公开(公告)号：US20150224978A1

公开(公告)日：2015-08-13

申请号：US14416933

申请日：2012-07-26

申请人： Satoshi Shimizu

发明人： Satoshi Shimizu

IPC分类号： B60W10/184 ,  B60T8/171 ,  B60T8/58 ,  B60W40/13 ,  B60T8/175 ,  B60W10/08 ,  B60W40/076 ,  B60W40/105 ,  B60T8/172 ,  B60T8/1761

CPC分类号： B60W10/184 ,  B60T8/171 ,  B60T8/172 ,  B60T8/175 ,  B60T8/1761 ,  B60T8/58 ,  B60T2240/07 ,  B60T2250/04 ,  B60W10/08 ,  B60W40/076 ,  B60W40/105 ,  B60W40/13 ,  B60W2520/10 ,  B60W2520/26 ,  B60W2520/28 ,  B60W2550/12 ,  B60W2550/142 ,  B60W2550/148

摘要： A braking/driving force control device includes a braking/driving force control unit configured to control a braking/driving force of a vehicle based on a wheel speed; and wheel speed correcting unit configured to compute a wheel speed correction amount for matching detected speeds of all wheels to a predetermined speed for every wheel and corrects the detected wheel speed of the wheel with the wheel speed correction amount of the wheel, or compute a wheel diameter correction amount for matching detected wheel diameters of all wheels to a predetermined wheel diameter for every wheel and corrects the detected wheel speed of the wheel using the wheel diameter correction amount of the wheel, wherein the wheel speed correcting unit computes a correction value of the wheel speed correction amount or a correction value of the wheel diameter correction amount.

摘要翻译： 制动/驱动力控制装置包括：制动/驱动力控制单元，被配置为基于车轮速度来控制车辆的制动/驱动力; 以及车轮速度校正单元，其被配置为计算用于将所有车轮的检测速度匹配到每个车轮的预定速度的车轮速度校正量，并且用车轮的车轮速度校正量校正车轮的检测到的车轮速度，或者计算车轮 用于将所有车轮的检测到的车轮直径与每个车轮的预定车轮直径相匹配的直径校正量，并且使用车轮的车轮直径校正量校正车轮的检测到的车轮速度，其中车轮速度校正单元计算修正值 车轮速度校正量或车轮直径校正量的校正值。

公开(公告)号：US08810317B2

公开(公告)日：2014-08-19

申请号：US13547431

申请日：2012-07-12

申请人： Ryo Kadoi ,  Norio Hayashi ,  Satoshi Shimizu ,  Akio Yamamoto

发明人： Ryo Kadoi ,  Norio Hayashi ,  Satoshi Shimizu ,  Akio Yamamoto

IPC分类号： H03G3/30

CPC分类号： H03F1/0261 ,  H03F1/0211 ,  H03F3/193 ,  H03F3/195 ,  H03F2200/18 ,  H03F2200/465 ,  H03G3/3042

摘要： A high frequency circuit and a high frequency module are provided, in which the accuracy of compensation operation is improved in compensating by digital control. The amplification gain of an amplification element of an amplifier unit is controlled by a bias current of a bias control unit. A process monitoring circuit of a calibration circuit includes a first and a second element characteristic detector and a voltage comparator. The detectors convert the current of replica elements into a first and a second detection voltage. The voltage comparator compares a first and a second detection voltage and supplies a comparison output signal to a search control unit. Responding to the comparison output signal of the comparator and a clock signal of a clock generating unit, the controller generates a multi-bit digital compensation value according to a predetermined search algorithm, and the bias control unit of the second detector is feedback-controlled.

