公开(公告)号：US06174406B1

公开(公告)日：2001-01-16

申请号：US09057630

申请日：1998-04-09

申请人： Michael A. Gaynes ,  Ramesh R. Kodnani

发明人： Michael A. Gaynes ,  Ramesh R. Kodnani

IPC分类号： B32B3100

CPC分类号： F16B11/006 ,  B32B37/0007 ,  B32B37/1292 ,  B32B2315/08 ,  Y10T428/1059 ,  Y10T428/24802 ,  Y10T428/24826 ,  Y10T428/24843 ,  Y10T428/2852 ,  Y10T428/2891 ,  Y10T428/2896

摘要： Two surfaces are adhesively bonded together by providing on one of the surfaces a central, single point adhesive contact deposit and providing on one of the surfaces, adhesive extending from a central point deposit in a spoke-like array diagonally across substantially the entire surface. Also provided is the article obtained by the above method as well as the assembly used for bonding the two surfaces together. The surfaces are brought together, one on top of the other, with the adhesive located between the surfaces to cause the adhesive to spread out and cover the surfaces to thereby bond them together.

摘要翻译： 两个表面通过在其中一个表面上提供中心的单点粘合剂接触沉积物并在其中一个表面上提供粘合剂粘合在一起，从中央点沉积物以一个辐射状阵列沿着对角线横跨基本上整个表面延伸的粘合剂。 还提供了通过上述方法获得的制品以及用于将两个表面粘合在一起的组装。 这些表面一个在另一个之上，粘合剂位于表面之间，以使粘合剂展开并覆盖表面，从而将它们粘合在一起。

公开(公告)号：US08651359B2

公开(公告)日：2014-02-18

申请号：US12861017

申请日：2010-08-23

申请人： Michael A. Gaynes ,  Jae-Woong Nah

发明人： Michael A. Gaynes ,  Jae-Woong Nah

IPC分类号： B23K1/00

CPC分类号： B23K1/0016 ,  B23K3/047 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/75303 ,  H01L2224/75315 ,  H01L2224/75745 ,  H01L2224/81815 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/15787 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512

摘要： A low thermal conductivity material layer covers a peripheral portion of the bottom surface of the conductive plate of a chip bonder head. The center portion of the conductive plate is exposed or covered with another conductive plate laterally surrounded by the low thermal conductivity material layer. During bonding, the chip bonder head holds a first substrate upside down and heats the first substrate through the conductive plate. Heating of a fillet, i.e., the laterally extruding portion, of a pre-applied underfill material is reduced because the temperature at the exposed surfaces of the low thermal conductivity material layer is lower than the temperature at the bottom surface of the conductive plate. The longer curing time and the more uniform shape of the fillet in the bonded structure enhance the structural reliability of the bonded substrates.

摘要翻译： 低导热性材料层覆盖芯片接合头的导电板的底面的周边部分。 导电板的中心部分被另一导电板暴露或覆盖，导电板横向被低导热材料层包围。 在接合期间，芯片接合头将第一衬底倒置并且通过导电板加热第一衬底。 由于低导热材料层的暴露表面的温度低于导电板的底表面处的温度，加热了预先施加的底部填充材料的圆角，即侧向挤压部分。 接合结构中固化时间越长，圆角形状越均匀，提高了粘合基材的结构可靠性。

公开(公告)号：US20130062757A1

公开(公告)日：2013-03-14

申请号：US13231594

申请日：2011-09-13

申请人： Claudius Feger ,  Michael A. Gaynes ,  Jae-Woong Nah ,  Da-Yuan Shih

发明人： Claudius Feger ,  Michael A. Gaynes ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC分类号： H01L23/498 ,  H01L21/50

CPC分类号： H01L24/81 ,  H01L21/463 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L24/92 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/1605 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/2741 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83

摘要： A preassembly semiconductor device comprises substrate soldering structures extending toward chip soldering structures for forming solder connections with the chip soldering structures, i.e., the chip and the substrate are in preassembly positions relative to one another. The height of the substrate soldering structures is greater than the height of the chip soldering structures. A pre-applied underfill is contiguous with the substrate and is sufficiently thick so as to extend substantially no further than the full height of the substrate soldering structures. In another embodiment the height of the chip soldering structures is greater than the height of the substrate soldering structures and the pre-applied underfill is contiguous with the semiconductor chip and sufficiently thick so as to extend substantially no further than the full height of the chip soldering structures. A process comprises manufacturing semiconductor assemblies from these devices by soldering the semiconductor chip and the substrate to one another.

