公开(公告)号：US08791567B2

公开(公告)日：2014-07-29

申请号：US13494537

申请日：2012-06-12

申请人： Nobuaki Takahashi ,  Masahiro Komuro ,  Satoshi Matsui

发明人： Nobuaki Takahashi ,  Masahiro Komuro ,  Satoshi Matsui

IPC分类号： H01L23/48

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05684 ,  H01L2224/13009 ,  H01L2224/131 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13644 ,  H01L2224/13664 ,  H01L2224/17181 ,  H01L2924/00014

摘要： In this semiconductor device, the through-hole is formed in the substrate, and is located under the conductive pattern. The insulating layer is located at the bottom surface of the through-hole. The conductive pattern is located on one surface side of the substrate. The opening pattern is formed in the insulating layer which is located between the through-hole and the conductive pattern, where the distance r3 from the circumference of the opening pattern to the central axis of the through-hole is smaller than the distance r1 in the through-hole. By providing the opening pattern, the conductive pattern is exposed at the bottom surface of the through-hole. The bump is located on the back surface side of the substrate, and is formed integrally with the through-electrode.

摘要翻译： 在该半导体装置中，通孔形成在基板上，位于导电图案的下方。 绝缘层位于通孔的底面。 导电图案位于基板的一个表面侧。 开口图案形成在位于通孔和导电图案之间的绝缘层中，其中从开口图案的周边到通孔的中心轴线的距离r3小于通孔中的距离r1 通孔。 通过设置开口图案，导电图案在通孔的底面露出。 凸块位于基板的背面侧，与贯通电极一体形成。

公开(公告)号：US20120252147A1

公开(公告)日：2012-10-04

申请号：US13514763

申请日：2010-10-01

申请人： Nobuaki Takahashi ,  Shigetoshi Kawabe ,  Natsuki Yamamoto

发明人： Nobuaki Takahashi ,  Shigetoshi Kawabe ,  Natsuki Yamamoto

IPC分类号： H01L51/56

CPC分类号： H01L51/56 ,  H01L2251/566

摘要： A method of manufacturing an organic electroluminescence element having on a belt-formed flexible base material, a first electrode, at least one organic functional layer, and a second electrode, includes continuously forming at least one organic functional layer by coating the same on a first electrode which is formed continuously on the flexible base material in the conveying direction thereof, further forming a second electrode on the organic functional layer, so as to make a plurality of organic electroluminescence element structures in the conveying direction, and then cutting the electroluminescence element structures into individual organic electroluminescence elements so as to manufacture organic electroluminescence elements.

摘要翻译： 一种制造具有带状柔性基材，第一电极，至少一个有机功能层和第二电极的有机电致发光元件的方法包括：通过在至少一个有机功能层上涂覆第一 电极，其在所述柔性基材的输送方向上连续地形成，在所述有机功能层上形成第二电极，以在输送方向上形成多个有机电致发光元件结构体，然后切割所述电致发光元件结构体 成为有机电致发光元件，制造有机电致发光元件。

公开(公告)号：US08143716B2

公开(公告)日：2012-03-27

申请号：US11088836

申请日：2005-03-25

申请人： Masaya Kawano ,  Nobuaki Takahashi

发明人： Masaya Kawano ,  Nobuaki Takahashi

IPC分类号： H01L23/04 ,  H01L23/02

CPC分类号： H01L25/0657 ,  H01L23/49816 ,  H01L24/28 ,  H01L24/83 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： The invention provides a semiconductor device including a plurality of stacked semiconductor chips, which offers a higher degree of freedom in selecting a chip size of the semiconductor chip and arranging the routing, and increase of the reliability and speed in signal transmission between the semiconductor chips. The semiconductor device includes a lower semiconductor chip, an upper semiconductor chip and a silicon spacer formed between the lower semiconductor chip and the upper semiconductor chip and including a projecting portion projecting farther outward than an outer periphery of the upper semiconductor chip, and the silicon spacer includes through electrodes and reroutings.