摘要翻译： 提供了一种高频电路和高频模块，其中通过数字控制来补偿补偿操作的精度。 放大器单元的放大元件的放大增益由偏置控制单元的偏置电流控制。 校准电路的过程监控电路包括第一和第二元件特征检测器和电压比较器。 检测器将复制元件的电流转换成第一和第二检测电压。 电压比较器比较第一和第二检测电压，并将比较输出信号提供给搜索控制单元。 响应于比较器的比较输出信号和时钟产生单元的时钟信号，控制器根据预定的搜索算法生成多位数字补偿值，并且反馈控制第二检测器的偏置控制单元。

公开(公告)号：US20140142831A1

公开(公告)日：2014-05-22

申请号：US14232156

申请日：2012-07-13

申请人： Satoshi Shimizu

发明人： Satoshi Shimizu

IPC分类号： B60T8/24 ,  B60T8/1764 ,  B60T8/26

CPC分类号： B60T8/246 ,  B60T8/1764 ,  B60T8/26

摘要： In a braking force control system for a vehicle having a braking system capable of controlling braking force of each of right and left front wheels and right and left rear wheels independently of one another, when anti-skid control starts being performed on one of the front wheels while the vehicle is running on a road having different coefficients of friction on the left side and right side thereof, increase of the braking force of the other front wheel laterally opposite to the above-indicated one front wheel is suppressed, and increase of the braking force of at least one of the right and left rear wheels is suppressed.

摘要翻译： 在具有制动系统的制动力控制系统中，该制动系统能够彼此独立地控制左前后轮和右前轮和左后轮中的每一个的制动力，当在前方之一上进行防滑控制时 在车辆在其左侧和右侧具有不同摩擦系数的道路上行驶时的车轮，抑制了与上述一个前轮横向相反的另一前轮的制动力的增加， 左右后轮中的至少一个的制动力被抑制。

公开(公告)号：US08637892B2

公开(公告)日：2014-01-28

申请号：US12886890

申请日：2010-09-21

申请人： Hidenori Egoshi ,  Hiroaki Oshio ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto ,  Satoshi Shimizu

发明人： Hidenori Egoshi ,  Hiroaki Oshio ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto ,  Satoshi Shimizu

IPC分类号： H01L33/00

CPC分类号： H01L24/97 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/4554

摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，LED芯片包括至少包含铟，镓和铝的半导体层，LED芯片的一个端子连接到第一引线框架，LED的另一个端子 芯片连接到第二引线框架。 树脂体覆盖LED芯片，并且整个上表面，下表面的一部分和第一引线框架和第二引线框架中的每一个的边缘表面的一部分，并且树脂体暴露下表面的其余部分 边缘表面。 并且，树脂体的外观是LED封装的外观的一部分。

公开(公告)号：US08487418B2

公开(公告)日：2013-07-16

申请号：US12886124

申请日：2010-09-20

申请人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

发明人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

IPC分类号： H01L23/495

CPC分类号： H01L33/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.

摘要翻译： 根据一个实施例，LED封装包括（2×n）（n为2以上的整数）引线框，n个LED芯片和树脂体。 （2×n）个引线框架彼此分开布置。 n个LED芯片设置在引线框架的上方。 n个LED芯片中的每一个具有连接到（2×n）个引线框架的n个引线框架中的每一个的一个端子，以及连接到除了n个引线框架之外的（2×n）个引线框架的每个引线框架的另一个端子。 树脂体覆盖（2×n）引线框和n个LED芯片。

公开(公告)号：US08378347B2

公开(公告)日：2013-02-19

申请号：US13289587

申请日：2011-11-04

申请人： Satoshi Shimizu ,  Kazuhisa Iwashita ,  Teruo Takeguchi ,  Tetsuro Komatsu ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Naoya Ushiyama ,  Kazuhiro Inoue ,  Gen Watari

发明人： Satoshi Shimizu ,  Kazuhisa Iwashita ,  Teruo Takeguchi ,  Tetsuro Komatsu ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Naoya Ushiyama ,  Kazuhiro Inoue ,  Gen Watari

IPC分类号： H01L25/075 ,  H01L33/62 ,  H01L21/329 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L33/50

CPC分类号： H01L33/62 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L2224/26175 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01063 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01068 ,  H01L2924/0107 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2933/0066 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2224/4554

摘要： According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other.