摘要翻译： 预组装半导体器件包括朝向芯片焊接结构延伸的衬底焊接结构，用于形成与芯片焊接结构的焊接连接，即，芯片和衬底相对于彼此处于预组装位置。 基板焊接结构的高度大于芯片焊接结构的高度。 预先施加的底部填充物与基底相邻并且足够厚以便基本上不超过基底焊接结构的全高度延伸。 在另一个实施例中，芯片焊接结构的高度大于衬底焊接结构的高度，并且预先施加的底部填充物与半导体芯片邻接并且足够厚以便基本上不超过芯片焊接的全部高度 结构。 一种方法包括通过将半导体芯片和衬底相互焊接来从这些器件制造半导体组件。

公开(公告)号：US08268389B2

公开(公告)日：2012-09-18

申请号：US12684174

申请日：2010-01-08

申请人： Evan G. Colgan ,  Paul W. Coteus ,  Michael A. Gaynes ,  Kenneth C. Marston ,  Steven P. Ostrander

发明人： Evan G. Colgan ,  Paul W. Coteus ,  Michael A. Gaynes ,  Kenneth C. Marston ,  Steven P. Ostrander

IPC分类号： B05D5/10

CPC分类号： B32B37/1207 ,  B32B37/26 ,  B32B2037/243 ,  B32B2037/268 ,  B32B2309/02 ,  B32B2311/12 ,  B32B2311/24 ,  B32B2457/08 ,  Y10T156/11 ,  Y10T156/1195 ,  Y10T428/2804 ,  Y10T428/2813 ,  Y10T428/2861

摘要： Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.

摘要翻译： 预制的可固化热界面粘合剂便于在其热界面处容易且可重复地分离和保留电子部件，以及用于通过使用这种粘合剂在组件的热界面处实现上述可重复分离和重新化的方法。

公开(公告)号：US20110292621A1

公开(公告)日：2011-12-01

申请号：US13110175

申请日：2011-05-18

申请人： Martin Beaumier ,  Alexandre Blander ,  Pascale Gagnon ,  Michael A. Gaynes ,  Eric Giguere ,  Eric Salvas ,  Luc Tousignant

发明人： Martin Beaumier ,  Alexandre Blander ,  Pascale Gagnon ,  Michael A. Gaynes ,  Eric Giguere ,  Eric Salvas ,  Luc Tousignant

IPC分类号： H05K1/00 ,  H05K13/00

CPC分类号： H05K9/0009 ,  H01L23/055 ,  H01L23/10 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16251 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2224/0401

摘要： An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.

摘要翻译： 用于在微电子部件级降低EMI的装置包括具有集成在其中的接地导体的基板。 诸如集成电路的微电子部件安装到基板。 导电盖安装到基板上，从而与基板形成物理界面。 导电盖基本覆盖微电子部件。 提供导电链路以在物理接口处在导电盖和接地导体之间产生电连接。

公开(公告)号：US08037594B2

公开(公告)日：2011-10-18

申请号：US12116655

申请日：2008-05-07

申请人： Jeffrey T. Coffin ,  Michael A. Gaynes ,  David L. Questad ,  Kamal K. Sikka ,  Hilton T. Toy ,  Jamil A. Wakil

发明人： Jeffrey T. Coffin ,  Michael A. Gaynes ,  David L. Questad ,  Kamal K. Sikka ,  Hilton T. Toy ,  Jamil A. Wakil

IPC分类号： H05B3/00

CPC分类号： H01L23/34 ,  H01L23/3735 ,  H01L23/42 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/3511 ,  Y10T29/49004 ,  Y10T29/49083 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/4935

摘要： Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.

摘要翻译： 披露的是导热板。 每个板被构造成使得当板结合到发热结构并经受使得发热结构的预定温度范围内的温度时，板和发热结构之间可以实现均匀的粘合剂填充的间隙 经。 另外，本公开提供了形成板并将板结合到发热结构的相关方法。 在一个实施例中，板是弯曲的并被建模以使发热结构的弯曲表面在预定温度范围内匹配。 在另一个实施例中，板是多层导电结构，其被配置为在与热产生结构相关的热负荷下经历相同的翘曲。 因此，当板与发热结构接合时，能够在任何温度下实现和保持均匀的粘合剂填充间隙。

公开(公告)号：US08008122B1

公开(公告)日：2011-08-30

申请号：US12886871

申请日：2010-09-21

申请人： Michael A. Gaynes ,  Jae-Woong Nah ,  Satoru Katsurayama

发明人： Michael A. Gaynes ,  Jae-Woong Nah ,  Satoru Katsurayama

IPC分类号： H01L21/44

CPC分类号： H01L24/81 ,  H01L24/75 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81048 ,  H01L2224/81148 ,  H01L2224/81191 ,  H01L2224/81204 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83048 ,  H01L2224/83093 ,  H01L2224/83097 ,  H01L2224/83148 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83211 ,  H01L2224/838 ,  H01L2224/83862 ,  H01L2224/83948 ,  H01L2224/83986 ,  H01L2224/9205 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： To prevent formation of entrapped underfill material between solder balls and bonding bumps, fast temperature ramping is employed during a chi assembly after application of an underfill material prior to bonding. Voids formed within the underfill material are subsequently removed by curing the underfill material in a pressurized environment. Temperature cycling on the underfill material is limited during the bonding process in order to maintain viscosity of the underfill material prior to the cure process in the pressurized environment. Further, the underfill material is subjected to the pressurized environment until the cure process is complete to prevent re-formation of voids. The cure process can be a constant temperature or a multi-temperature process including temperature ramping. Further, the cure process can be a constant pressure process or a pressure cycling process that accelerates removal of the voids.