摘要翻译： 本发明提供一种半导体器件，其包括多个层叠的半导体芯片，其在选择半导体芯片的芯片尺寸并布置布线时提供更高的自由度，并且增加半导体芯片之间的信号传输中的可靠性和速度。 半导体器件包括下半导体芯片，上半导体芯片和形成在下半导体芯片和上半导体芯片之间的硅间隔物，并且包括比上半导体芯片的外周更向外突出的突出部分，并且硅间隔物 包括通过电极和重新排列。

公开(公告)号：US20110304029A1

公开(公告)日：2011-12-15

申请号：US13216118

申请日：2011-08-23

申请人： Yoshimichi Sogawa ,  Takao Yamazaki ,  Nobuaki Takahashi

发明人： Yoshimichi Sogawa ,  Takao Yamazaki ,  Nobuaki Takahashi

IPC分类号： H01L23/58

CPC分类号： H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/132 ,  H01L2224/133 ,  H01L2224/1358 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/0271 ,  H05K3/244 ,  H05K3/3436 ,  H05K2201/0212 ,  Y02P70/613 ,  H01L2924/01015 ,  H01L2924/00 ,  H01L2224/11

摘要： A terminal pad is formed on an active surface of an LSI chip, and a composite barrier metal layer is provided over this terminal pad. In the composite barrier metal layer, a plurality of low-elasticity particles composed of a silicone resin is dispersed throughout a metal base phase composed of NiP. The composite barrier metal layer has a thickness of, e.g., 3 μm, and the low-elasticity particles have a diameter of, e.g., 1 μm. A semiconductor device is mounted on a wiring board by bonding a solder bump to the composite barrier metal layer. The low-elasticity particles are thereby allowed to deform according to the applied stress when the semiconductor device is bonded to the wiring board via the solder bump, whereby the stress can be absorbed.

摘要翻译： 在LSI芯片的有源面上形成端子焊盘，在该端子焊盘上设置复合阻挡金属层。 在复合阻挡金属层中，将由硅树脂构成的多个低弹性粒子分散在由NiP构成的金属基体相中。 复合阻挡金属层的厚度例如为3μm，低弹性颗粒的直径例如为1μm。 通过将焊料凸块粘合到复合阻挡金属层上，将半导体器件安装在布线板上。 因此，当半导体器件通过焊料凸块接合到布线板时，低弹性粒子根据施加的应力而变形，从而能够吸收应力。

公开(公告)号：US07770428B2

公开(公告)日：2010-08-10

申请号：US12318882

申请日：2009-01-12

申请人： Nobuaki Takahashi ,  Akio Yamamoto ,  Masahiko Hamada

发明人： Nobuaki Takahashi ,  Akio Yamamoto ,  Masahiko Hamada

IPC分类号： B21D9/00

CPC分类号： B21C37/08 ,  B23K33/006 ,  B23K2101/06 ,  B23K2103/04 ,  C21D9/08 ,  C21D9/50 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06

摘要： A high-strength hot bend pipe which has a balance between an excellent strength of at least X70 grade and toughness and which has excellent tensile properties and a weld metal with excellent low temperature toughness is manufactured. A UOE steel pipe having a base metal with a composition of C: 0.03-0.12%, Si: 0.05-0.50%, Mn: 1.4-2.2%, S: at most 0.01%, Al: at most 0.06%, N: at most 0.008%, and a remainder of Fe and impurities, with the carbon equivalent (Ceq) being at most 0.36% and the weld cracking parameter (Pcm) being at most 0.22%, and having a weld metal with a weld cracking parameter (Pcm) of at most 0.28%, a B content of at most 5 ppm, and an O content of at most 280 ppm is heated to a temperature range of 900-1100° C. and subjected to bending, and then is immediately cooled to a temperature range of 300° C. or lower at a cooling rate of at least 3° C./sec, and then is tempered in a temperature range of 300-500° C.

摘要翻译： 制造具有至少X70等级的优异强度和具有优异的拉伸性能的优异强度与具有优异的低温韧性的焊接金属之间的平衡的高强度热弯管。 具有组成为C：0.03〜0.12％，Si：0.05〜0.50％，Mn：1.4〜2.2％，S：0.01％以下，Al：0.06％以下的贱金属的UOE钢管，N： 最多0.008％，余量为Fe和杂质，碳当量（Ceq）最大为0.36％，焊接裂纹参数（Pcm）为0.22％以下，具有焊缝裂纹参数（Pcm ）为0.28％以下，B含量为5ppm以下，O含量为280ppm以下，加热到900〜1100℃的温度范围，进行弯曲，然后立即冷却至 温度范围为300℃以下，冷却速度为3℃/秒以上，然后在300-500℃的温度范围内回火。