摘要翻译： 根据一个实施例，LED封装包括彼此间隔开的第一和第二引线框架和LED芯片。 第一引线框架和第二引线框架中的每一个包括基部和从基部延伸的多个延伸部。 基部的下表面的一部分，基部的侧表面，延伸部的下表面和延伸部的侧表面被树脂覆盖。 基部的下表面的剩余部分和延伸部分的末端表面不被树脂覆盖。 基部的下表面的一部分包括第一引线框架的第一边缘和第二引线框架的第二边缘。 第一边缘和第二边缘彼此相对。

公开(公告)号：US20120273826A1

公开(公告)日：2012-11-01

申请号：US13234792

申请日：2011-09-16

申请人： Mami Yamamoto ,  Kazuhiro Inoue ,  Satoshi Shimizu ,  Hidenori Egoshi ,  Yasunori Nagahata

发明人： Mami Yamamoto ,  Kazuhiro Inoue ,  Satoshi Shimizu ,  Hidenori Egoshi ,  Yasunori Nagahata

IPC分类号： H01L33/36 ,  H01L33/52

CPC分类号： H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L33/54 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/78301 ,  H01L2224/85186 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： According to one embodiment, an LED package includes a first leadframe and a second leadframe mutually-separated, an LED chip and a resin body. The LED chip is provided above the first and second leadframes. One terminal of the LED chip is connected to the first leadframe. One other terminal is connected to the second leadframe. The resin body covers an entire upper surface, a portion of a lower surface, and a portion of an end surface of each of the first and second leadframes. The resin body covers the LED chip. Remaining portions of the lower surface and the end surface of each of the first and second leadframes are exposed on the resin body. First and second recesses are made between the remaining portions of the first and second leadframes. An inner surface of each of the first and second recesses is not covered with the resin body.

摘要翻译： 根据一个实施例，LED封装包括相互分离的第一引线框架和第二引线框架，LED芯片和树脂体。 LED芯片设置在第一引线框架和第二引线框架之上。 LED芯片的一个端子连接到第一引线框架。 另一个终端连接到第二引线框。 树脂体覆盖整个上表面，下表面的一部分和第一引线框和第二引线框中的每一个的端面的一部分。 树脂体覆盖LED芯片。 第一引线框架和第二引线框架的每个的下表面和端表面的剩余部分暴露在树脂体上。 在第一引线框架和第二引线框架的其余部分之间形成第一和第二凹槽。 第一和第二凹部中的每一个的内表面不被树脂体覆盖。

公开(公告)号：US20120132938A1

公开(公告)日：2012-05-31

申请号：US13052255

申请日：2011-03-21

申请人： Tetsuro Komatsu ,  Satoshi Shimizu

发明人： Tetsuro Komatsu ,  Satoshi Shimizu

IPC分类号： H01L27/15

CPC分类号： H01L25/167 ,  H01L24/73 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： According to one embodiment, an LED package includes a first, a second, and a third lead frame separated from one another. The LED package includes a first LED chip of a top surface terminal type having one terminal connected to the second lead frame, and having one other terminal connected to the third lead frame, the first LED chip is mounted on the first lead frame. The LED package includes a first protection chip of a top surface terminal type having one terminal connected to the second lead frame, and having one other terminal connected to the third lead frame, the first protection chip is mounted on the first lead frame. And, a resin body covers a part of the first, second and third lead frames, the first LED chip, and the first protection chip, An outer shape of the resin body forms an outer shape of the LED package.

摘要翻译： 根据一个实施例，LED封装包括彼此分离的第一，第二和第三引线框架。 LED封装包括具有连接到第二引线框架的一个端子并且具有连接到第三引线框架的另一个端子的顶表面端子类型的第一LED芯片，第一LED芯片安装在第一引线框架上。 LED封装包括顶表面端子类型的第一保护芯片，其一端连接到第二引线框架，并且另一个端子连接到第三引线框架，第一保护芯片安装在第一引线框架上。 并且，树脂体覆盖第一，第二和第三引线框架的一部分，第一LED芯片和第一保护芯片。树脂体的外形形成LED封装的外形。

公开(公告)号：US20120028920A1

公开(公告)日：2012-02-02

申请号：US13270544

申请日：2011-10-11

申请人： Hiroshi YAMASHITA ,  Hideaki Kuroda ,  Nobuaki Ito ,  Shin Miyamura ,  Kunio Oshima ,  Jun Matsubara ,  Haruka Takahashi ,  Tae Fukushima ,  Satoshi Shimizu ,  Kazumi Kondo ,  Yohji Sakurai ,  Takeshi Kuroda ,  Shinichi Taira ,  Motohiro Itotani ,  Tatsuyoshi Tanaka

