公开(公告)号：US5079070A

公开(公告)日：1992-01-07

申请号：US595902

申请日：1990-10-11

Applicant: Pedro A. Chalco ,  Carlos J. Sambucetti

Inventor： Pedro A. Chalco ,  Carlos J. Sambucetti

IPC: B23K20/10 ,  B23K26/32 ,  G02F1/13 ,  H05K3/20 ,  H05K3/22 ,  H05K3/24 ,  H05K3/32 ,  H05K3/46

CPC classification number: H05K3/225 ,  B23K20/10 ,  G02F1/1309 ,  H05K2201/0317 ,  H05K2201/1028 ,  H05K2203/0278 ,  H05K2203/0285 ,  H05K2203/107 ,  H05K2203/173 ,  H05K3/20 ,  H05K3/244 ,  H05K3/328 ,  Y10S428/901 ,  Y10S428/913 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31721

Abstract: Open defects in thin film conductor lines on a substrate are repaired by diffusion bonding a selected conductive repair line from a support sheet positioned over the open defect. The diffusion bonding is performed by the application of ultrasonic energy and laser energy.

Abstract translation: 通过将所选择的导电修复线从位于开放缺陷上的支撑片扩散接合来修复衬底上的薄膜导体线中的开放缺陷。 通过施加超声能量和激光能量来进行扩散接合。

公开(公告)号：US4664309A

公开(公告)日：1987-05-12

申请号：US509684

申请日：1983-06-30

Applicant: Leslie J. Allen ,  Gabe Cherian ,  Stephen H. Diaz

Inventor： Leslie J. Allen ,  Gabe Cherian ,  Stephen H. Diaz

IPC: H01R9/16 ,  B23K3/06 ,  B23K35/02 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K13/04 ,  H01L21/58 ,  B23K1/12

CPC classification number: B23K35/0222 ,  B23K3/06 ,  H05K1/0271 ,  H05K13/0465 ,  H05K3/325 ,  H05K3/3436 ,  H01L2924/00013 ,  H05K2201/0215 ,  H05K2201/0314 ,  H05K2201/0373 ,  H05K2201/1028 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10727 ,  H05K2201/10946 ,  H05K2203/0415 ,  H05K2203/0769 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/4015 ,  Y02P70/613

Abstract: A chip mounting device which is hereinafter also referred to as an "interconnection preform placement device", includes a retaining member having a predefined pattern of holes in which are positioned preforms of joint-forming material such as solder. Each preform is of a predefined configuration and has a height or length greater than is cross-sectional dimension. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. A method of forming resilient interconnections comprises placing the interconnection preform placement device between parallel patterns of electrically conductive elements, such as the conductive pads on an electronic component and a circuit board, and effecting the bonding of the conductive elements with the preforms.

Abstract translation: 在下文中也称为“互连预成型件放置装置”的芯片安装装置包括具有预定图案的孔的保持构件，其中定位有诸如焊料的接合形成材料的预成型件。 每个预成型件具有预定的构造并且具有大于横截面尺寸的高度或长度。 预成型件在互连或焊接工艺之后保持其一般构造，以形成能够承受应力，应变和疲劳的弹性接头。 形成弹性互连的方法包括将互连预制件放置装置放置在导电元件的平行图案之间，诸如电子部件和电路板上的导电焊盘，并且实现导电元件与预成型件的结合。

公开(公告)号：US4355199A

公开(公告)日：1982-10-19

申请号：US109664

申请日：1980-01-04

Applicant: Penelope J. V. Luc

Inventor： Penelope J. V. Luc

IPC: H05K3/36 ,  H05K3/40 ,  H05K1/00

CPC classification number: H05K3/4046 ,  H01L2224/18 ,  H05K2201/1028 ,  H05K2201/10946 ,  H05K3/36 ,  H05K3/403 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A conductive connection between a metallized outer surface of a film of plastics material, such as a polyimide film and a metal or metallized surface of a substrate to which the film is attached. The connection comprises a flexible conductor secured to the substrate and a second film of plastics material which is bonded to the metallized surface of the first film material and to the flexible conductor to effect a conductive connection between the metallized surface of the first film and the substrate. The second film may be so arranged that it holds the flexible conductor in close contact with the metallized layer on the first film to effect an electrical connection but is preferably metallized whereby an additional electrical connection is effected by way of its metallized surface and the flexible conductor.

Abstract translation: 塑料材料膜的金属化外表面之间的导电连接，例如聚酰亚胺膜和附着有薄膜的基底的金属或金属化表面。 连接包括固定到基板的柔性导体和粘合到第一薄膜材料的金属化表面和柔性导体上的塑料材料的第二薄膜，以实现第一薄膜的金属化表面与基底之间的导电连接 。 第二膜可以被布置成使得其保持柔性导体与第一膜上的金属化层紧密接触以实现电连接，但是优选地被金属化，由此通过其金属化表面和柔性导体来实现额外的电连接 。

公开(公告)号：US3958075A

公开(公告)日：1976-05-18

申请号：US522564

申请日：1974-11-11

Applicant: Lance R. Kaufman

Inventor： Lance R. Kaufman

IPC: H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/538 ,  H01L25/16 ,  H05K1/02 ,  H05K1/09 ,  H05K3/20 ,  H05K3/34 ,  H01B7/34

CPC classification number: H05K3/3405 ,  H01L23/3672 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49861 ,  H01L23/5389 ,  H01L25/16 ,  H05K1/0263 ,  H01L2224/48247 ,  H01L2924/13034 ,  H05K1/092 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K3/202 ,  H05K3/3421 ,  Y10T29/49149 ,  Y10T29/5178

Abstract: The lead frame for a thick film circuit has inwardly extending strip portions of substantial area which are positioned and dimensioned to substantially match and overlie selected thick film conductors to increase the current carrying capacity thereof and to act as mounting elements and heat diffusers for diodes, SCRs (silicon controlled rectifiers) and other heat-generating components.