公开(公告)号：US20090174052A1

公开(公告)日：2009-07-09

申请号：US12298285

申请日：2007-05-22

申请人： Yoshimichi Sogawa ,  Takao Yamazaki ,  Nobuaki Takahashi

发明人： Yoshimichi Sogawa ,  Takao Yamazaki ,  Nobuaki Takahashi

IPC分类号： H01L23/52

CPC分类号： H01L23/49866 ,  H01L21/563 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0362 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05118 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/0516 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/115 ,  H01L2224/11502 ,  H01L2224/1152 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75702 ,  H01L2224/8121 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3512 ,  H01L2924/3651 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/3463 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

摘要： In a conventional UBM made of, for example, Cu, Ni, or NiP, there has been a problem that when an electronic component is held in high-temperature conditions for an extended period, the barrier characteristic of the UBM is lost and the bonding strength decreases due to formation of a brittle alloy layer at a bonding interface. The present invention improves the problem of decrease in long-term connection reliability of a solder connection portion after storage at high temperatures. An electronic component comprises the electronic component includes an electrode pad formed on a substrate or a semiconductor element and a barrier metal layer formed to cover the electrode pad and the barrier metal layer comprises a CuNi alloy layer on the side opposite the side in contact with the electrode pad, the CuNi alloy layer containing 15 to 60 at % of Cu and 40 to 85 at % of Ni.

摘要翻译： 在由例如Cu，Ni或NiP制成的常规UBM中，存在如下问题：当电子部件长时间保持在高温条件下时，UBM的阻挡特性丧失， 由于在接合界面处形成脆性合金层，强度降低。 本发明改善了在高温下储存之后焊料连接部分的长期连接可靠性降低的问题。 电子部件包括电子部件，其包括形成在基板或半导体元件上的电极焊盘和形成为覆盖电极焊盘的阻挡金属层，并且阻挡金属层在与所述电极焊盘接触的一侧相反的一侧包括CuNi合金层 电极焊盘，含有15〜60at％的Cu和40〜85at％的Ni的CuNi合金层。

公开(公告)号：US20090173715A1

公开(公告)日：2009-07-09

申请号：US12162617

申请日：2007-01-29

申请人： Yasuhiro Oshima ,  Nobuaki Takahashi

发明人： Yasuhiro Oshima ,  Nobuaki Takahashi

IPC分类号： H01L21/306 ,  C23C14/28

CPC分类号： H01J37/32192 ,  H01J65/044

摘要： A light source device is formed by a plasma formation chamber including a plasma formation region where plasma is formed by electrodeless discharge to generate light and an optical window defining the lower end of the plasma region in the plasma formation chamber and transmitting the light. A microwave transmitting window is formed in the plasma chamber for introducing microwaves for generating the plasma. Furthermore, outside of the microwave transmitting window, a microwave antenna is connected to the microwave window for introducing the microwaves.

摘要翻译： 光源装置由等离子体形成室形成，该等离子体形成室包括等离子体形成区域，其中通过无电极放电形成等离子体以产生光，以及限定等离子体形成室中的等离子体区域的下端并传输光的光学窗口。 在等离子体室中形成微波传输窗，用于引入用于产生等离子体的微波。 此外，在微波发射窗外，将微波天线连接到微波窗口以引入微波。

公开(公告)号：US20090149784A1

公开(公告)日：2009-06-11

申请号：US12349198

申请日：2009-01-06

申请人： Yoshitoshi Morita ,  Yuji Kan ,  Nobuaki Takahashi

发明人： Yoshitoshi Morita ,  Yuji Kan ,  Nobuaki Takahashi

IPC分类号： A61H7/00

CPC分类号： A61H7/00 ,  A61H7/007 ,  A61H15/0078 ,  A61H2007/009 ,  A61H2015/0028 ,  A61H2201/0149 ,  A61H2201/1427 ,  A61H2201/1623 ,  A61H2201/1654 ,  A61H2201/1669 ,  A61H2201/1678 ,  A61H2205/04 ,  A61H2205/062 ,  A61H2205/081

摘要： A pivotal lever has a first therapeutic member and a second therapeutic member positioned below the first member, for the members to grip and knead the shoulder of the person to be massaged as by the fingers of the acupressurist. A massage unit 20 comprises a pair of left and right pivotal levers 100 pivotally movably arranged on a chassis 21, and a first therapeutic member 200 and a second therapeutic member 300 arranged on each of the pivotal levers 100 and movable toward and away from each other. The first and second therapeutic members 200, 300 have motion conversion means 400 coupled thereto for converting the pivotal movement of the pivotal lever 100 into the movement of the first and second therapeutic members 200, 300 toward and away from each other. The first and second therapeutic members 200, 300 grip the shoulder of the person when moved toward each other and release the shoulder from the gripping action when moved away from each other to thereby cause the members to simulate the gripping and kneading movement of the acupressurist.

