/00 ,  Y10T29/49609

摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.

摘要翻译： 根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量 导致剥离力高于自释放层和应力金属层之间的粘附力。 此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中， 在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。