Abstract translation: 用于厚膜电路的引线框架具有大致面积的向内延伸的带状部分，其位置和尺寸被设计成基本上匹配并覆盖所选择的厚膜导体以增加其载流能力，并且用作用于二极管，SCR的安装元件和热扩散器 （可控硅整流器）和其他发热元件。

公开(公告)号：US3775579A

公开(公告)日：1973-11-27

申请号：US3775579D

申请日：1972-05-30

Applicant: IBM

Inventor： BURGHART A ,  HOUSER D ,  KIEFFER J ,  WALLACE G

IPC: B23K11/00 ,  H05K3/22 ,  H05K3/32 ,  B23K1/02

CPC classification number: B23K11/0046 ,  H05K3/225 ,  H05K3/328 ,  H05K2201/1028 ,  H05K2203/0278 ,  H05K2203/1115 ,  H05K2203/173 ,  Y10T29/49718

Abstract: A method and apparatus for repairing an open or void in a printed circuit line on a printed circuit board wherein the board is positioned with the open underneath a bonding head and metallic ribbon material is positioned over the open, thermal compression bonded to the circuit line on one side of the open, cut to length, and then thermal compression bonded to the circuit line on the other side of the open.

Abstract translation: 一种用于修复印刷电路板上的印刷电路线中的开放或空隙的方法和装置，其中板被定位成在接合头下方开放，并且金属带材料被定位在接合到电路线上的开放的热压缩上 一侧打开，切割长度，然后热压接在电路线的另一侧开放。

公开(公告)号：US3554793A

公开(公告)日：1971-01-12

申请号：US3554793D

申请日：1968-02-20

Applicant: SIEMENS AG

Inventor： KRIEGER FRIEDRICH

IPC: B23K1/20 ,  H01R12/00 ,  H05K3/34 ,  B41M3/08 ,  H05K3/02

CPC classification number: H05K3/3468 ,  B23K1/20 ,  B23K2201/42 ,  H05K2201/1028 ,  H05K2203/044 ,  H05K2203/0723 ,  H05K2203/1105

Abstract: SOLDERING MATERIAL IS SPRAYED OVER AN ELECTRICAL CIRCUIT PATTERN POSITIONED ON AN INSULATING CARRIER. THE SOLDER IS IN THE LIQUID STATE, BUT IS BELOW THE TEMPERATURE AT WHICH THE SOLDER FORMS AN ALLOY WITH THE METAL CIRCUIT PATTERN. THE LAYER OF SOLDER IS THEN HEATED TO ITS ALLOYING TEMPERATURE CAUSING THE SOLDER TO CNTRACT, BY SURFACE TENSION, ONTO THE METAL CIRCUIT PATTERN FORMING AN ALLOY THEREWITH AND LEAVING THE INSULATING CARRIER SUBSTANTIALLY FREE OF SOLDER, WHICH COULD CAUSE A SHORT CIRCUIT.

公开(公告)号：US3292051A

公开(公告)日：1966-12-13

申请号：US33382563

申请日：1963-12-27

Applicant: GEN ELECTRIC

Inventor： OLNEY JR FRED D ,  PRICE DONALD R

IPC: H05K1/18 ,  H05K7/06

CPC classification number: H05K1/18 ,  H05K7/06 ,  H05K2201/1028 ,  H05K2201/10454 ,  H05K2201/1053 ,  H05K2201/10651 ,  H05K2201/10962

公开(公告)号：US3234629A

公开(公告)日：1966-02-15

申请号：US20241762

申请日：1962-06-14

Applicant: DEFIANCE PRINTED CIRCUIT CORP

Inventor： WHEELER JAMES C

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/10 ,  H05K3/34 ,  H05K3/38 ,  H05K7/06

CPC classification number: H05K3/103 ,  H05K1/0266 ,  H05K3/0005 ,  H05K3/3447 ,  H05K3/386 ,  H05K7/06 ,  H05K2201/0373 ,  H05K2201/09936 ,  H05K2201/1028 ,  Y10T29/49142 ,  Y10T29/49155

公开(公告)号：US1941411A

公开(公告)日：1933-12-26

申请号：US48606430

申请日：1930-10-03

Applicant: HARTFORD EMPIRE CO

Inventor： VERGIL MULHOLLAND

IPC: C03B5/235 ,  H05K1/00 ,  H05K3/10

CPC classification number: C03B5/235 ,  H05K1/0289 ,  H05K3/107 ,  H05K2201/098 ,  H05K2201/1028 ,  Y02P40/535

公开(公告)号：US11903131B2

公开(公告)日：2024-02-13

申请号：US17643100

申请日：2021-12-07

Applicant: WÜRTH ELEKTRONIK EISOS GMBH & CO. KG

Inventor： Alexander Treml ,  Julia Sanwald ,  Stefan Klingler

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K2201/1028 ,  H05K2201/10037 ,  H05K2201/10462 ,  H05K2201/10643

Abstract: The invention relates to a holder for a button cell, wherein the holder is intended to be fastened on a printed circuit board, wherein the holder has at least two first latching arms which protrude from the printed circuit board when the holder is in the mounted state, wherein the button cell is received between the first latching arms when the button cell is in the mounted state, wherein the first latching arms, at one end, are each connected to a main body which has a base area which is connected to the printed circuit board when the holder is in the mounted state, wherein the first latching arms each have at least one first latching lug in order to hold the button cell on the printed circuit board, and wherein the first latching lugs are arranged at a first distance from the base area of the main body.