摘要翻译： 为了防止在焊球和焊接凸块之间形成捕获的底部填充材料，在粘合之前施加底部填充材料之后的i组装期间采用快速温度斜坡化。 然后通过在加压环境中固化底部填充材料，在底部填充材料内形成的空隙。 底部填充材料的温度循环在粘合过程中受到限制，以便在加压环境中的固化过程之前保持底部填充材料的粘度。 此外，底部填充材料经受加压环境直到固化过程完成以防止空隙重新形成。 固化过程可以是包括温度斜坡在内的恒定温度或多温度过程。 此外，固化过程可以是恒定压力过程或加速空隙去除的压力循环过程。

公开(公告)号：US20090045501A1

公开(公告)日：2009-02-19

申请号：US11838474

申请日：2007-08-14

申请人： Michael A. Gaynes ,  David L. Questad ,  Jamil A. Wakil

发明人： Michael A. Gaynes ,  David L. Questad ,  Jamil A. Wakil

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/50 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/562 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/15798 ,  H01L2924/19106 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00

摘要： Chip packages and a related method are disclosed that provide a structure on a side opposite a chip on a carrier of a chip package to substantially match a stiffness of the chip. In one embodiment, a chip package includes a chip coupled to a carrier; and a structure on a side opposite the chip on the carrier, the structure having a first stiffness to substantially match a second stiffness of the chip.

摘要翻译： 公开了芯片封装和相关方法，其提供在芯片封装的载体上与芯片相对的一侧上的结构，以基本上匹配芯片的刚度。 在一个实施例中，芯片封装包括耦合到载体的芯片; 以及与所述载体上的所述芯片相对的一侧上的结构，所述结构具有基本匹配所述芯片的第二刚度的第一刚度。

公开(公告)号：US07252515B2

公开(公告)日：2007-08-07

申请号：US11650748

申请日：2007-01-08

申请人： William L. Brodsky ,  William E. Buchler, Jr. ,  Benson Chan ,  Michael A. Gaynes

发明人： William L. Brodsky ,  William E. Buchler, Jr. ,  Benson Chan ,  Michael A. Gaynes

IPC分类号： H01R4/58

CPC分类号： H01R13/2414 ,  H01R12/714 ,  H01R13/2407 ,  H05K7/1069

摘要： A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.

公开(公告)号：US07064013B2

公开(公告)日：2006-06-20

申请号：US10883548

申请日：2004-07-01

申请人： Stephen Leslie Buchwalter ,  Hung Manh Dang ,  Michael A. Gaynes ,  Konstantinos I. Papathomas

发明人： Stephen Leslie Buchwalter ,  Hung Manh Dang ,  Michael A. Gaynes ,  Konstantinos I. Papathomas

IPC分类号： H01L21/44

CPC分类号： H01L23/3142 ,  H01L23/4334 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/0401

摘要： An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a metallic plate, and an adhesion promoter layer on the mineral layer. The metallic plate includes a metallic substance that includes a pure metal with or without a metal coating. The metallic substance may include such substances as stainless steel, aluminum, titanium, copper, copper coated with nickel, and copper coated with chrome. The mineral layer includes a chemical compound derived from a mineral; e.g., silicon dioxide (SiO2) derived from quartz. Such chemical compounds may include such substances as silicon dioxide, silicon nitride, and silicon carbide. The chemical compound may exist in either crystalline or amorphous form. The adhesion promoter may include such chemical substances as silanes, titanates, zirconates, and aluminates.

摘要翻译： 可与电子组件（例如芯片）结合的电子结构。 电子结构可以通过使用结构环氧树脂粘合剂连接到诸如芯片的电子组件。 电子结构包括金属板上的矿物层和矿物层上的粘附促进剂层。 金属板包括金属物质，其包括具有或不具有金属涂层的纯金属。 金属物质可以包括诸如不锈钢，铝，钛，铜，镀有镍的铜和涂有铬的铜等物质。 矿物层包括衍生自矿物的化合物; 例如来自石英的二氧化硅（SiO 2）。 这样的化合物可以包括二氧化硅，氮化硅和碳化硅等物质。 化合物可以以结晶或无定形形式存在。 粘合促进剂可以包括诸如硅烷，钛酸盐，锆酸盐和铝酸盐的化学物质。