发明人： Hiroshi YAMASHITA ,  Hideaki Kuroda ,  Nobuaki Ito ,  Shin Miyamura ,  Kunio Oshima ,  Jun Matsubara ,  Haruka Takahashi ,  Tae Fukushima ,  Satoshi Shimizu ,  Kazumi Kondo ,  Yohji Sakurai ,  Takeshi Kuroda ,  Shinichi Taira ,  Motohiro Itotani ,  Tatsuyoshi Tanaka

IPC分类号： A61K31/496 ,  C07D409/10 ,  C07D417/14 ,  C07D413/14 ,  A61K31/538 ,  A61K31/517 ,  A61K31/506 ,  A61K31/55 ,  A61K31/5415 ,  A61K31/553 ,  C07F7/18 ,  A61K31/695 ,  A61P25/18 ,  A61P25/24 ,  A61P25/00 ,  C07D409/14

CPC分类号： C07D409/12 ,  C07D333/54 ,  C07D407/12 ,  C07D409/14 ,  C07D413/12 ,  C07D417/12 ,  C07D487/08 ,  C07D491/113

摘要： A heterocyclic compound or a salt thereof represented by the formula (1): where R2 represents a hydrogen atom or a lower alkyl group; A represents a lower alkylene group or lower alkenylene group; and R1 represents an aromatic group or a heterocyclic group. The compound of the present invention has a wide treatment spectrum for mental disorders including central nervous system disorders, no side effects and high safety.

摘要翻译： 由式（1）表示的杂环化合物或其盐：其中R 2表示氢原子或低级烷基; A表示低级亚烷基或低级亚烯基; R1表示芳基或杂环基。 本发明的化合物具有广泛的精神障碍治疗范围，包括中枢神经系统疾病，无副作用和高安全性。

公开(公告)号：US20110281819A1

公开(公告)日：2011-11-17

申请号：US13143129

申请日：2010-02-01

申请人： Kazuaki Kakehi ,  Hiroaki Asai ,  Naohiro Hayashi ,  Satoshi Shimizu ,  Fumitaka Goto ,  Yasuo Koga ,  Takahiro Tomoyasu ,  Takao Taki ,  Yusuke Kato ,  Satoru Nakazato ,  Junji Takaba ,  Atsushi Azuma ,  Wakako Hirano ,  Kazunari Izumi ,  Minoru Kashimoto ,  Yoko Sakamoto ,  Takashi Hayashi ,  Masaru Nishida

发明人： Kazuaki Kakehi ,  Hiroaki Asai ,  Naohiro Hayashi ,  Satoshi Shimizu ,  Fumitaka Goto ,  Yasuo Koga ,  Takahiro Tomoyasu ,  Takao Taki ,  Yusuke Kato ,  Satoru Nakazato ,  Junji Takaba ,  Atsushi Azuma ,  Wakako Hirano ,  Kazunari Izumi ,  Minoru Kashimoto ,  Yoko Sakamoto ,  Takashi Hayashi ,  Masaru Nishida

IPC分类号： A61K31/728 ,  A61P11/06 ,  A61P17/00 ,  C08B37/08 ,  A61P37/08

CPC分类号： A61K31/728 ,  C08B37/0072

摘要： A low-molecular-weight polysulfated hyaluronic acid derivative useful for prevention and/or treatment of an allergic disease. An agent for prevention and/or treatment of an allergic disease selected from pollinosis, allergic rhinitis, allergic conjunctivitis, atopic dermatitis, and asthma, represented by the following general formula (IA) or (IB); wherein n represents a number of 0 to 15; R′s each independently represent a hydrogen atom or an SO3H group etc.

摘要翻译： 用于预防和/或治疗过敏性疾病的低分子量多硫酸化透明质酸衍生物。 由以下通式（IA）或（IB）表示的预防和/或治疗选自传粉炎，过敏性鼻炎，过敏性结膜炎，特应性皮炎和哮喘的过敏性疾病的药剂; 其中n表示0〜15的数; R各自独立地表示氢原子或SO 3 H基等