摘要翻译： 枢转杆具有位于第一构件下方的第一施疗构件和第二施疗构件，用于使构件按指压按钮的手指夹持和捏合要按摩的人的肩部。 按摩单元20包括可枢转地可移动地布置在底盘21上的一对左右枢转杆100，以及布置在每个枢转杆100上并可彼此相对移动的第一施疗构件200和第二施疗构件300 。 第一和第二治疗构件200,300具有联接到其上的运动转换装置400，用于将枢转杆100的枢转运动转换成第一和第二治疗构件200,300彼此相对和远离的运动。 第一和第二治疗部件200,300在彼此移动时握住人的肩部，并且当彼此远离时从抓握动作中释放肩部，从而使部件模拟针压者的夹持和捏合动作。

公开(公告)号：US20090127816A1

公开(公告)日：2009-05-21

申请号：US11991622

申请日：2006-01-04

申请人： Yozo Oka ,  Nobuaki Takahashi ,  Katsuzo Kato

发明人： Yozo Oka ,  Nobuaki Takahashi ,  Katsuzo Kato

IPC分类号： B62D25/24 ,  B62D25/22

CPC分类号： B62D25/24 ,  B62D25/10 ,  B62D49/0671

摘要： The present invention provides a tractor which can easily perform maintenance of a pedal interlocking mechanism. In a tractor which includes a driver portion, a stepped portion mounted on the driver portion in an extending manner, and a pedal interlocking mechanism arranged below the stepped portion, a maintenance-use opening portion is formed in the stepped portion, and the maintenance-use opening portion is closed by an open/close lid body in an openable manner. Due to such a constitution, In maintaining the pedal link mechanism, the lid is opened to expose the opening so that the pedal link mechanism can be easily maintained through the maintenance-use opening from above the stepped portion.

摘要翻译： 本发明提供一种能够容易地进行踏板联锁机构的维护的拖拉机。 在包括驱动器部分的拖拉机中，以延伸方式安装在驱动器部分上的阶梯部分和布置在阶梯部分下方的踏板互锁机构，在阶梯部分中形成维修用开口部分， 使用开口部分以可打开的方式被打开/关闭的盖体封闭。 由于这样的结构，在保持踏板连杆机构的情况下，打开盖子露出开口，从而能够通过台阶部的上方的维护用开口容易地维持踏板连杆机构。

公开(公告)号：US20090127815A1

公开(公告)日：2009-05-21

申请号：US11991620

申请日：2006-01-04

申请人： Shinsuke Tani ,  Yozo Oka ,  Nobuaki Takahashi

发明人： Shinsuke Tani ,  Yozo Oka ,  Nobuaki Takahashi

IPC分类号： B62D25/22

CPC分类号： B62D49/02 ,  B62D49/0671

摘要： The present invention ensures excellent assembly and maintenance of a machine body. A tractor of the present invention includes a prime mover part, a transmission portion interlockingly connected to a rear portion of the prime mover part, a driver portion arranged above the transmission portion, a lifting mechanism mounted on the transmission portion, wherein a working oil tank for storing a working oil for operating at least the lifting mechanism is arranged below a stepped portion formed on the driver portion in an extending manner. Due to such a constitution, a space which constitutes a dead space can be effectively utilized thus ensuring the excellent assembly and maintenance of the machine body.

摘要翻译： 本发明确保了机体的优良的组装和维护。 本发明的拖拉机包括原动机部分，与原动机部分的后部互锁连接的传动部分，布置在传动部分上方的驱动部分，安装在传动部分上的提升机构，其中工作油箱 用于存储用于操作至少提升机构的工作油被布置在形成在驱动器部分上的阶梯部分的延伸方式的下方。 由于这样的结构，可以有效地利用构成死空间的空间，从而确保机体的优良的组装和维护。